TW415880B - Polishing method for a notch on a wafer - Google Patents

Polishing method for a notch on a wafer Download PDF

Info

Publication number
TW415880B
TW415880B TW088119490A TW88119490A TW415880B TW 415880 B TW415880 B TW 415880B TW 088119490 A TW088119490 A TW 088119490A TW 88119490 A TW88119490 A TW 88119490A TW 415880 B TW415880 B TW 415880B
Authority
TW
Taiwan
Prior art keywords
honing
notch
wafer
pad
face
Prior art date
Application number
TW088119490A
Other languages
English (en)
Chinese (zh)
Inventor
Shunji Hakomori
Original Assignee
Speedfam Ipec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Co Ltd filed Critical Speedfam Ipec Co Ltd
Application granted granted Critical
Publication of TW415880B publication Critical patent/TW415880B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW088119490A 1998-11-27 1999-11-08 Polishing method for a notch on a wafer TW415880B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337700A JP2000158315A (ja) 1998-11-27 1998-11-27 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法

Publications (1)

Publication Number Publication Date
TW415880B true TW415880B (en) 2000-12-21

Family

ID=18311145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088119490A TW415880B (en) 1998-11-27 1999-11-08 Polishing method for a notch on a wafer

Country Status (4)

Country Link
EP (1) EP1004400A1 (ja)
JP (1) JP2000158315A (ja)
KR (1) KR20000047734A (ja)
TW (1) TW415880B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077872A (ja) * 2001-09-06 2003-03-14 Speedfam Co Ltd 半導体ウェハ研磨装置及び研磨方法
KR20030053085A (ko) * 2001-12-22 2003-06-28 주식회사 실트론 실리콘 웨이퍼의 제조방법
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
DE102013204839A1 (de) 2013-03-19 2014-09-25 Siltronic Ag Verfahren zum Polieren einer Scheibe aus Halbleitermaterial

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798345B2 (ja) * 1993-06-11 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP2798347B2 (ja) * 1993-07-08 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
DE4325518A1 (de) * 1993-07-29 1995-02-02 Wacker Chemitronic Verfahren zur Glättung der Kante von Halbleiterscheiben
TW308561B (ja) * 1995-08-24 1997-06-21 Mutsubishi Gum Kk

Also Published As

Publication number Publication date
JP2000158315A (ja) 2000-06-13
KR20000047734A (ko) 2000-07-25
EP1004400A1 (en) 2000-05-31

Similar Documents

Publication Publication Date Title
JP3841491B2 (ja) ポリッシング装置
US5094037A (en) Edge polisher
JP2002208572A (ja) 研磨装置
TW200834805A (en) Substrate processing apparatus
TW580737B (en) Semiconductor wafer edge grinding system
TW415880B (en) Polishing method for a notch on a wafer
TW380084B (en) Modular wafer polishing apparatus and method
JP3766177B2 (ja) 基板処理装置および基板洗浄装置
JP2001121412A (ja) 両面研磨装置
JP2000237955A (ja) 端面研磨装置におけるウエハ吸着部への液体の供給および真空引き機構
JP4280397B2 (ja) ワークの研磨方法
TW411298B (en) Wafer polishing machine
JP3979451B2 (ja) ポリッシング装置
JP2000158309A (ja) 端面研磨装置における周面研磨部の搬送部材配列
JP2000158337A (ja) 端面研磨装置におけるウエハチャック機構
JP2020059095A (ja) ウェハの研磨装置および研磨方法
JP2000164678A (ja) 端面研磨装置におけるウエハのノッチ位置補償方法
JP2000183147A (ja) 端面研磨装置におけるノッチハンドラ機構
JP2000202750A (ja) 端面研磨装置におけるノッチ研磨装置のウエハ揺動機構
JPH07314304A (ja) ウエハの鏡面加工装置
JP2000183135A (ja) 端面研磨装置における搬送部材の支持機構
JP2000084843A (ja) 片面ポリッシング装置及び片面ポリッシング方法
JPH11195690A (ja) ウエーハ移載装置
WO2021131243A1 (ja) 研磨装置への半導体ウェーハの受け渡し方法および半導体ウェーハの製造方法
TWM255995U (en) Edge-contact wafer holder

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees