KR20000047734A - 단면연마장치에 있어서의 노치연마장치의 노치연마방법 - Google Patents

단면연마장치에 있어서의 노치연마장치의 노치연마방법 Download PDF

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Publication number
KR20000047734A
KR20000047734A KR1019990052942A KR19990052942A KR20000047734A KR 20000047734 A KR20000047734 A KR 20000047734A KR 1019990052942 A KR1019990052942 A KR 1019990052942A KR 19990052942 A KR19990052942 A KR 19990052942A KR 20000047734 A KR20000047734 A KR 20000047734A
Authority
KR
South Korea
Prior art keywords
polishing
notch
wafer
pad
polishing apparatus
Prior art date
Application number
KR1019990052942A
Other languages
English (en)
Korean (ko)
Inventor
하코모리순지
Original Assignee
오하라 히로시
스피드팜.아이펙 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오하라 히로시, 스피드팜.아이펙 가부시키가이샤 filed Critical 오하라 히로시
Publication of KR20000047734A publication Critical patent/KR20000047734A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019990052942A 1998-11-27 1999-11-26 단면연마장치에 있어서의 노치연마장치의 노치연마방법 KR20000047734A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10337700A JP2000158315A (ja) 1998-11-27 1998-11-27 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法
JP337700 1998-11-27

Publications (1)

Publication Number Publication Date
KR20000047734A true KR20000047734A (ko) 2000-07-25

Family

ID=18311145

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990052942A KR20000047734A (ko) 1998-11-27 1999-11-26 단면연마장치에 있어서의 노치연마장치의 노치연마방법

Country Status (4)

Country Link
EP (1) EP1004400A1 (ja)
JP (1) JP2000158315A (ja)
KR (1) KR20000047734A (ja)
TW (1) TW415880B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030053085A (ko) * 2001-12-22 2003-06-28 주식회사 실트론 실리콘 웨이퍼의 제조방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077872A (ja) * 2001-09-06 2003-03-14 Speedfam Co Ltd 半導体ウェハ研磨装置及び研磨方法
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
DE102013204839A1 (de) 2013-03-19 2014-09-25 Siltronic Ag Verfahren zum Polieren einer Scheibe aus Halbleitermaterial

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798345B2 (ja) * 1993-06-11 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP2798347B2 (ja) * 1993-07-08 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
DE4325518A1 (de) * 1993-07-29 1995-02-02 Wacker Chemitronic Verfahren zur Glättung der Kante von Halbleiterscheiben
TW308561B (ja) * 1995-08-24 1997-06-21 Mutsubishi Gum Kk

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030053085A (ko) * 2001-12-22 2003-06-28 주식회사 실트론 실리콘 웨이퍼의 제조방법

Also Published As

Publication number Publication date
TW415880B (en) 2000-12-21
EP1004400A1 (en) 2000-05-31
JP2000158315A (ja) 2000-06-13

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