TW429180B - Nickel powder, process for preparing the same, conductor paste comprising the same, multilayer ceramic electronic component and multilayer ceramic substrate - Google Patents

Nickel powder, process for preparing the same, conductor paste comprising the same, multilayer ceramic electronic component and multilayer ceramic substrate

Info

Publication number
TW429180B
TW429180B TW086113816A TW86113816A TW429180B TW 429180 B TW429180 B TW 429180B TW 086113816 A TW086113816 A TW 086113816A TW 86113816 A TW86113816 A TW 86113816A TW 429180 B TW429180 B TW 429180B
Authority
TW
Taiwan
Prior art keywords
nickel powder
same
nickel
multilayer ceramic
powder
Prior art date
Application number
TW086113816A
Other languages
English (en)
Inventor
Eiichi Asada
Yuji Akimoto
Kazuro Nagashima
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Application granted granted Critical
Publication of TW429180B publication Critical patent/TW429180B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • C23D5/02—Coating with enamels or vitreous layers by wet methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Insulated Conductors (AREA)
TW086113816A 1997-05-26 1997-09-23 Nickel powder, process for preparing the same, conductor paste comprising the same, multilayer ceramic electronic component and multilayer ceramic substrate TW429180B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09149949A JP3137035B2 (ja) 1997-05-26 1997-05-26 ニッケル粉末及びその製造方法

Publications (1)

Publication Number Publication Date
TW429180B true TW429180B (en) 2001-04-11

Family

ID=15486113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113816A TW429180B (en) 1997-05-26 1997-09-23 Nickel powder, process for preparing the same, conductor paste comprising the same, multilayer ceramic electronic component and multilayer ceramic substrate

Country Status (8)

Country Link
US (1) US5871840A (zh)
JP (1) JP3137035B2 (zh)
KR (1) KR100259562B1 (zh)
CN (1) CN1093020C (zh)
CA (1) CA2216457C (zh)
MY (1) MY121682A (zh)
SG (1) SG66396A1 (zh)
TW (1) TW429180B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704297B2 (en) 2006-04-27 2010-04-27 Shoei Chemical Inc. Nickel powder manufacturing method

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206496B2 (ja) * 1997-06-02 2001-09-10 昭栄化学工業株式会社 金属粉末及びその製造方法
US6165247A (en) * 1997-02-24 2000-12-26 Superior Micropowders, Llc Methods for producing platinum powders
JP3475749B2 (ja) * 1997-10-17 2003-12-08 昭栄化学工業株式会社 ニッケル粉末及びその製造方法
CA2273563C (en) 1998-05-29 2006-05-16 Mitsui Mining And Smelting Co., Ltd. Composite nickel fine powder and method for preparing the same
US6391084B1 (en) 1998-07-27 2002-05-21 Toho Titanium Co., Ltd. Metal nickel powder
JP3928309B2 (ja) * 1998-10-06 2007-06-13 昭栄化学工業株式会社 ニッケル複合粒子、導体ペースト及びセラミック積層電子部品
AU2000225122A1 (en) * 2000-01-21 2001-07-31 Midwest Research Institute Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
JP4986356B2 (ja) * 2000-02-18 2012-07-25 カナディアン・エレクトロニクス・パウダーズ・コーポレーション ニッケル粉末を製造する方法
JP3473548B2 (ja) 2000-04-27 2003-12-08 株式会社村田製作所 金属粉末の製造方法，金属粉末，これを用いた導電性ペーストならびにこれを用いた積層セラミック電子部品
DE10110341A1 (de) * 2001-03-03 2002-10-31 Bosch Gmbh Robert Metallpulver-Verbundwerkstoff und Ausgangsmaterial und Verfahren für die Herstellung eines solchen
JP3772967B2 (ja) 2001-05-30 2006-05-10 Ｔｄｋ株式会社 磁性金属粉末の製造方法
TW200615323A (en) * 2004-06-21 2006-05-16 Sekisui Chemical Co Ltd Binder resin composition, paste, and green sheet
US20060169389A1 (en) * 2005-01-31 2006-08-03 Barber Daniel E Electrode paste for thin nickel electrodes in multilayer ceramic capacitors and finished capacitor containing same
JP4807581B2 (ja) * 2007-03-12 2011-11-02 昭栄化学工業株式会社 ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
CN102484355B (zh) 2009-08-27 2014-12-10 株式会社村田制作所 Esd保护器件及其制造方法
KR20140024584A (ko) * 2012-08-20 2014-03-03 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
JP7245418B2 (ja) * 2019-07-09 2023-03-24 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3918933A (en) * 1973-03-28 1975-11-11 Gen Electric Nickel-lanthanum alloy produced by a reduction-diffusion process
US3883346A (en) * 1973-03-28 1975-05-13 Gen Electric Nickel-lanthanum alloy produced by a reduction-diffusion process
JPS58171502A (ja) * 1982-04-02 1983-10-08 Toyota Motor Corp セラミック―金属複合微粉末体の製造方法
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
JPS6331522A (ja) * 1986-07-25 1988-02-10 Kao Corp 吸湿剤
US5126915A (en) * 1989-07-28 1992-06-30 E. I. Du Pont De Nemours And Company Metal oxide-coated electrically conductive powders and compositions thereof
US5372845A (en) * 1992-03-06 1994-12-13 Sulzer Plasma Technik, Inc. Method for preparing binder-free clad powders
TW261554B (zh) * 1992-10-05 1995-11-01 Du Pont
JPH06290985A (ja) * 1993-03-30 1994-10-18 Taiyo Yuden Co Ltd 内部電極ペースト
JPH09129028A (ja) * 1995-11-01 1997-05-16 Daiken Kagaku Kogyo Kk 無機皮膜を有する金属粉の製造法及び金属粉

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704297B2 (en) 2006-04-27 2010-04-27 Shoei Chemical Inc. Nickel powder manufacturing method

Also Published As

Publication number Publication date
CN1093020C (zh) 2002-10-23
JP3137035B2 (ja) 2001-02-19
JPH10324906A (ja) 1998-12-08
CN1200312A (zh) 1998-12-02
CA2216457A1 (en) 1998-11-26
KR19980086381A (ko) 1998-12-05
MY121682A (en) 2006-02-28
SG66396A1 (en) 1999-07-20
KR100259562B1 (ko) 2000-06-15
CA2216457C (en) 2000-09-12
US5871840A (en) 1999-02-16

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