經濟部智慧財產局員工消费合作社印製 415880 A7 ___B7___ 五、發明說明（1 ) (發明所屬之技術領域） 本發明係有關於端面硏磨裝置之凹口硏磨裝置之凹口 硏磨方法，特別是令凹口硏磨用墊令墊正旋轉及逆旋轉以 資硏磨凹口之端面硏磨裝置之凹口硏磨方法。 (先前技術） 通常如矽晶圓一般之半導體晶圓乃爲了防止周邊之倒 翻或外延成長時之中央厚度之凸起（crown )起見，對於該 周緣部實施削面加工。 該削面加工係以金剛石磨石來硏削來實施1 '惟在硏削 後很容易留存加工應變層，如果有這些加工應變層留存時 ，在於器件加工（device proccess )中反複做熱熱處理時， 就會發生結晶缺陷之可能。 因此通常係以蝕刻加工來去除上述加工應變層，惟在 '施予蝕刻處理之表面乃成爲波浪狀或魚鱗狀之凹凸而很容 易留存髒污，而此髒污在器件加工時擴散於晶圓全體，構 成使特性劣化之很大的原因。 於是近年乃以做爲晶圓之表面硏磨完全不同之技術而 確立開發有對於晶圓實施削面加工之周緣上以鏡面硏磨來 予以平順平滑化之技術提案有以鏡面硏磨晶圓之周緣之裝 置而有種種之端面硏磨裝置。 並且在端面硏磨裝置之凹口硏磨裝置中|以旋轉之墊 來硏磨依序運送而來之晶圓之凹口。惟由於墊本身乃有某 一種程度之柔軟度，在於旋轉時將多多少少膨出於外方， II----------- 裝 ------—訂- ------I "線 <靖先閲讀背面之注意事項再填寫本頁》 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公*〉 -4 - 經濟耶智慧財產局員工消f合作社印製 415880 A7 _B7____ 五、發明說明（2 ) 所以在接觸於凹口之前墊之外周緣可以充分接觸於凹口之 外周緣，而抵接後即蟄之外周緣乃與抵接前比較層離開於 凹口之表面，無法充分的抵接於凹口之表面，因此具有凹 口之表面呈顯墊之旋轉方向之前方側經常不得充分之硏磨 ，無法獲得硏磨之均一性之問題。 本發明之目的乃提供一種，在端面硏磨裝置之凹口硏 磨裝置中，在於以硏磨墊來硏磨硏磨墊之凹口時，可以充 分且均一的硏磨凹口之全部之表面之端面硏磨裝置之凹口 硏磨裝置之凹口硏磨方法者。 (爲解決問題之手段） 爲了解決上述問題，本發明乃採用了： 一種端面硏磨裝置之凹口硏磨裝置的凹口硏磨方法， 主要係由：供給收容於盒中之晶圓之供給部·及用於 硏磨被供給之晶圓之凹口之凹口硏磨部，及硏磨晶圓之周 面之硏磨部，以及用於收容在此硏磨部所硏磨之晶圓之盒 之排出部，所成之端面硏磨裝置中，其特徵爲； 在上述凹口硏磨部配設；以水平狀態地載置所供給之 晶圓之吸著部，及用於硏磨晶圓之凹口之凹口硏磨用墊， 同時備有對於上述吸著部而接•離自如之硏磨部而成之硏 磨裝置，該凹口硏磨裝置乃上述凹口硏磨用墊之行正旋轉 及逆旋轉的硏磨凹口者。 又，本發明係採用了在上述硏磨部配設有驅動源，而 由此驅動源本身之行正逆旋轉而使上述凹口硏磨用墊可能 ----I!-裝------丨—訂·！丨丨I-線 {請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格<210 X 297公S ) -5- 415880 A7 B7 五、發明說明（3 ) 行正逆旋轉者。 (請先Μ讀背面之注意事項再填寫本頁) 再本發明係採用了在上述硏磨部配設有驅動源，而在 於驅動源與上述凹口硏磨用墊之間之驅動力傳遞過程中配 設正逆旋轉機構，由而使上述凹口硏磨用墊成爲正逆旋轉 可能者。 (作用） 本發明係由於採用了上述手段，所以在硏磨凹口時， 由於凹口硏磨用墊鼓起於旋轉方法，靠身方側得於充分的 被硏磨，旋轉方向之前方側即無法充分的被硏磨，所以經 常以旋轉於同一方向地實施硏磨時，在於旋轉之前後會發 生硏磨之不均一由而無法確保硏磨之均一性，惟依本發明 時，由於凹口硏磨用墊會實施正旋轉及逆旋轉，因此在旋 轉之前後不會有發生硏磨不均一之情形，所以可以確保硏 磨之均一性。 (發明之實施形態） 經濟部智慧財產局員工消f合作社印製 下面說明附圖所示之本發明之實施形態β 附圖乃表示採用依本發明之凹口硏磨裝置之凹口硏磨 方法之晶圓之端面硏磨裝置（edge-poHsher)之全體圖 本端面硏磨裝置乃具備有：從內部以疊層狀的收容晶 圓之盒中取出晶圓，排列於一定之朝向，又反轉其前後而 運送於下序之過程之供給部1 〇 ’及 從此供給部10而接受晶圓以資硏磨設於晶圓之凹口 -6- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 415880 B7 __ 五、發明說明（4 ) 之凹口硏磨部2 0，及 (靖先閱讀背面之注意事項再填寫本頁) 接受在該凹口硏磨部2 0而硏磨了凹口之晶圓，首先 以表面側朝上狀態實施晶圓之端面之硏磨，再使表背面反 轉狀態而同樣的實施晶圓之端面之硏磨之端面硏磨部5 0 ，及 備有收容完成了凹口及端面之硏磨之晶圓之盒之排出 部1 0 0而成。 下面對於配設於依本發明之凹口硏磨方法之凹口硏磨 部2 0之凹口硏磨裝置2 2 « 首先，上述凹口硏磨部2 0乃配設有如第1圖所示， 挾著二個晶圓移交部21、 21地面向之一對凹口硏磨裝 置 2 2、2 2。 又如第2圖所示，設置有：分別據位於上述兩凹口硏 磨裝置22、 22之上面，同時昇降自如，且在沿著配設 於X方向之軌條2 9而移動自如於晶圓移交部2 1與凹口 硏磨裝置2 2之間，在下降位置時•於上述晶圓移送部 經濟部智慧財產局員工消费合作社印.製 2 1而接受上述晶圓W而上昇，又移動於X方向據位於凹 口硏磨裝置2 2之上方，而後下降移交於凹口硏磨裝置之 吸著盤3 6而構成之三爪構件2 3。 並且*上述凹口硏磨裝置2 2乃如第4圖、第5圖所 示，由吸著部3 0，及硏磨部3 4所構成，上述吸著部 3 0乃在其上面可能吸著晶圓，另一方面上述硏磨部3 4 乃與吸著於吸著部3 0之晶圓接近·離開可能同時該面向 於凹口之部位係開口狀之蓋3 1，乃據位於此蓋3 1內部 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 經濟部智慧財產局員工消f合作社印製 415880 A7 _B7_____ 五、發明說明（5 ) 而可抵接於凹口的突出之凹口硏磨用墊3 2，以及用於驅 動該凹口硏磨用墊3 2之驅動源3 3等所構成。 再者上述吸著部3 0乃呈顯圓盤之上面形成有圓周狀 之吸著孔3 5，而在此吸著盤3 6連接有真空源。 再者，上述硏磨部3 4乃，於凹口硏磨裝置2 2之機 械3 7上以朝著吸著部3 0地被配設之主軸3 8之貫穿狀 態地設有基盤3 9，在此基盤3 9上以起立狀態的配設有 基板4 0，在此基板4 0之上部安裝有其內部有凹口硏磨 用墊3 2所據位之蓋3 1 β 在下方設有驅動源3 3，而驅動源3 3與凹口硏磨用 墊3 2之旋轉軸之間張架有皮帶4 1。 另一方面在上述基盤39上設有連結構件42·在此 連結構件4 2上連結有鋼索4 3 *在鋼索4 3介著設於機 台之帶輪4 4而懸吊有配重4 5。 於是藉由配重4 5，基盤3 9乃沿著主軸3 8而移動 *設於基盤3 9之基板4 0之凹口硏磨用墊3 2乃被壓接 於該吸著於吸著盤3 6上之晶圓W之凹口。 又標號4 6乃該動作部4 6 a爲使頂抗於上述配重 4 5之基盤3 9移動之氣缸，藉由氣缸4 6而可以使可動 部移動至從凹口離開之位置》 並且在凹口硏磨部2 0上夾著晶圓移交部2 1地設有 二個凹口硏磨裝置2 2。 對於上述之凹口硏磨裝置2 2供給晶圓之三爪構件 2 3係具有垂下於下方之爪部2 4，在第3圖表示沿著第 — I!丨丨 1111 48^ · ί I I 訂·11111! "5^ {請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公蹵） -8- A7 415880 B7___ 五、發明說明（6 ) 1圖之C—C線所觀視之狀態》 (請先閱讀背面之注意事項再填寫本頁) 上述爪部2 4乃具有三個爪，當捉持晶圓w時’ 一個 爪會進入於上述晶圓之凹口，另外之二個爪即推壓晶圓之 周端面。 並且該各爪係藉由驅動源而可以握持及擴開，而握持 時，即由一爪之據位於凹口而可阻止晶圓之旋轉。 又|上述爪部2 4乃由驅動源而可能昇降，同時可移 動於X方向，且保持水平狀態地旋轉自如地被構成，而移 動於X方向時，分別可據於第4圖所示之凹口硏磨裝置 22、 22之吸著盤36之上方之位置。 下面說明如上面所述地被構成之凹口硏磨裝置2 2之 動作。 首先後述之供給部10之運送構件14之多關節臂 1 3係於在其上面載置晶圓狀態地移位於晶圓移交部2 1 、2 1 ° 經濟部智慧財產局員工消费合作社印製 於是三爪構件2 3之爪部2 4係握持晶圓而對吸著部 3 0運送，而移位至吸著盤3 6 -而使氣缸4 6不動作時 基盤3 9即由配重4 5之作用而沿著主軸3 8而移動，而 設於基盤3 9之基板4 0之凹口硏磨用墊3 2即推壓於由 吸著盤3 6所吸著之晶圓W之凹口 a也。 於是，如上述對於凹口 a而推壓從蓋3 1凸出之凹口 硏磨用墊3 2，同時起動驅動源3 3，於是驅動源3 3之 驅動力係介著皮帶4 1而傳遞於凹口硏磨用墊3 2 ’所以 凹口硏磨用墊3 2之抵接於晶圓W之凹口 a之狀態而開始 -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） 經濟部智慧財產局員工消費合作社印製 415880 A7 ___B7______ 五、發明說明（7 ) 旋轉。 在此旋轉時，如第1 3圖所示，凹口硏磨用墊3 2本 身由於具有某一種程度之彈性，所以在旋轉時鼓起而以凹 口 a之抵接部X爲境界，而旋轉方向靠身旁側之部位係充 分的可接觸於凹口 a ，而旋轉方向之前方側之部位即變位 至從凹口 a之離開之方向。 換言之凹口硏磨用墊3 2係以凹口 a之抵接部X爲境 界而旋轉方向之靠身旁側係鼓起而前方側之部位即呈顯凹 入，所以凹口a乃經常的良好的硏磨抵接部 之靠身旁。 又在此種條件之下，上述凹口硏磨用墊3 2即由於驅 動源3 3係可以正旋轉及逆旋轉，所以凹口 a即不關任何 部位也得於良好的被硏磨也。 詳述之，設於晶圓W之凹口 a乃從平面視之，即入口 側係成爲與凹口硏磨用墊3 2之厚度大致同一之寬，而愈 入內方其寬愈狹之碗狀，而由於凹口硏磨用墊32乃如上 述可實施正旋轉及逆旋轉，因此凹口 a之任何部位均能確 實且均一的被硏磨也。 上述驅動源3 3爲其本身具有可以行正旋轉及逆旋轉 之可逆性之驅動源也可以》或在介著此皮帶4 1而被旋轉 之凹口硏磨用墊3 2之間介著可逆可能之機構而實施正旋 轉及逆旋轉也可以> 下面說明對於如上述構成之凹口硏磨部2 0供給晶圓 之供給部1 0。 即如第1 2圖所示，由：在內部疊層了晶圓W而收容 本纸張尺度適用中囿國家標準（CNS)A4規格（210 χ 297公爱) -10- -------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) A7 415880 B7____ 五、發明說明（8 ) 之二個盒1 1，1 1 ，及依序取出該盒1 1內之晶圓W而 使形成於周面之凹口之成爲一定之位置地予以整列之排列 器12，及由上述盒11而對於排列器12傳遞晶圓，同 時從排列器12所取出之被整齊的排列之晶圓運送至凹口 硏磨過程之備有多關節臂13之運送構件14所構成。 上述二個盒11、 11及排列器12係載置於載置台 1 1 0，另一方面上述運送構件1 4係藉由機器人1 1 1 而可沿著上述載置台110而可移動的被構成。 於是上述運送構件14乃可以往復移動於圖示之實線 位置與二點鍊鎖線之位置之間，而具有二個在前端部配設 有二叉部1 5之多關節臂1 3、1 3，在此運送構件14 之二個二叉部15之上面分別載置有晶圓W而隨著多關節 1 3之伸縮而可能運送晶圓W也。 又上述運送構件14之外側而以二點鍊鎖線所示之圓 係示之二叉部15之迴動域也》 再者，上述排列器1 2係例如曰本專利公報特許第 2 7 2 9 2 9 7號公報所示，接受以運送構件1 4之多關 節臂1 3之二叉部1 5所運送之晶圓W，而使設於晶圓W 之周緣部之凹口之對於多關節臂13之二叉部15而成爲 規定之位置地使之整齊排列也。 所以上述運送構件14乃從盒11取出晶圓W而運送 於排列器1 2，而接受在排列器1 2所整齊排列之晶圓W 而傳遞於晶圓移交部21、 21^ 此時晶圓移交部21、 21乃對應於後述之設於凹口 I-----I--! _ I ---—訂 I — I — I _ (諳先Μ讀背面之注意事項再填窵本頁) 經濟部智慧財產局員工消费合作杜印製 本紙張尺度適用+國國家標準（CNS)A4規格（210 * 297公* ) 11· 經濟部智慧財產局員工消费合作社印*1^ A7 B7___ 五、發明說明（9 ) 硏磨部2 0之凹口硏磨裝置2 2地如二點鍊鎖線所示形成 於二處。 另一方面連續於上述凹口硏磨部2 0而設有用於硏磨 晶圓之周面之端面硏磨部5 0。 該端面硏磨部5 ◦係，於中央部連續於γ方向地被配 設，同時設成一串列，由：具備有Y方向往復移動可能之 二支多關節臂之二個運送構件5 1、5 2，及挾著二個運 送構件5 1、5 2而互相面向，同時分別在γ方向分別一 串列的予以配設之周面硏磨裝置5 3。並且備有晶圓反轉 構件8 0。 該晶圓反轉構件8 0乃分別沿著端面硏磨部5 0之上 部地設置之軌條8 2而可移動於Y方向，同時具備有可以 反轉晶圓之一對晶圓反轉機構8 1。 而此晶圓反轉機構81乃接受載置於上述一方之運送 構件51之各多關節臂13之上面之晶圓而載置於一方之 多關節臂1 3之晶圓移至另一方之周面硏磨裝置5 3之另 一側之吸著盤5 4 ,又另一方之多關節臂1 3所載置之晶 圓交至上述一方之周面硏磨裝置5 3之另一側之吸著盤 5 4也。 又在於由上述供給部1 0側之周面硏磨裝置5 3之端 面之硏磨後，接受吸著盤5 4之兩晶圓之後上昇，同時實 施反轉，接受於另一方之周面硏磨裝置5 3之兩吸著盤 5 4，在於由另一方之周面硏磨裝置5 3之周端面之硏磨 後移交於另一方之運送構件5 2之兩多關節臂也。 111111111111( *—11)11— «ιιιι — lla ·"·請先閲讀背面之沒意事項再填寫本頁) 本紙張尺度適用中S國家標準<CNS)A4規格（210 X 297公釐） -12- 415880 A7 B7 經濟部智慧財產局具工消费合作社印•製 五、發明說明（10 ) 又於上述中央部連續於γ方向而配設之二個運送構件 5 1、5 2係具有與供給部1〇所使用之運送構件14同 樣之構成。 另一方面，上述周面硏磨裝置5 3係具有據位於中央 部而分別捲繞有鼓輪墊5 5 a之一對硏磨鼓輪5 5 »在此 硏磨鼓輪5 5之兩側之Y方向分別配設有晶圓壓接機構 6 0。 此時各晶圓壓接機構6 0乃從平面觀視而對於Y方向 只傾斜有規定角度之方向（A方向）地配設而成（參照第 1 0圖），又在其上部配設有在水平狀態與傾斜狀態之間 可擺動於垂直方向之吸著盤5 4也 此晶圓壓接機構6 0係如第7圖，第8圖，第9圖所 示，具有：以保持以真空吸著晶圓用之吸著盤5 4之第1 體6 1，及以支軸6 2爲中心而擺動自如地保持第1體 6 1之第2體6 3，並且第2體63乃以支持機構65而 支持移動於旋轉台6 4之半徑方向，即支持移動於接·離 於硏磨鼓輪5 5之方向以及支持移動於直交於硏磨鼓輪 5 5之半徑方向即與連結鄰接於二個硏磨鼓輪5 5之中心 之線成平行之方向。 上述支持機構6 5係具有：在固定於旋轉台6 4之下 面之台板上，以接•離於硏磨鼓輪5 5之方向（A方向） 的被設置之第1軌道6 7，及沿著此第1軌道6 7而移動 自如之第1滑動構件6 8，及在第1滑動構件6 8之上部 而設於直交於上述第1軌道6 7之方向（B方向）之第2 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） -13- I I I tf ί ί n n »^i ί- * ϋ i« n n n t— · 1 n n n n n n f 線 (請先閲讀背面之注意事項再«.'寫本頁) 經濟部智慧財產局員工消費合作社印製 415880 a? __B7_ 五、發明說明（11 ) 軌道6 9，以及沿著第2軌道6 9而移動可能之第2滑動 構件7 0 *而在第2滑動構件7 0之上部以台腳7 1而安 裝有上述第2體6 3 p 又在上述台板6 6之下面安裝有帶輪7 2。在此帶輪 72上張架有鋼索72a。鋼索72a之後端係固定於由 上述第1滑動構件6 8而朝下方向延出之臂7 3，而在鋼 索7 2 a之先端懸吊有配重7 4。 而由此配重7 4而第1滑動構件6 8乃在第1軌道 6 7經常朝硏磨鼓輪5 5側被賦予勢能（或被彈撥）》 又在上述第2滑動構件7 0上安裝有介著帶輪9 0而 在其端部安裝了配重9 1之鋼索9 2，由該配重9 1而將 吸著盤5 4被推壓而使吸著之晶圓對於二個硏磨鼓輪5 5 、55而可以略均一的抵接地被構成也。 這是爲了對於旋轉之硏磨鼓輪55、 55而當晶圓之 抵接時，爲了晶圓本身之旋轉而會發生之對於兩硏磨鼓輪 55、 55之不均一之抵接力使之略均一化之用者。 在上述台板6 6之下面安裝有空氣氣缸7 5，此空氣 氣缸7 5之桿7 5 a之前端低抵接於臂7 3，由而以此空 氣氣缸7 5而令第1滑動構件6 8係頂抗於配重7 4而有 將它具有推壓於從硏磨鼓輪5 5離開之方向之趨勢的被構 成6 又如第9圖所示，上述吸著盤5 4乃在此表面穿設有 複數之吸著孔，這些吸著孔乃介著設於第1體6 1及第2 體63等之口及配管77而連接於真空源（不圖示）。 1!!!裝 ----- -- 訂·！1111!線 (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國圉家標準（CNS)A4規格（210 X 297公釐） -14 - 415880 A7 B7 五、發明說明（12 ) 該吸著盤5 4係由設於第1體6 1之驅動源而硏磨時 即以非常之緩慢的速度而被旋轉。 又，如前面所述|上述第1體6 1乃藉由旋轉致動器 7 8而以支軸6 2爲中心而以吸著盤5 4爲朝水平之狀態 ，及呈傾斜之狀態的可以擺動。又水平狀態時即由硏磨鼓 輪5 5而離開實施晶圓之移交或接受也。 於是在吸著盤5 4之成傾斜之狀態下，以配重7 4之 作用力而分別壓接接觸於兩硏磨鼓輪5 5，即壓接接觸於 捲繞於二個硏磨鼓輪5 5之鼓輪墊5 5 a由而晶圓乃同時 的被硏磨周面之二處。 再者第1體61乃在非硏磨位置之水平狀態時係藉由 氣缸7 5而頂抗於配重7 4而被退後於從硏磨鼓輪5 5離 開之方向。 又上述硏磨鼓輪5 5乃由設於硏磨裝置之機台之驅動 源7 6而被構成爲旋轉可能也 再者，在安裝於吸著盤5 4之晶圓W之硏磨時，可以 噴出硏磨劑（漿液），由而可回收硏磨劑以供再利用。 晶圓反轉構件8 0乃，如第2圖，第6圖所示，被設 爲可以在如上述在一方側之二個周面硏磨裝置5 3之上方 移動。 即晶圓反轉構件8 0係具有：在一方之側之二個周面 硏磨裝置5 3之上方之Υ方向地設置之軌道8 2，及安裝 於此軌道8 2同時挾著上述硏磨鼓輪5 5而互相面向之具 有一對之吸著盤5 4所對應之間隔之一對晶圓反轉機構 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） -15 - <請先Mt*背面之ίΐ.*爹項再填寫本頁> 裝------- 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 415880 A7 ___B7___ V. Description of the invention (1) (Technical field to which the invention belongs) The present invention relates to a notch honing method for a notch honing device of an end face honing device, in particular It is a notch honing method for making the pad for notch honing to rotate the pad forward and reverse to honing the end face honing device of the notch. (Prior technology) Generally, a semiconductor wafer, such as a silicon wafer, is subjected to a facet processing on the peripheral portion in order to prevent the central thickness crown at the time of peripheral inversion or epitaxial growth. This facet processing is performed by diamond grinding with 1 ', but it is easy to retain the processing strain layer after honing. If these processing strain layers are left, it is caused by repeated heat treatment during device processing (device proccess). The possibility of crystal defects will occur. Therefore, the above-mentioned processing strain layer is usually removed by etching, but the surface that is subjected to the etching treatment becomes wavy or fish-scale-shaped unevenness, and it is easy to retain dirt, and this dirt spreads on the wafer during device processing Overall, it constitutes a large cause of deterioration of characteristics. Therefore, in recent years, it has been established as a completely different technology of wafer surface honing. Developed a technology proposal to smoothen and smooth the surface of the wafer by mirror honing. Mirror honing the periphery of the wafer. There are various end honing devices. And in the notch honing device of the end-face honing device, the notches of the wafers that are sequentially conveyed are honed with a rotating pad. However, because the pad itself has a certain degree of softness, it swells out more or less outside when rotating, II ----------- installed ------- order-- ---- I " Line " Jing first read the precautions on the back before filling out this page. "This paper size applies to China National Standard (CNS) A4 (210 X 297) *> -4-Employees of Economic and Intellectual Property Bureau Printed by Consumer Cooperative 415880 A7 _B7____ 5. Description of the Invention (2) Therefore, before contacting the notch, the outer periphery of the pad can fully contact the outer periphery of the notch, and after the contact, that is, the outer periphery is not before the contact. The comparative layer leaves the surface of the notch and cannot fully abut the surface of the notch. Therefore, the surface with the notch is often not sufficiently honed before the rotation direction of the pad, and the uniformity of the honing cannot be obtained. The object of the present invention is to provide a sufficient and uniform honing notch in a notch honing device of an end-face honing device. The notch honing method of the end face honing device of the surface. Means for solving the problem) In order to solve the above-mentioned problems, the present invention adopts: A notch honing method for a notch honing device of an end-face honing device, which is mainly provided by a supply unit for supplying wafers contained in a box · And a notch honing part for honing the notch of the wafer being supplied, a honing part for honing the peripheral surface of the wafer, and a box for accommodating the wafer honed by the honing part The discharge part and the end face honing device formed are characterized in that: the notch honing part is arranged; a suction part for placing the supplied wafer in a horizontal state, and for honing the wafer The notch honing pad is also provided with a honing device which is connected to and free from the above-mentioned suction portion. The notch honing device is the same as the above-mentioned notch honing pad. The honing notches are rotated in a forward rotation and a reverse rotation. In addition, the present invention adopts a driving source provided in the honing unit, and the driving source itself is rotated in the forward and reverse directions to hob the notches. The pad may be ---- I! -Installed ------ 丨 --ordered! 丨 丨 I-line {Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specifications < 210 X 297 male S) -5- 415880 A7 B7 V. Description of the invention (3) Those who perform forward and reverse rotation. (Please read the precautions on the back before filling in this page.) The present invention uses a driving source in the honing unit, and the driving force transmission process between the driving source and the notch honing pad. A forward and reverse rotation mechanism is provided in the center, so that the above-mentioned notch honing pad becomes a person capable of forward and reverse rotation. (Action) The present invention adopts the above-mentioned means. Therefore, when honing the notch, since the notch honing pad is swelled by the rotation method, the side of the body can be honed sufficiently, and the side of the rotation is anterior side. That is, the honing can not be sufficiently performed. Therefore, when honing is often performed in the same direction of rotation, the unevenness of the honing occurs before and after the rotation, and the uniformity of the honing cannot be ensured. However, according to the present invention, due to the concave The mouth honing pad performs forward rotation and reverse rotation. Therefore, the honing unevenness does not occur before and after the rotation, so the uniformity of the honing can be ensured. (Implementation form of the invention) Printed by an employee of the Intellectual Property Bureau of the Ministry of Economic Affairs, Cooperative, the following describes the embodiment of the present invention shown in the accompanying drawings. The overall picture of the edge-poHsher of the wafer The supply part 10 ′, which is transferred before and after and is transported in the next process, and the wafer is received from the supply part 10 to grind the notch set on the wafer-6- This paper applies the Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) A7 415880 B7 __ V. The notch honing section 20 of the description of the invention (4), and (Jing first read the precautions on the back before filling this page) Accepted in the notch honing section 20 For a wafer with a notch, honing the end face of the wafer with the surface side facing up, and then honing the end face of the wafer with the front and back faces reversed Part 50, and a honing crystal containing a notch and an end face The discharge part of the round box is made of 100. Next, the notch honing device 2 2 provided in the notch honing section 20 of the notch honing method according to the present invention is provided with the notch honing section 20 as shown in FIG. 1. A pair of notch honing devices 2 2, 2 2 are held with the two wafer transfer portions 21 and 21 facing the ground. As shown in FIG. 2, it is provided that: it is located on the two notch honing devices 22 and 22 respectively, and can be lifted and lowered at the same time, and moves freely on the crystal along the rails 29 arranged in the X direction. Between the circular transfer unit 21 and the notch honing device 22, when it is in the lowered position • printed on the above-mentioned wafer transfer department, the Intellectual Property Bureau of the Ministry of Economic Affairs, the staff consumer cooperative. The three-claw member 23, which moves in the X direction and is located above the notch honing device 22, is then lowered and transferred to the suction plate 36 of the notch honing device. And * the notch honing device 22 is composed of a suction portion 30 and a honing portion 34 as shown in FIG. 4 and FIG. 5, and the suction portion 30 may suck on it. On the other hand, the honing portion 3 4 is close to and away from the wafer adsorbed on the adsorption portion 30. At the same time, the portion facing the notch is an opening-shaped cover 31, which is located here. Cover 3 1 Internal This paper size is in accordance with Chinese National Standard (CNS) A4 specifications (210 X 297 mm) printed by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by a cooperative 415880 A7 _B7_____ 5. The invention description (5) can be abutted on the concave The notch honing pad 3 2 protruding from the mouth, and a driving source 3 3 for driving the notch honing pad 32 2 are formed. Further, the above-mentioned suction part 30 is a top surface of a disc. A circumferential suction hole 3 5 is formed, and a vacuum source is connected to the suction disc 36. The honing portion 34 is provided on the machine 37 of the notch honing device 22 to face the surface. A base plate 39 is provided in the penetrating state of the main shaft 38 arranged on the suction portion 30, and a base plate 40 is arranged on the base plate 39 in a standing state. A cover 3 1 β with a notch honing pad 3 2 inside is installed on the upper part, and a driving source 3 3 is provided below, and the driving source 3 3 and the rotation axis of the notch honing pad 3 2 are provided. The tensioner is provided with a belt 41. On the other hand, a connecting member 42 is provided on the base plate 39. A steel cable 4 3 is connected to the connecting member 4 2 * The steel cable 4 3 is connected to a pulley 4 4 provided on the machine. A counterweight 4 5 is suspended. Therefore, with the counterweight 4 5, the base plate 3 9 is moved along the main shaft 3 8. The notch honing pad 3 2 of the base plate 40 of the base plate 3 9 is crimped. The notch of the wafer W which is attracted to the suction plate 36. The reference numeral 4 6 is an air cylinder for moving the base plate 3 9 which resists the weight 4 5. The air cylinder 46 can move the movable part to a position away from the notch. Two notch honing devices 22 are provided on the notch honing part 20 with the wafer transfer part 21 interposed therebetween. The notch honing device 2 2 is a three-claw member 2 3 for supplying wafers, and has claws 2 4 which hang down below. In FIG. 3, it is shown along the first— I! 丨 丨 1111 48 ^ · ί II order · 11111 ! " 5 ^ {Please read the note on the back first Please fill in this page for the matters needing attention.) This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 cm) -8- A7 415880 B7___ V. Description of the invention (6) View from line C-C of Figure 1 Status "(Please read the notes on the back before filling this page) The above claws 2 and 4 have three claws. When holding the wafer w ', one claw will enter the notch of the above wafer, and the other two The claw pushes the peripheral end surface of the wafer. In addition, the claws can be held and expanded by the driving source, and when held, the rotation of the wafer can be prevented by the position of a claw in the notch. Also | The claws 2 and 4 can be raised and lowered by a driving source, and can be moved in the X direction and can be rotated freely while maintaining a horizontal state. When moving in the X direction, they can be respectively shown in Figure 4 Position above the suction plate 36 of the notch honing devices 22, 22. The operation of the notch honing device 22 constructed as described above will be described below. First of all, the articulated arms 1 3 of the conveying member 14 of the supply section 10 described later are moved to the wafer transfer section 2 1, 2 1 while the wafer is mounted thereon. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Then, the claws 2 and 4 of the three-claw member 23 hold the wafer and transport them to the suction portion 30, and shift to the suction plate 3 6-so that the base plate 3 9 is weighted by the weight when the cylinder 4 6 does not operate. 4 5 moves along the main axis 38, and the notch honing pad 32 provided on the substrate 40 of the base plate 39 is pressed against the wafer W held by the suction plate 36. Notch a too. Then, as described above, the notch honing pad 3 2 protruding from the cover 31 is pushed against the notch a, and the driving source 3 3 is started at the same time, so the driving force of the driving source 3 3 is transmitted through the belt 41. In the notch honing pad 3 2 ′, the state of the notch honing pad 3 2 abuts on the notch a of the wafer W and starts from the state of -9- This paper size applies the Chinese National Standard (CNS) A4 specification ( 210x297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 415880 A7 ___B7______ 5. Description of the invention (7) Rotation. During this rotation, as shown in FIG. 13, since the notch honing pad 32 has a certain degree of elasticity, it bulges during the rotation and uses the abutment portion X of the notch a as a boundary, and The part on the side of the rotation direction is sufficiently accessible to the notch a, and the part on the side before the rotation direction is displaced to the direction away from the notch a. In other words, the notch honing pad 3 2 uses the abutting part X of the notch a as the boundary, and the side of the rotation direction is bulging, and the part on the front side is concave, so the notch a is often Good honing abutment is next to it. Under these conditions, since the above-mentioned notch honing pad 32 can drive forward and reverse rotation, the notch a can be well honed even if no part is involved. In detail, the notch a provided on the wafer W is viewed from a plane, that is, the entrance side is approximately the same width as the thickness of the notch honing pad 32, and the width is narrower and narrower as it enters the inside. Since the notch honing pad 32 can perform forward rotation and reverse rotation as described above, any part of the notch a can be honed reliably and uniformly. The above-mentioned driving source 3 3 may be a driving source which has reversibility of forward rotation and reverse rotation itself, or reversible between the notch honing pads 3 2 which are rotated through the belt 41. The possible mechanism may be forward rotation and reverse rotation. ≫ Next, the supply unit 10 for supplying wafers to the notch honing unit 20 configured as described above will be described. That is, as shown in FIG. 12, since the wafer W is stacked inside to accommodate this paper, the standard of China National Standards (CNS) A4 (210 χ 297 public love) is applied -10- ----- -------- Installation -------- Order --------- Line (Please read the precautions on the back before filling this page) A7 415880 B7____ 5. Description of the invention (8 ) Two boxes 11, 1 1, and an arrayer 12 for sequentially arranging the wafers W in the box 11 so that the notches formed on the peripheral surface become a certain position, and the above-mentioned boxes 11 The wafer is transferred to the aligner 12, and at the same time, the aligned wafers taken out from the aligner 12 are transported to the notch honing process by the transport member 14 equipped with the articulated arm 13. The two boxes 11, 11 and the arranger 12 are placed on the mounting table 1 10, while the conveying member 14 is configured to be movable along the mounting table 110 by the robot 1 1 1 . Therefore, the above-mentioned conveying member 14 can be reciprocated between the solid line position shown in the figure and the position of the two-point chain link line, and has two articulated arms 1 3, 1 3 equipped with a bifurcated portion 15 at the front end. A wafer W is placed on each of the two forks 15 of the transport member 14, and the wafer W may be transported as the multi-joint 13 expands and contracts. The revolving range of the bifurcated portion 15 shown by the circle system shown by the two-point chain link line on the outer side of the conveying member 14 is also described above. Furthermore, the arrayer 12 is, for example, Japanese Patent Publication No. 2 7 2 9 As shown in JP 2 9 7, the wafer W carried by the multi-joint arm 13, the bifurcated portion 15 of the transport member 14, and the multi-joint of the notch provided in the peripheral portion of the wafer W is received. The two fork portions 15 of the arms 13 are aligned in a predetermined position. Therefore, the transporting member 14 takes out the wafer W from the cassette 11 and transports it to the arrayer 12, and receives the wafers W aligned in the arrayer 12 and transfers them to the wafer transfer sections 21 and 21. The transfer sections 21 and 21 correspond to the notches I ----- I--! To be described later _ I ----- order I — I — I _ (I read the notes on the back and fill in the transcript first Page) Consumption cooperation between employees of the Intellectual Property Bureau of the Ministry of Economic Affairs and Du Duan This paper is applicable to the standard + National Standard (CNS) A4 specification (210 * 297 public *) Description of the invention (9) The notch honing device 22 of the honing section 20 is formed at two places as shown by a two-point chain link line. On the other hand, an end face honing portion 50 for honing the peripheral surface of the wafer is provided continuously to the notch honing portion 20. This end face honing part 5 is a continuous arrangement in the central part in the γ direction. At the same time, it is arranged in a series and consists of two conveying members 5 1 with two articulated arms with the possibility of reciprocating movement in the Y direction. , 5 2, and peripheral honing devices 5 3 which are arranged in series with the two conveying members 5 1 and 5 2 facing each other, respectively, in the γ direction. A wafer reversing unit 80 is also provided. The wafer reversing member 80 is movable along the rails 8 2 provided on the upper surface of the end honing portion 50 and is movable in the Y direction. At the same time, it has a wafer reversing mechanism capable of reversing the wafer. 8 1. The wafer reversing mechanism 81 accepts the wafers placed on the articulated arms 13 of the above-mentioned one of the transport members 51 and the wafers placed on the articulated arms 1 3 of one side are moved to the other side. The suction plate 5 4 on the other side of the surface honing device 5 3, and the wafer on the other side of the articulated arm 1 3 are handed over to the suction on the other side of the peripheral honing device 5 3. The plate 5 4 also. After the honing of the end surface of the peripheral honing device 5 3 on the supply side 10, the wafers on the suction pad 54 are raised, and the wafer is reversed at the same time, and is accepted on the other side. The two suction pads 54 of the grinding device 5 3 are honed by the circumferential end surface of the other side honing device 53 and transferred to the two articulated arms of the other conveying member 52. 111111111111 (* —11) 11— «ιιιι — lla · " · Please read the unintentional matter on the back before filling in this page) This paper size applies to the national standard of S < CNS) A4 (210 X 297 mm) -12- 415880 A7 B7 Printed and produced by the Intellectual Property Bureau of the Ministry of Economic Affairs, Industrial and Consumer Cooperatives. 5. Description of the invention (10) The two transportation components 5 1 and 5 2 arranged in the above-mentioned central part continuously in the γ direction are The transport member 14 used in the supply unit 10 has the same configuration. On the other hand, the above-mentioned peripheral honing device 5 3 has a pair of honing drum wheels 5 5 each having a drum pad 5 5 a wound around the central portion thereof. Wafer crimping mechanisms 60 are respectively arranged in the Y direction. At this time, each wafer crimping mechanism 60 is arranged in a direction (A direction) that is inclined at a predetermined angle with respect to the Y direction when viewed from a plane (refer to FIG. 10), and is also arranged on the upper part thereof. The suction pad 5 which can swing in the vertical direction between the horizontal state and the tilted state. This wafer crimping mechanism 60 is shown in FIG. 7, FIG. 8, and FIG. 9. The first body 61 of the chuck 5 4 for holding the wafer and the second body 6 3 of the first body 6 1 swingably held about the support shaft 62 as a center, and the second body 63 is The support mechanism 65 supports movement in the radial direction of the turntable 64, that is, supports the movement in the direction of the honing drum wheel 5 5 and the movement in the radial direction orthogonal to the honing drum wheel 5 5 is adjacent to the connection The lines at the centers of the two honing drums 55 are parallel. The above-mentioned support mechanism 65 is provided with a first track 67 which is provided on a platen fixed to the lower surface of the turntable 64 and connected to and away from the honing drum 5 5 (direction A), and A first sliding member 68, which can move freely along this first rail 67, and a second book which is provided above the first sliding member 68 in a direction (direction B) orthogonal to the first rail 67. Paper size applies to Chinese national standard (CNS > A4 specification (210 X 297 mm) -13- III tf ί nn »^ i ί- * ϋ i« nnnt— · 1 nnnnnnf line (Please read the precautions on the back before «. 'Write this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 415880 a? __B7_ V. Description of the invention (11) Track 6 9 and the second sliding member 7 0 that can move along the second track 6 9 * The second body 6 3 p is mounted on the upper part of the second sliding member 70 with a foot 7 1, and a pulley 7 2 is mounted below the platen 6 6. The pulley 72 is stretched. A steel cable 72a is provided. The rear end of the steel cable 72a is fixed to the arm 7 3 extending downward from the first sliding member 68 and the front end of the steel cable 7 2 a. A counterweight 7 4 is hoisted. As a result, the counterweight 7 4 and the first sliding member 6 8 are always given potential energy (or be plucked) toward the honing drum 5 5 on the first track 6 7. 2 A sliding cable 9 2 is mounted on the sliding member 7 0 via a pulley 90 and a weight 9 1 is attached to the end of the sliding member 7 0. The suction disc 5 4 is pushed by the weight 9 1 to cause suction. The wafers are configured to be evenly abutted against the two honing drums 5 5 and 55. This is for the rotating honing drums 55 and 55 and for the wafers to abut A user who slightly rotates and generates unevenness due to the non-uniform abutment force on the two honing drums 55 and 55. An air cylinder 7 5 is installed below the above platen 6 6, and this air cylinder 7 The front end of the 5 rod 7 5 a is abutted against the arm 7 3, so that the air cylinder 7 5 makes the first sliding member 6 8 system resist the weight 7 4 and pushes it against the 硏The structure of the grinding wheel 5 5 in the direction in which it leaves is 6 As shown in FIG. 9, the above-mentioned suction plate 5 4 is provided with a plurality of suction holes on this surface, and these suction holes are provided through the first 1 body 6 1 and 2 The mouth of the body 63 and the piping 77 are connected to a vacuum source (not shown). 1 !!! Installation -------- Order 1111! Line (Please read the precautions on the back before filling this page ) This paper size is in accordance with China National Standard (CNS) A4 specification (210 X 297 mm) -14-415880 A7 B7 V. Description of the invention (12) The suction plate 5 4 is set on the first body 6 1 When it is honing, it is rotated at a very slow speed. In addition, as described above, the first body 6 1 may be a state where the support shaft 6 2 is centered and the suction plate 54 is oriented horizontally by the rotary actuator 7 8 and the tilted state may be used. swing. In the horizontal state, the honing drum 55 leaves the handover or acceptance of the wafer. Therefore, in the state that the suction plate 54 is inclined, the two honing drum wheels 5 5 are crimped and contacted by the force of the weight 7 4 respectively, that is, the crimping contacts are wound on the two honing drums. 5 5 的 轮 轮 垫 5 5 a Because the wafer is simultaneously honing two places on the peripheral surface. Furthermore, the first body 61 is retracted in the direction away from the honing drum 55 by the air cylinder 75 and the weight 7 4 when the first body 61 is in a non-honed position. The honing drum 5 5 is configured to be rotatable by a driving source 76 provided on a honing machine. When honing the wafer W mounted on the chuck 5 4, The honing agent (slurry) can be sprayed so that the honing agent can be recovered for reuse. As shown in Figs. 2 and 6, the wafer reversing member 80 is provided so as to be movable above the two peripheral honing devices 53 on one side as described above. That is, the wafer reversing member 80 has a rail 8 2 provided in a Υ direction above the two peripheral honing devices 5 3 on one side, and the rail 8 2 is mounted on the rail 8 2 while honing. The drum 5 5 faces each other and has a pair of suction pads 5 4 corresponding to one of the intervals of the wafer reversing mechanism. The paper size applies the Chinese National Standard (CNS) A4 specification (210 * 297 mm) -15 -< Please fill in this page first on the back of Mt *. * Father's item > Install --------- Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs
« n |> n n n I I «1 i n ϋ ϋ ϋ ϋ ϋ ϋ ^ ϋ I n ϋ ϋ H ·1 ^1 n _ _ I A7 415880 B7____ 五、發明說明（13 ) 8 1° (锖先閱讀背面之法意事項再填寫本頁> 此晶圓反轉構件8 0之晶圓反轉機構8 1係分別據於 對應於挾著周面硏磨裝置5 3之硏磨鼓輪5 5而互相面向 之水平狀態之吸著盤5 4之位置之上方。 並且晶圓反轉機構81乃以驅動源而可能握持晶圓W ，且在垂直方向可以旋轉。具有：以握持晶圓之狀態而旋 轉就可以使晶圓之表面與背面反轉之由一對之彎狀臂所成 之彎狀爪部8 3 ·及以氣缸等之構件而使此彎狀爪部8 3 而可以昇降之昇降臂8 4，以及固定有該昇降臂8 4之移 動機台8 5。 上述移動機台8 5係藉於它之驅動源來可以沿著上述 軌道8 2而可以移動於Υ方向。 所以如第2圖所示，該分別備有彎狀爪部8 3之晶圓 反轉機構81 (81a，81b)乃，從供給部10側之 周面硏磨裝置53之挾著硏磨鼓輪55而互相面向之水平 狀態之吸著盤54、 54之上方而沿著配設於上方之軌條 8 2可移動於Y方向而到達於另一周面硏磨裝置5 3之挾 著硏磨鼓輪55、 55而互相面向之水平狀態之吸著盤 經濟部智慧財產局員工消費合作社印.製 54、 54之上方也* 此時，兩周面硏磨裝置5 3之吸著盤5 4中對向於供 給部1 0側之吸著盤5 4 a之上方者係同一之晶圓反轉機 構81 (81a)，所以兩面硏磨裝置53之吸著盤54 中之對向於供給部1 0側之相反側之吸著盤5 4 b之上方 者也是相同之晶圓反轉機構81 (81b) » -16- 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） A7 415880 _B7_ 五、發明說明（14 ) 由而對於兩周面硏磨裝置5 3之供給部1 0側之吸著 盤5 4 a ，及對向於供給部1 〇側之相反側之吸著盤 5 4 b上即分別供給同一之晶圓W也。 又，上述軌條8 2及晶圓反轉構件8 0乃也配設於， 以上述二個之運送構件51、 52爲界而對向地配設之二 個周面硏磨裝置5 3之上方也。 由而端面硏磨部50乃構成：以運送構件51、52 爲共用而在Y方向連續之由兩個周面硏磨裝置5 3及晶圓 反轉構件8 0所形成之二組之端面硏磨部5 0也。 又配設於上述端面硏磨部5 0而配設有可收容硏磨後 之晶圓之排出部1 0 0 » 此排出部1 0 0乃配設有二個與設於上述供給部1 0 之盒11相同之盒11。而此盒11之插入方向前側即被 封閉，阻止更進一步之插入。 又配設該各盒11之部位係藉由配設於上述端面硏磨 部5 0之運送構件5 2之兩多關節臂而可收容硏磨後晶圓 W之位置。 再者，上述兩盒1 1係安裝於基台1 0 1同時此基台 1 0 1係固定於由驅動源1 0 2而於水平位置與垂直位置 之間上下方向地可以擺動之基板1 0 3之上面，並且此基 板1 0 3之成爲垂直位置時設於上面之盒1 1之可以沒於 水地在排出部1 0 0設有水之儲存部1 0 4 (參照第2圖 )。 又由於上述兩盒11之晶圓之插入方向前側乃阻止進 ^1 ϋ I I If > n ·1 n i a n —I. I I —.1 (請先閲讀背面之Λ意事項再填寫本頁) 經濟部智慧財產局具工消费合作社印製 本紙張尺度適用中圉國家標準（CNS>A4規格（210Χ297公釐） -17- 415880 A7 B7_ 五、發明說明（15 ) (請先閲讀背面之主意事項再填寫本頁> —步以上之晶圓地被閉塞，所以盒1 1之插入方向變爲前 側朝下地以驅動源1 0 2而來迴旋基板1 0 3而沒入於水 中時，盒1 1內之晶圓也不會有溜出來之虞。 在此盒11之沒入於水中時|收容於其內部之硏磨後 之晶圓乃成爲可沒入於水中，不受水之阻抗作用地順暢地 沒入於水中，同時在沒入於水中及提起時得由水接受洗滌 該表面之作用。 下面說明如上述構成之端面硏磨裝置之動作。 從以本發明之盒水平保持機構而確實的載置於載置台 110上之盒11 ，以運送構件14而運出晶圓W，傳遞 於排列器1 2，而在此排列器1 2上以凹口能整頓於一定 位置地實施晶圓W之定位。 此後，運送構件1 4之多關節臂1 3係運送晶圓w而 反轉晶圓W之前後，另一方面三爪構件2 3之爪部2 4係 握持晶圓而移交於凹口硏磨裝置2 2之吸著盤3 6，而在 凹口硏磨裝置2 2來實施凹口之硏磨》 關於此凹口之硏磨即如前述，凹口硏磨裝置2 2之凹 經濟部智慧財產局具工消费合作社印製 口硏磨用墊3 2實施正旋轉及逆旋轉而確實的硏磨凹口也 〇 又，完成凹口之硏磨之晶圓即由運送構件5 1運送於 周面硏磨裝置5 3之所互相面向之吸著盤5 4，於是於周 面硏磨裝置5 3以二個硏磨鼓輪5 5來硏磨端面。 又，此硏磨乃於對於水平而在垂直方向有規定角度傾 斜之狀態來實施，所以首先以前面之周面硏磨裝置5 3來 -18- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 415880 a? ___B7_ 五、發明說明（16 ) 硏磨，此後晶圓即被運送至下一個周面硏磨裝置5 3 » 並且在前面之周面硏磨裝匱5 3與下一個周面硏磨裝 置5 3之間之上方設有晶圓反轉構件8 0，所以在前面之 周面硏磨裝置5 3被硏磨之晶圓即以晶圓反轉構件8 0來 反轉，運送至下一個周面硏磨裝置5 3再度被硏磨。即晶 圓W之端面乃以傾斜狀態地二次推壓於硏磨鼓輪5 5而被 硏磨也。 在此硏磨時，由於晶圓之端面乃.己被經削面加工，所 以在表面側之硏磨時，端面之中央部及表面側之削面端面 被硏磨，又在背面側之硏磨時端面之中央部及背面側之被 削面加工之端面即分別的被硏磨也。 於是，分別經表面、背面硏磨之晶圓W即以運送構件 5 2之臂而運送於排出部1 〇 0，收容於位於該處之盒 1 1也。 所以在排出部1 0 0之盒1 1之內部乃以疊層狀態地 收容被硏磨了凹口及周端面之晶圓，端面硏磨裝置上之硏 磨作業就告完成。 經濟部智慧財產局員工消费合作社印製 (發明之效果） 本發明乃如上述地予以構成，所以對供給部所供給之 晶圓施予硏磨凹口時，由於凹口硏磨用墊乃可實施正旋轉 及逆旋轉，所以由凹口硏磨用墊之硏磨狀態乃得於凹口之 全面可以確保均一性。 又做爲使凹口硏磨用墊正旋轉及逆旋轉之手段而採用 • 19 - (請先闉讀背面之沒意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 415880 B7_ 五、發明說明（17 ) 了可以使驅動源本身可以正逆旋轉之可逆馬達，而可以確 實的使凹口硏磨用墊正旋轉及逆旋轉也。 <請先閲讀背面之注意事項再填寫本頁> 再者，如使用單方向旋轉之驅動源時，也由於設置了 旋轉方向之切換機構，就可以確實的使凹口硏磨用墊正旋 轉及逆旋轉等等 具有顯著之效果。 圖面之簡單說明 第1圖表示採用本發明之凹口硏磨裝置之凹口硏磨方 法之端面硏磨裝置之全體之槪略平面圖。 第2圖表示端面硏磨裝置之全體之槪略正面圖。 第3圖表示沿第1圖之C_C線觀視之槪略圖。 第4圖表示凹口硏磨裝置之槪略平面圖· / 第5圖表示凹口硏磨裝置之槪略正面圖。 第6圖表示沿著第1圖之D — D線之槪略圖。 第7圖表示配置於端面硏磨裝置之周面硏磨裝置之槪 略正面圖。/ 經濟部智慧財產局員工消费合作社印製 第8圖表示配置於端面硏磨裝置之周面硏磨裝置之槪 略側面圖。/ 第9圖表示配置於端面硏磨裝置之遇面硏磨裝置之吸 著部之近傍之槪略正面圖。/ 第1 0圖表示配置於端面硏磨裝置之端面硏磨部之一 側之槪略平面圖*广 第11圖表示配置於端面硏磨裝置之端面硏磨部之一 -20- 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） 415880 A7 B7 五、發明說明（18 ) 側之槪略正面圖。 第12圖表示供給部之槪略平面圖。 第13圖表示對於晶圓之凹口有凹α硏磨用墊抵接之 狀態之槪略說明圖 經濟部智慧財產局員工消費合作社印製 主要元件對照表 10 供給部 11 盒 12 排列器 13 多關節臂 14、 51、 52 運送構件 15 二叉部 2 0 凹口硏磨部 2 1 晶圓移交部 2 2 凹口硏磨裝置 2 3 三爪構件 2 4 爪部 29.82 軌條 3 0 吸著部 3 1 蓋 32 凹口硏磨用墊 33、 76、 102 驅動源 3 4 硏磨部 3 5 吸著孔 ---------------------訂 i—— — —— — (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -21 - 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（19〉 36、 54(54a、 54b) 吸著盤 3 7 機台 3 8 主軸 3 9 基盤 40,103 基板 -------------裝--------訂---------線 <請先Μ讀背面之注意事項再填窵本頁) 4 1 皮 帶 4 2 連 結構 件 4 3 , 7 2 a - 9 2 鋼索 4 4、 ,7 2、 9 0 帶 輪 4 5 、 7 4、 9 1 配 重 4 6 、 7 5 氣 缸 4 6 ； a 動作 部 5 0 端 面硏 磨 部 5 3 週 面硏 磨 裝 置 5 5 硏 磨鼓 輪 5 5 ： a 鼓輪 墊 6 0 晶 圓壓 接 機 構 6 1 第 1體 6 2 支 軸 6 3 第 2體 6 4 旋 轉台 6 5 支 持機 構 6 6 台 板 6 7 第1軌道 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公芨） -22- 經濟部智慧財產局員工消費合作社印製 415880 a? 五、發明說明（2〇 ) 6 8 第 1 滑 動 構 件 6 9 第 2 軌 道 7 0 第 2 滑 動 構 材 7 1 台 腳 7 3 臂 7 5 ί 3 桿 7 7 配 管 7 8 旋 轉 致 動 器 8 0 晶 圓 反 轉 構 件 8 1 ( 8 1 a , 8 1b) 晶圓反轉機構 83 彎狀爪部 8 4 昇降臂 85 移動機台 1 0 0 排出部 10 1 基台 104 貯溜部 110 載置台 111 機器人 w 晶圓 a 凹口 X 抵接部 — — — — — — — — — — — — J · I I ^* 111111 ^^^ (請先閱讀背面之泫意事項再填寫本頁》 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公芨） -23 -«N | > nnn II« 1 in ϋ ϋ ϋ ϋ ϋ ϋ ^ ϋ I n ϋ ϋ H · 1 ^ 1 n _ _ I A7 415880 B7____ 5. Description of the invention (13) 8 1 ° (锖 Read the first Please fill in this page for legal matters > The wafer reversing mechanism 8 1 of this wafer reversing member 80 is facing each other according to the honing drum wheels 5 5 corresponding to the peripheral honing device 5 3. The horizontal state is above the position of the chuck 54. And the wafer reversing mechanism 81 is capable of holding the wafer W by the driving source and can be rotated in the vertical direction. It has: in the state of holding the wafer The curved claws 8 3 formed by a pair of curved arms can be reversed by rotating the front and back surfaces of the wafer, and the curved claws 8 3 can be raised and lowered by a member such as a cylinder. The arm 8 4 and the moving machine 8 5 to which the lifting arm 8 4 is fixed. The above moving machine 8 5 can move along the above-mentioned track 8 2 by its driving source, so it can be moved in the direction of Υ. As shown in FIG. 2, the wafer reversing mechanisms 81 (81a, 81b) each provided with curved claw portions 83 are honing from the peripheral surface honing device 53 on the supply unit 10 side. The wheels 55 are above the suction plates 54 and 54 in a horizontal state facing each other, and can be moved in the Y direction along the rails 8 2 arranged above to reach the other side honing device 5 3 Drums 55, 55 and horizontally facing suction cups are printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Also above 54 and 54 * At this time, the suction cups 5 3 of the two-side honing device 5 3 The upper side of the chuck 5 4 a facing the 10 side of the supply unit is the same wafer reversing mechanism 81 (81a), so the chuck 54 of the double-side honing device 53 faces the supply unit. 1 The opposite side of the suction plate 5 4 b is also the same wafer reversing mechanism 81 (81b) »-16- This paper size applies to China National Standard (CNS) A4 (210 * 297 mm) ) A7 415880 _B7_ V. Description of the invention (14) Therefore, the suction plate 5 4 a on the supply side 10 side of the two-side honing device 5 3 and the suction on the opposite side of the supply side 10 side The same wafer W is also supplied to the landing plate 5 4 b. The rails 8 2 and the wafer reversing member 80 are also disposed on the two wafers. The members 51 and 52 are also arranged above the two peripheral honing devices 53 arranged opposite to each other. As a result, the end face honing unit 50 is constituted by: the conveying members 51 and 52 are shared and continuous in the Y direction. There are also two sets of end face honing parts 50 formed by two peripheral honing devices 53 and a wafer reversing member 80. The end face honing parts 50 are also arranged on the end face honing part 50 and can be accommodated. The discharged part 100 of the ground wafer »The discharging part 100 is provided with two boxes 11 which are the same as the boxes 11 provided in the supply section 10 described above. The front side of the insertion direction of the box 11 is closed to prevent further insertion. The positions where the boxes 11 are arranged are positions where the honing wafers W can be accommodated by the two articulated arms of the transport member 52 arranged on the end face honing section 50. Furthermore, the above two boxes 11 are mounted on a base 1 0 1 and the base 1 1 1 is fixed on a base plate 1 0 which can be swung up and down between a horizontal position and a vertical position by a driving source 1 2 3, and the box 1 1 provided on the upper surface when the substrate 10 3 is in a vertical position, a water storage portion 10 4 may be provided in the discharge portion 100 (see FIG. 2) submerged. And because the wafers in the two boxes of 11 are inserted in the front side, they are blocked from entering ^ 1 ϋ II If > n · 1 nian —I. II —.1 (Please read the Λ notice on the back before filling this page) Ministry of Economy The paper size printed by the Intellectual Property Bureau's Industrial Cooperative Cooperative applies the Chinese National Standard (CNS > A4 specification (210 × 297 mm) -17- 415880 A7 B7_ V. Description of the invention (15) (Please read the idea on the back before filling This page > —The wafer land above step is blocked, so the insertion direction of the box 1 1 is changed to the front side down to drive the source 1 0 2 and back and forth the substrate 1 0 3 and submerged in the water, inside the box 1 1 There is no risk that the wafer will slip out. When the box 11 is submerged in water | The honing wafer contained in it will become submersible in the water, and it will be smooth without the resistance of water. The ground is immersed in water, and the surface must be washed by water when immersed in water and lifted. The operation of the end face honing device configured as described above will be described below. It is confirmed from the horizontal holding mechanism of the box of the present invention. The box 11 is placed on the mounting table 110 to carry the member 14 and The wafer W is delivered to the aligner 12 and the alignment of the wafer W can be performed at a certain position on the aligner 12 by the notch. Thereafter, the articulated arms 13 of the transport member 14 are transported. The wafer w is reversed before and after the wafer W. On the other hand, the claw portion 24 of the three claw member 23 is holding the wafer and transferred to the suction plate 3 6 of the notch honing device 22, and the concave The mouth honing device 22 is used to implement the honing of the notch. As for the honing of the notch, as described above, the notch honing device 2 2 of the concave of the Ministry of Economic Affairs, Intellectual Property Bureau, Tooling and Consumer Cooperatives, prints the pad for honing. 3 2 The honing notches that are positively rotated and reversed are also reliable. The wafers that have been honing the notches are transported by the conveying member 51 to the peripheral honing device 53 and sucked toward each other. The disc 5 4 is then honing the end surface with two honing drums 55 in the peripheral honing device 53. The honing is carried out in a state inclined at a predetermined angle in the vertical direction to the horizontal, so First use the front surface honing device 5 3 to -18- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 415880 a? ___B7_ 5. Description of the invention (16) Honing, after which the wafer is transported to the next peripheral honing device 5 3 »and the front peripheral honing device 5 3 and the next peripheral honing device A wafer reversing member 80 is provided above 5 3, so the honing wafer on the front peripheral honing device 5 3 is reversed by the wafer reversing member 80 and transported to the next one. The peripheral honing device 5 3 is honed again. That is, the end face of the wafer W is pressed by the honing drum 5 5 in a tilted state and is honed. During honing, since the end face of the wafer has been machined, the central part of the end face and the end face of the facet side are honed during honing on the surface side, and honing on the back side during honing. The central portion of the end surface and the end surface to be machined on the back side are respectively honed. Then, the wafer W, which has been honed on the front surface and the back surface, is transported to the discharge unit 100 by the arm of the transport member 52, and is stored in the box 11 located there. Therefore, inside the box 1 1 of the discharge section 100, the wafers having the honing notch and the peripheral end surface are housed in a stacked state, and the honing operation on the end surface honing device is completed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (Effects of Invention) The present invention is structured as described above. Therefore, when a honing notch is applied to a wafer supplied by the supply unit, the notch honing pad is acceptable. The forward rotation and reverse rotation are implemented, so the honing state of the notch honing pad is obtained from the whole of the notch to ensure uniformity. It is also used as a means to make the notch honing pad rotate forward and reverse. • 19-(Please read the unintentional matter on the back before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 specification ( (210 X 297 mm) A7 415880 B7_ V. Description of the invention (17) A reversible motor that enables the drive source to rotate forwards and backwards, and can positively and negatively rotate the notch honing pad. < Please read the precautions on the back before filling this page > Furthermore, when using a drive source with unidirectional rotation, it is also possible to positively correct the notch honing pad by using the rotation direction switching mechanism. Rotation and counter-rotation have significant effects. Brief Description of the Drawings Fig. 1 is a schematic plan view of the entire end face honing apparatus using the notch honing method of the notch honing apparatus of the present invention. Fig. 2 is a schematic front view of the entire honing apparatus of the end face honing device. FIG. 3 is a schematic view of the view taken along the line C_C in FIG. 1. Fig. 4 is a schematic plan view of the notch honing device. Fig. 5 is a schematic front view of the notch honing device. Fig. 6 shows a schematic drawing along the line D-D of Fig. 1. Fig. 7 is a schematic front view of the honing device of the peripheral honing device arranged on the end honing device. / Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 8 shows a schematic side view of the peripheral honing device arranged on the end honing device. / Fig. 9 is a schematic front view of the vicinity of the suction portion of the face honing device arranged on the end face honing device. / Fig. 10 shows a rough plan view of one side of the end face honing device disposed on the end face honing device. * Fig. 11 shows one of the end face honing sections disposed on the end face honing device. China National Standard (CNS) A4 specification (210 * 297 mm) 415880 A7 B7 5. The front view of the invention (18). Fig. 12 is a schematic plan view of the supply unit. Figure 13 shows a schematic illustration of the state of the abutting pads with recessed alpha honing pads on the wafers. The comparison table of the main components printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economy 10 Supply Department 11 Box 12 Arrayer 13 Multiple Articulated arm 14, 51, 52 transport member 15 two-fork part 2 0 notch honing part 2 1 wafer transfer part 2 2 notch honing device 2 3 three claw member 2 4 claw part 29.82 rail 3 0 suction part 3 1 Cover 32 Notch honing pad 33, 76, 102 Drive source 3 4 Honing part 3 5 Suction hole ----------------------- Order i —— — —— — (Please read the precautions on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -21-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives System A7 B7 V. Description of the invention (19> 36, 54 (54a, 54b) Suction disk 3 7 Machine 3 8 Spindle 3 9 Base plate 40,103 Substrate ------------------- ----- Order --------- Thread < Please read the notes on the back before filling this page) 4 1 Belt 4 2 Linking member 4 3, 7 2 a-9 2 Steel cable 4 4, 7 2 9 9 Pulley 4 5 7 4, 9 1 Counterweight 4 6, 7 5 Cylinder 4 6; a Actuating part 5 0 End face honing part 5 3 Peripheral honing device 5 5 Honing drum 5 5: a Drum pad 6 0 Wafer crimping Mechanism 6 1 1st body 6 2 Pivot shaft 6 3 2nd body 6 4 Rotary table 6 5 Supporting mechanism 6 6 Platen 6 7 1st track This paper size applies Chinese National Standard (CNS) A4 specification (210 * 297 cm) ) -22- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 415880 a? V. Description of the invention (20) 6 8 1st sliding member 6 9 2nd track 7 0 2nd sliding member 7 1 stand 7 3 arm 7 5 ί 3 rods 7 7 Piping 7 8 Rotary actuator 8 0 Wafer reversing member 8 1 (8 1 a, 8 1b) Wafer reversing mechanism 83 Curved claw 8 8 Lifting arm 85 Moving machine 1 0 0 Discharge section 10 1 Base 104 Storage section 110 Mounting table 111 Robot w Wafer a Notch X Abutment section — — — — — — — — — — — — J · II ^ * 111 111 ^^^ (Please first Read the notes on the back and fill in This page "This paper scale applicable Chinese National Standard (CNS) A4 size (210x297 public striata) -23--