TW428170B - Method and apparatus for laminating boards - Google Patents

Method and apparatus for laminating boards

Info

Publication number
TW428170B
TW428170B TW086104047A TW86104047A TW428170B TW 428170 B TW428170 B TW 428170B TW 086104047 A TW086104047 A TW 086104047A TW 86104047 A TW86104047 A TW 86104047A TW 428170 B TW428170 B TW 428170B
Authority
TW
Taiwan
Prior art keywords
gap
adhesive
boards
nozzle
discharging
Prior art date
Application number
TW086104047A
Other languages
English (en)
Chinese (zh)
Inventor
Keinosuke Kanashima
Norihide Higaki
Toshiyuki Fujioka
Susumu Nojiri
Hiroyuki Fukuno
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of TW428170B publication Critical patent/TW428170B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1454—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/342—Preventing air-inclusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8225—Crank mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • B29D17/005—Producing optically read record carriers, e.g. optical discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/10—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1412—Infrared [IR] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7852—Holding or clamping means for handling purposes using electrostatic forces to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Medicinal Preparation (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
TW086104047A 1996-03-28 1997-03-28 Method and apparatus for laminating boards TW428170B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7353696 1996-03-28
JP8924396 1996-04-11

Publications (1)

Publication Number Publication Date
TW428170B true TW428170B (en) 2001-04-01

Family

ID=26414682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104047A TW428170B (en) 1996-03-28 1997-03-28 Method and apparatus for laminating boards

Country Status (6)

Country Link
US (1) US6231705B1 (enExample)
JP (1) JP3863188B2 (enExample)
CN (1) CN1088008C (enExample)
AU (1) AU706524B2 (enExample)
TW (1) TW428170B (enExample)
WO (1) WO1997035720A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI888082B (zh) * 2023-03-31 2025-06-21 日商芝浦機械電子裝置股份有限公司 基板分離裝置、基板處理裝置以及基板分離方法

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1167068C (zh) 1997-05-30 2004-09-15 松下电器产业株式会社 制造光盘的方法及设备
EP1001874A1 (de) 1997-08-06 2000-05-24 Krauss-Maffei Kunststofftechnik GmbH Verfahren und vorrichtung zum verkleben von zwei dvd (digital versatile disc)-halbseiten
DE19744408A1 (de) * 1997-10-08 1999-04-15 Leybold Systems Gmbh Verfahren zum Verkleben eines flachen, kreisscheibenförmigen ersten Substrats aus einem Kunststoff mit einem ebensolchen zweiten Substrat
EP1164004A3 (en) * 1997-11-12 2005-01-26 STEAG HamaTech, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
US6106657A (en) * 1998-05-19 2000-08-22 First Light Technology, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
WO1999024240A1 (en) * 1997-11-12 1999-05-20 First Light Technology, Inc. System and method for dispensing a resin between substrates of a bonded storage disk
JP4833386B2 (ja) * 1997-11-26 2011-12-07 エヌエックスピー ビー ヴィ ２つの板状物体を接着するための方法及び装置
SE511641C2 (sv) * 1998-02-24 1999-11-01 Toolex Alpha Ab Förfarande för sammanlimning av optiska skivsubstrat
TW543034B (en) 1998-08-05 2003-07-21 Matsushita Electric Industrial Co Ltd Production process and apparatus of optical disk and production process of substrate
JP2000076710A (ja) * 1998-08-26 2000-03-14 Matsushita Electric Ind Co Ltd 光ディスク用基板の貼り合わせ方法および装置
DE19907210A1 (de) * 1999-02-23 2000-08-31 Krauss Maffei Kunststofftech Vorrichtung zum Transportieren und gleichzeitigen Kühlen von Substraten für Informationsträgerscheiben wie CD, DVD oder dergleichen
DE69904015T2 (de) 1999-02-23 2003-10-09 Otb Group B.V., Eindhoven Ein Verfahren zur Herstellung einer Scheibe und eine so hergestellte Scheibe
WO2000057414A1 (en) 1999-03-23 2000-09-28 Dainippon Ink And Chemicals, Inc. Optical disk production device
JP2001093197A (ja) * 1999-09-27 2001-04-06 Matsushita Electric Ind Co Ltd 光学的記録媒体製造装置
JP2001134990A (ja) * 1999-11-02 2001-05-18 Sony Corp 光学記録ディスクの製造方法及び製造装置
JP2001209980A (ja) * 2000-01-26 2001-08-03 Matsushita Electric Ind Co Ltd 光学的情報記録媒体の製造方法および製造装置
JP2002175646A (ja) * 2000-09-28 2002-06-21 Pioneer Electronic Corp ディスク作製方法及びディスク転写方法
EP1256948A3 (en) * 2001-05-11 2006-05-24 Dainippon Ink And Chemicals, Inc. Method for maintaining flatness, flatness maintaining unit and device, and disc manufacturing method and device
JP2004523057A (ja) 2001-05-14 2004-07-29 アプリリス，インコーポレイテッド 正確な平行度の表面を有する光学記録媒体の製造方法とその装置
US20040134603A1 (en) * 2002-07-18 2004-07-15 Hideo Kobayashi Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus
JP2005174375A (ja) * 2003-12-05 2005-06-30 Kitano Engineering Co Ltd 光ディスクの貼合わせ方法及び光ディスクの貼合わせ装置
US7829152B2 (en) * 2006-10-05 2010-11-09 Lam Research Corporation Electroless plating method and apparatus
DE602004014204D1 (de) * 2004-11-04 2008-07-10 4M Technologies Holding Neigungsverwaltungseinrichtung und -verfahren
DE102005005925B4 (de) * 2005-02-09 2009-01-15 Steag Hamatech Ag Verfahren und Vorrichtung zum Zusammenfügen von Substratscheiben eines optischen Datenträgers
JP4042778B2 (ja) * 2005-09-29 2008-02-06 ダイキン工業株式会社 冷凍装置のケーシング構造およびそのケーシングのシーリング方法
TWI307505B (en) * 2006-03-08 2009-03-11 Ind Tech Res Inst Apparatus for fabricating coverlayer of optical information storage media and operating method of the same
EP2474478B1 (en) * 2009-09-04 2017-04-05 Dexerials Corporation Filling device
CN102625943B (zh) * 2009-09-04 2014-10-29 迪睿合电子材料有限公司 填充装置
TWI534500B (zh) * 2009-10-13 2016-05-21 Dexerials Corp A manufacturing method of a display device, and a transparent resin filler
JP2011222087A (ja) * 2010-04-09 2011-11-04 Mitsubishi Kagaku Media Co Ltd 光記録媒体の製造方法及びその製造装置
US8512491B2 (en) * 2010-12-21 2013-08-20 Tessera, Inc. Dual wafer spin coating
JP5486704B1 (ja) * 2013-01-30 2014-05-07 オリジン電気株式会社 部材貼り合わせ装置
WO2014119542A1 (ja) * 2013-01-30 2014-08-07 オリジン電気株式会社 部材貼り合わせ装置
JP6247995B2 (ja) * 2014-04-22 2017-12-13 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
DE102014017149A1 (de) * 2014-11-17 2016-05-19 Kienle + Spiess Gmbh Verfahren zur Herstellung von Lamellenpaketen und Anlage zur Durchführung des Verfahrens
JP6742449B2 (ja) * 2016-03-11 2020-08-19 イノテック モーション ゲーエムベーハーＩｎｎｏｔｅｃ Ｍｏｔｉｏｎ Ｇｍｂｈ 座席用家具シャーシに固定するためのフットレストシャーシ
CN105711018B (zh) * 2016-04-14 2017-10-27 保定华翼风电叶片研究开发有限公司 一种环氧树脂浇注体平板制备方法及装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52714B1 (enExample) * 1971-06-21 1977-01-10
AU517509B2 (en) 1972-10-30 1981-08-06 J. W Ellemor Manufacturing articles by joining preformed shapes
US4877475A (en) * 1984-11-01 1989-10-31 Matsushita Electric Industrial Co., Ltd. Method for producing information storage disk
JPS61194662A (ja) 1985-02-22 1986-08-29 Matsushita Electric Ind Co Ltd 情報記録担体の製造方法
EP0245460A1 (en) 1985-11-18 1987-11-19 EASTMAN KODAK COMPANY (a New Jersey corporation) Stamping optical recording media
EP0243517B1 (en) * 1986-04-28 1991-02-27 Matsushita Electric Industrial Co., Ltd. Method for producing information storage disk
NL8702493A (nl) * 1986-10-31 1988-05-16 Seiko Epson Corp Optisch opnamemedium en werkwijze voor het vervaardigen daarvan.
DE3830866A1 (de) 1988-09-10 1990-03-15 Lenhardt Maschinenbau Verfahren zum zusammenbauen von zwei glastafeln zu einer isolierglasscheibe
US5022556A (en) * 1989-10-25 1991-06-11 Raytheon Company Programmable volume dispensing apparatus
DE3935994A1 (de) 1989-10-28 1991-05-02 Ppg Glastechnik Gmbh Verfahren zum verbinden zweier glastafeln zu einer isolierglasscheibe und vorrichtung zum durchfuehren des verfahrens
DE4041199A1 (de) * 1990-12-21 1992-07-09 Hamatech Halbleiter Maschinenb Verfahren und vorrichtung zum verkleben von zwei miteinander zu verbindenden, informationen tragenden scheiben oder dergleichen
JPH0520714A (ja) 1991-07-15 1993-01-29 Matsushita Electric Ind Co Ltd 光デイスク製造方法及び製造装置
JPH0650577A (ja) 1992-07-31 1994-02-22 Mitsui Eng & Shipbuild Co Ltd 冷房方式
JP3098892B2 (ja) 1993-06-16 2000-10-16 松下冷機株式会社 冷蔵庫
DE4402676A1 (de) 1994-01-29 1995-08-03 Michael Seewald Handwerksgerät zur Förderung und Portionierung plastischer, plastoelastischer und pastöser Massen
JPH0845113A (ja) 1994-07-29 1996-02-16 Nikon Corp 光記録媒体の製造方法
IL113739A (en) 1995-05-15 1998-03-10 Shellcase Ltd Bonding machine
JP3495145B2 (ja) 1995-06-26 2004-02-09 日本政策投資銀行 光ディスクの端部処理方法及びその装置
US5951806A (en) * 1995-11-30 1999-09-14 Kitano Engineering Co., Ltd. Method of manufacturing a storage disc

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI888082B (zh) * 2023-03-31 2025-06-21 日商芝浦機械電子裝置股份有限公司 基板分離裝置、基板處理裝置以及基板分離方法

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AU2176397A (en) 1997-10-17
JP3863188B2 (ja) 2006-12-27
CN1088008C (zh) 2002-07-24
CN1216955A (zh) 1999-05-19
US6231705B1 (en) 2001-05-15
JP2000507174A (ja) 2000-06-13
AU706524B2 (en) 1999-06-17
WO1997035720A1 (en) 1997-10-02

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