JPS6453597A - Manufacture of ceramic multilayered board - Google Patents
Manufacture of ceramic multilayered boardInfo
- Publication number
- JPS6453597A JPS6453597A JP21049187A JP21049187A JPS6453597A JP S6453597 A JPS6453597 A JP S6453597A JP 21049187 A JP21049187 A JP 21049187A JP 21049187 A JP21049187 A JP 21049187A JP S6453597 A JPS6453597 A JP S6453597A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- unbaked
- baked
- board
- wiring layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE:To eliminate a short-circuit between wiring layers by a method wherein unbaked wiring layers made of copper oxide paste are formed on a baked ceramic board and, after an insulating layer made of low temperature sintered ceramic material is formed on the baked ceramic substrate, an unbaked green sheet is bonded to it. CONSTITUTION:Wiring layers 2 made of copper oxide paste is screen-printed on a baked alumina board 1 beforehand and dried. Then wiring layers 2 made of copper oxide paste are formed on an unbaked green sheet 4 in which holes are formed at required positions and dried. Insulating paste is applied to the baked alumina board 1 to form a thin unbaked insulating layer 3 and, before the insulating layer 3 is dried, the unbaked green sheet 4 is put on it and the baked ceramic board 1 and the unbaked green sheet 4 are bonded to each other. Then the multilayer board after bonding is heated in the air at 300-700 deg.C to eliminate organic components in the paste and the green sheet completely for debindering. Then, after the copper oxide is reduced into metal copper in a nitrogen gas atmosphere containing 5-40% of hydrogen gas at 300-500 deg.C, the metal copper and the green sheet are baked in a nitrogen gas atmosphere at 850-1000 deg.C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21049187A JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21049187A JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6453597A true JPS6453597A (en) | 1989-03-01 |
| JPH0561799B2 JPH0561799B2 (en) | 1993-09-07 |
Family
ID=16590229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21049187A Granted JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453597A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0529765A (en) * | 1990-08-23 | 1993-02-05 | Ngk Insulators Ltd | Ceramic multilayer wiring board and manufacture thereof |
| EP1189495A1 (en) * | 2000-03-15 | 2002-03-20 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing multilayer ceramic substrate, and conductor paste |
-
1987
- 1987-08-25 JP JP21049187A patent/JPS6453597A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0529765A (en) * | 1990-08-23 | 1993-02-05 | Ngk Insulators Ltd | Ceramic multilayer wiring board and manufacture thereof |
| EP1189495A1 (en) * | 2000-03-15 | 2002-03-20 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing multilayer ceramic substrate, and conductor paste |
| EP1189495A4 (en) * | 2000-03-15 | 2007-07-04 | Matsushita Electric Ind Co Ltd | Method of manufacturing multilayer ceramic substrate, and conductor paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0561799B2 (en) | 1993-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6630881B1 (en) | Method for producing multi-layered chip inductor | |
| JP4428852B2 (en) | Multilayer electronic component and manufacturing method thereof | |
| JP3351043B2 (en) | Method for manufacturing multilayer ceramic substrate | |
| JPS6453597A (en) | Manufacture of ceramic multilayered board | |
| JPS6453595A (en) | Manufacture of ceramic multlayered board | |
| JPS6453596A (en) | Manufacture of ceramic multilayered board | |
| JPH0266916A (en) | Manufacture of laminated ceramic capacitor | |
| US6103354A (en) | Ceramic circuit substrate and method of fabricating the same | |
| JPH05167253A (en) | Manufacture of multilayer ceramic board | |
| JPH05267854A (en) | Ceramic multilayer circuit board and manufacture thereof | |
| JPH02301113A (en) | Laminated ceramic electronic component and manufacture thereof | |
| JP2605306B2 (en) | Multilayer circuit board | |
| JPH02229403A (en) | Manufacture of resistance array | |
| JP2002076628A (en) | Manufacturing method of glass ceramic substrate | |
| JP2551046B2 (en) | Multilayer circuit board | |
| JPH0320914B2 (en) | ||
| JPH0588557B2 (en) | ||
| JPH0521958A (en) | Laminate for multilayered printed circuit board and manufacture thereof | |
| JPH04206613A (en) | Manufacture of multilayer ceramic capacitor | |
| JPS6453519A (en) | Laminated ceramic capacitor and its manufacture | |
| JPS6029240B2 (en) | Ceramic circuit board manufacturing method | |
| JP3316944B2 (en) | Method of laminating multilayer ceramic substrate | |
| JPS644004A (en) | Oxide superconductor coil and manufacture thereof | |
| JPH01321692A (en) | Manufacture of ceramic multilayer substrate | |
| JPH05308193A (en) | Manufacture of multilayer ceramic board |