GB1438559A - Method for manufacturing a composite sintered structure - Google Patents
Method for manufacturing a composite sintered structureInfo
- Publication number
- GB1438559A GB1438559A GB3553073A GB3553073A GB1438559A GB 1438559 A GB1438559 A GB 1438559A GB 3553073 A GB3553073 A GB 3553073A GB 3553073 A GB3553073 A GB 3553073A GB 1438559 A GB1438559 A GB 1438559A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheet
- paste
- composite
- ceramic
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/4578—Coating or impregnating of green ceramics or unset concrete
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
1438559 Sintered composite insulating & conducting layers HITACHI Ltd 25 July 1973 35530/73 Heading C7D A composite sintered structure which may be used in an integrated semi-conductor circuit device is made by depositing at least one layer of a green ceramic insulating paste 4 and at least one layer of a green ceramic conductor paste 2 on a green ceramic sheet I consisting of the same ceramic as the insulating paste and sintering the composite e.g. at 1450-1650‹C in a reducing or inert atmosphere. The ceramic used in the pastes and sheet is preferably 88-95% Al 2 O 3 the balance mineralizers such as S i O 2 and MgO. The conducting paste contains 50-70% W, Ti or Mo and the preferred binder for the pastes and sheet is polyvinyl butyral.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3553073A GB1438559A (en) | 1973-07-25 | 1973-07-25 | Method for manufacturing a composite sintered structure |
HK30579A HK30579A (en) | 1973-07-25 | 1979-05-10 | A method for manufacturing a composite sintered structure |
MY8000130A MY8000130A (en) | 1973-07-25 | 1980-12-31 | A method for manufacturing a composite sintered structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3553073A GB1438559A (en) | 1973-07-25 | 1973-07-25 | Method for manufacturing a composite sintered structure |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1438559A true GB1438559A (en) | 1976-06-09 |
Family
ID=10378767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3553073A Expired GB1438559A (en) | 1973-07-25 | 1973-07-25 | Method for manufacturing a composite sintered structure |
Country Status (3)
Country | Link |
---|---|
GB (1) | GB1438559A (en) |
HK (1) | HK30579A (en) |
MY (1) | MY8000130A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0078370A1 (en) * | 1981-10-19 | 1983-05-11 | International Business Machines Corporation | Method of detecting residual glass during fabrication of ceramic substrates for semiconductors |
EP0122522A1 (en) * | 1983-03-29 | 1984-10-24 | Kabushiki Kaisha Toshiba | Method of manufacturing sintered ceramic body |
-
1973
- 1973-07-25 GB GB3553073A patent/GB1438559A/en not_active Expired
-
1979
- 1979-05-10 HK HK30579A patent/HK30579A/en unknown
-
1980
- 1980-12-31 MY MY8000130A patent/MY8000130A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0078370A1 (en) * | 1981-10-19 | 1983-05-11 | International Business Machines Corporation | Method of detecting residual glass during fabrication of ceramic substrates for semiconductors |
EP0122522A1 (en) * | 1983-03-29 | 1984-10-24 | Kabushiki Kaisha Toshiba | Method of manufacturing sintered ceramic body |
US4626451A (en) * | 1983-03-29 | 1986-12-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of manufacturing sintered ceramic body |
Also Published As
Publication number | Publication date |
---|---|
HK30579A (en) | 1979-05-18 |
MY8000130A (en) | 1980-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19930724 |