TW415880B - Polishing method for a notch on a wafer - Google Patents
Polishing method for a notch on a wafer Download PDFInfo
- Publication number
- TW415880B TW415880B TW088119490A TW88119490A TW415880B TW 415880 B TW415880 B TW 415880B TW 088119490 A TW088119490 A TW 088119490A TW 88119490 A TW88119490 A TW 88119490A TW 415880 B TW415880 B TW 415880B
- Authority
- TW
- Taiwan
- Prior art keywords
- honing
- notch
- wafer
- pad
- face
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10337700A JP2000158315A (ja) | 1998-11-27 | 1998-11-27 | 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW415880B true TW415880B (en) | 2000-12-21 |
Family
ID=18311145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088119490A TW415880B (en) | 1998-11-27 | 1999-11-08 | Polishing method for a notch on a wafer |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1004400A1 (ja) |
JP (1) | JP2000158315A (ja) |
KR (1) | KR20000047734A (ja) |
TW (1) | TW415880B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077872A (ja) * | 2001-09-06 | 2003-03-14 | Speedfam Co Ltd | 半導体ウェハ研磨装置及び研磨方法 |
KR20030053085A (ko) * | 2001-12-22 | 2003-06-28 | 주식회사 실트론 | 실리콘 웨이퍼의 제조방법 |
US7559825B2 (en) | 2006-12-21 | 2009-07-14 | Memc Electronic Materials, Inc. | Method of polishing a semiconductor wafer |
DE102013204839A1 (de) | 2013-03-19 | 2014-09-25 | Siltronic Ag | Verfahren zum Polieren einer Scheibe aus Halbleitermaterial |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2798345B2 (ja) * | 1993-06-11 | 1998-09-17 | 信越半導体株式会社 | ウェーハのノッチ部研磨装置 |
JP2798347B2 (ja) * | 1993-07-08 | 1998-09-17 | 信越半導体株式会社 | ウェーハのノッチ部研磨装置 |
DE4325518A1 (de) * | 1993-07-29 | 1995-02-02 | Wacker Chemitronic | Verfahren zur Glättung der Kante von Halbleiterscheiben |
TW308561B (ja) * | 1995-08-24 | 1997-06-21 | Mutsubishi Gum Kk |
-
1998
- 1998-11-27 JP JP10337700A patent/JP2000158315A/ja not_active Withdrawn
-
1999
- 1999-11-08 TW TW088119490A patent/TW415880B/zh not_active IP Right Cessation
- 1999-11-08 EP EP99122257A patent/EP1004400A1/en not_active Withdrawn
- 1999-11-26 KR KR1019990052942A patent/KR20000047734A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2000158315A (ja) | 2000-06-13 |
KR20000047734A (ko) | 2000-07-25 |
EP1004400A1 (en) | 2000-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |