JPS6453596A - Manufacture of ceramic multilayered board - Google Patents

Manufacture of ceramic multilayered board

Info

Publication number
JPS6453596A
JPS6453596A JP21047887A JP21047887A JPS6453596A JP S6453596 A JPS6453596 A JP S6453596A JP 21047887 A JP21047887 A JP 21047887A JP 21047887 A JP21047887 A JP 21047887A JP S6453596 A JPS6453596 A JP S6453596A
Authority
JP
Japan
Prior art keywords
green sheet
wiring layers
copper oxide
unbaked
baked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21047887A
Other languages
Japanese (ja)
Other versions
JPH0561798B2 (en
Inventor
Minehiro Itagaki
Osamu Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21047887A priority Critical patent/JPS6453596A/en
Publication of JPS6453596A publication Critical patent/JPS6453596A/en
Publication of JPH0561798B2 publication Critical patent/JPH0561798B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To eliminate a short-circuit between wiring layers by a method where in a baked ceramic board on which unbaked wiring layers made of copper oxide paste are formed and an unbaked green sheet on which wiring layers made of copper oxide paste are formed are bonded to each other. CONSTITUTION:Wiring layers 2 made of copper oxide paste are screen-printed on a baked alumina board 1 beforehand and dried. Then wiring layers 2 made of copper oxide paste are formed on an unbaked green sheet 3 in which holes 4 are formed at required positions and dried. The baked alumina board 1 and the unbaked green sheet are laminated and bonded to each other. Then, the multilayered board after bonding is heated in the air at 300-700 deg.C to eliminate organic components in the paste and the green sheet completely for debindering. Then, after the copper oxide is reduced into metal copper in a nitrogen gas atmosphere containing 5-40% of hydrogen gas at 300-500 deg., the metal copper and the green sheet are baked in a nitrogen gas atmosphere.
JP21047887A 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board Granted JPS6453596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21047887A JPS6453596A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21047887A JPS6453596A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Publications (2)

Publication Number Publication Date
JPS6453596A true JPS6453596A (en) 1989-03-01
JPH0561798B2 JPH0561798B2 (en) 1993-09-07

Family

ID=16590012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21047887A Granted JPS6453596A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multilayered board

Country Status (1)

Country Link
JP (1) JPS6453596A (en)

Also Published As

Publication number Publication date
JPH0561798B2 (en) 1993-09-07

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