JPS6453595A - Manufacture of ceramic multlayered board - Google Patents

Manufacture of ceramic multlayered board

Info

Publication number
JPS6453595A
JPS6453595A JP62210476A JP21047687A JPS6453595A JP S6453595 A JPS6453595 A JP S6453595A JP 62210476 A JP62210476 A JP 62210476A JP 21047687 A JP21047687 A JP 21047687A JP S6453595 A JPS6453595 A JP S6453595A
Authority
JP
Japan
Prior art keywords
green sheet
wiring layers
copper oxide
board
unbaked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62210476A
Other languages
Japanese (ja)
Other versions
JPH0561797B2 (en
Inventor
Minehiro Itagaki
Osamu Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62210476A priority Critical patent/JPS6453595A/en
Publication of JPS6453595A publication Critical patent/JPS6453595A/en
Publication of JPH0561797B2 publication Critical patent/JPH0561797B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To eliminate a short-circuit between wiring layers by a method wherein a baked ceramic board on which unbaked wiring layers made of copper oxide paste are formed and an unbaked green sheet on which wiring layers made of copper oxide paste are formed are bonded to each other by thermocompression bonding at a specific temperature and under a specific pressure. CONSTITUTION:Wiring layers 2 made of copper oxide paste are screen-printed on a baked alumina board 1 beforehand and dried. Then wiring layers 2 made of copper oxide paste are formed on an unbaked green sheet 3 in which holes 4 are formed at required positions and dried. The baked alumina board 1 and the unbaked green sheet 3 are laminated and bonded to each other by thermocompression bonding at a temperature of 50-80 deg.C and under a pressure of 100-300kg/cm<2>. The multilayered board after bonding is heated in the air to eliminate organic components in the paste and the green sheet completely for debindering. Then, after the copper oxide is reduced into metal copper in a nitrogen gas atmosphere containing hydrogen gas, the metal copper and the green sheet are baked in a nitrogen gas atmosphere.
JP62210476A 1987-08-25 1987-08-25 Manufacture of ceramic multlayered board Granted JPS6453595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210476A JPS6453595A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multlayered board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210476A JPS6453595A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multlayered board

Publications (2)

Publication Number Publication Date
JPS6453595A true JPS6453595A (en) 1989-03-01
JPH0561797B2 JPH0561797B2 (en) 1993-09-07

Family

ID=16589976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210476A Granted JPS6453595A (en) 1987-08-25 1987-08-25 Manufacture of ceramic multlayered board

Country Status (1)

Country Link
JP (1) JPS6453595A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475278B2 (en) 2000-02-02 2002-11-05 Sharp Kabushiki Kaisha Molecular beam source and molecular beam epitaxy apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475278B2 (en) 2000-02-02 2002-11-05 Sharp Kabushiki Kaisha Molecular beam source and molecular beam epitaxy apparatus

Also Published As

Publication number Publication date
JPH0561797B2 (en) 1993-09-07

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