GB1438559A - Method for manufacturing a composite sintered structure - Google Patents

Method for manufacturing a composite sintered structure

Info

Publication number
GB1438559A
GB1438559A GB3553073A GB3553073A GB1438559A GB 1438559 A GB1438559 A GB 1438559A GB 3553073 A GB3553073 A GB 3553073A GB 3553073 A GB3553073 A GB 3553073A GB 1438559 A GB1438559 A GB 1438559A
Authority
GB
United Kingdom
Prior art keywords
sheet
paste
composite
ceramic
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3553073A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to GB3553073A priority Critical patent/GB1438559A/en
Publication of GB1438559A publication Critical patent/GB1438559A/en
Priority to HK30579A priority patent/HK30579A/en
Priority to MY8000130A priority patent/MY8000130A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4578Coating or impregnating of green ceramics or unset concrete
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383Multilayer substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1438559 Sintered composite insulating & conducting layers HITACHI Ltd 25 July 1973 35530/73 Heading C7D A composite sintered structure which may be used in an integrated semi-conductor circuit device is made by depositing at least one layer of a green ceramic insulating paste 4 and at least one layer of a green ceramic conductor paste 2 on a green ceramic sheet I consisting of the same ceramic as the insulating paste and sintering the composite e.g. at 1450-1650‹C in a reducing or inert atmosphere. The ceramic used in the pastes and sheet is preferably 88-95% Al 2 O 3 the balance mineralizers such as S i O 2 and MgO. The conducting paste contains 50-70% W, Ti or Mo and the preferred binder for the pastes and sheet is polyvinyl butyral.
GB3553073A 1973-07-25 1973-07-25 Method for manufacturing a composite sintered structure Expired GB1438559A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB3553073A GB1438559A (en) 1973-07-25 1973-07-25 Method for manufacturing a composite sintered structure
HK30579A HK30579A (en) 1973-07-25 1979-05-10 A method for manufacturing a composite sintered structure
MY8000130A MY8000130A (en) 1973-07-25 1980-12-31 A method for manufacturing a composite sintered structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3553073A GB1438559A (en) 1973-07-25 1973-07-25 Method for manufacturing a composite sintered structure

Publications (1)

Publication Number Publication Date
GB1438559A true GB1438559A (en) 1976-06-09

Family

ID=10378767

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3553073A Expired GB1438559A (en) 1973-07-25 1973-07-25 Method for manufacturing a composite sintered structure

Country Status (3)

Country Link
GB (1) GB1438559A (en)
HK (1) HK30579A (en)
MY (1) MY8000130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078370A1 (en) * 1981-10-19 1983-05-11 International Business Machines Corporation Method of detecting residual glass during fabrication of ceramic substrates for semiconductors
EP0122522A1 (en) * 1983-03-29 1984-10-24 Kabushiki Kaisha Toshiba Method of manufacturing sintered ceramic body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078370A1 (en) * 1981-10-19 1983-05-11 International Business Machines Corporation Method of detecting residual glass during fabrication of ceramic substrates for semiconductors
EP0122522A1 (en) * 1983-03-29 1984-10-24 Kabushiki Kaisha Toshiba Method of manufacturing sintered ceramic body
US4626451A (en) * 1983-03-29 1986-12-02 Tokyo Shibaura Denki Kabushiki Kaisha Method of manufacturing sintered ceramic body

Also Published As

Publication number Publication date
HK30579A (en) 1979-05-18
MY8000130A (en) 1980-12-31

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years

Effective date: 19930724