TW404148B - Tape carrier package for use in liquid crystal display modules - Google Patents
Tape carrier package for use in liquid crystal display modules Download PDFInfo
- Publication number
- TW404148B TW404148B TW087113039A TW87113039A TW404148B TW 404148 B TW404148 B TW 404148B TW 087113039 A TW087113039 A TW 087113039A TW 87113039 A TW87113039 A TW 87113039A TW 404148 B TW404148 B TW 404148B
- Authority
- TW
- Taiwan
- Prior art keywords
- base film
- lines
- lcd panel
- line
- carrier package
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019970079902A KR100476524B1 (ko) | 1997-12-31 | 1997-12-31 | 엘씨디모듈용테이프캐리어패키지 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW404148B true TW404148B (en) | 2000-09-01 |
Family
ID=19530230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087113039A TW404148B (en) | 1997-12-31 | 1998-08-07 | Tape carrier package for use in liquid crystal display modules |
Country Status (4)
Country | Link |
---|---|
US (1) | US6319019B1 (ja) |
JP (1) | JP3330547B2 (ja) |
KR (1) | KR100476524B1 (ja) |
TW (1) | TW404148B (ja) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100523275B1 (ko) * | 1998-08-07 | 2006-03-20 | 삼성전자주식회사 | 액정표시장치용 테이프 캐리어 패키지 |
KR20000021829A (ko) * | 1998-09-30 | 2000-04-25 | 윤종용 | 엘씨디 모듈용 테이프 캐리어 패키지 |
KR100574278B1 (ko) * | 1998-11-27 | 2006-09-22 | 삼성전자주식회사 | 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈 |
TW550428B (en) * | 1999-07-12 | 2003-09-01 | Nec Lcd Technologies Ltd | Flat panel display device and manufacturing method thereof |
JP2001205566A (ja) * | 2000-01-26 | 2001-07-31 | Noritake Co Ltd | 樹脂含浸ビトリファイド砥石およびその製造方法 |
KR100381052B1 (ko) * | 2000-02-23 | 2003-04-18 | 엘지.필립스 엘시디 주식회사 | 윈도우를 가지는 테이프 케리어 패키지 및 이를 접속한액정표시장치 |
KR100381047B1 (ko) * | 2000-05-24 | 2003-04-18 | 엘지.필립스 엘시디 주식회사 | 접합부가 분할된 테이프 캐리어 패키지와 이를 이용한액정표시장치 및 액정표시장치의 미스얼라인 보정방법 |
JP3756418B2 (ja) * | 2001-02-28 | 2006-03-15 | 株式会社日立製作所 | 液晶表示装置及びその製造方法 |
KR100391843B1 (ko) * | 2001-03-26 | 2003-07-16 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치의 실장 방법 및 그 구조 |
JP4742441B2 (ja) * | 2001-04-16 | 2011-08-10 | 日本電気株式会社 | フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法 |
KR100389022B1 (ko) * | 2001-05-23 | 2003-06-25 | 엘지.필립스 엘시디 주식회사 | 액정표시장치를 이용한 휴대 정보 단말기 |
JP3840180B2 (ja) * | 2002-12-26 | 2006-11-01 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
JP2005086098A (ja) * | 2003-09-10 | 2005-03-31 | Three M Innovative Properties Co | チップオンフレックス(cof)テープ |
US20070023877A1 (en) * | 2003-09-10 | 2007-02-01 | Hideo Yamazaki | Chip on flex tape with dimension retention pattern |
KR100637149B1 (ko) * | 2004-02-20 | 2006-10-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100615214B1 (ko) * | 2004-03-29 | 2006-08-25 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치 |
JP3915928B2 (ja) * | 2004-11-24 | 2007-05-16 | セイコーエプソン株式会社 | 電子部品及びその製造方法 |
TWI293708B (en) * | 2004-11-26 | 2008-02-21 | Innolux Display Corp | Liquid crystal display and flexible printed circuit using thereof |
JP4285484B2 (ja) * | 2005-01-24 | 2009-06-24 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置用基板、回路基板、実装構造体及び電子機器 |
JP2006301317A (ja) * | 2005-04-21 | 2006-11-02 | Hitachi Ltd | プラズマディスプレイモジュール |
JP4770295B2 (ja) * | 2005-06-30 | 2011-09-14 | ブラザー工業株式会社 | 配線基板 |
TWM280074U (en) * | 2005-07-13 | 2005-11-01 | Wintek Corp | Flexible printed circuit board |
US7742142B2 (en) * | 2005-08-09 | 2010-06-22 | Chunghwa Picture Tubes, Ltd. | Display and tape carrier package structure |
JP5148059B2 (ja) * | 2005-11-07 | 2013-02-20 | 株式会社ジャパンディスプレイセントラル | 液晶表示装置 |
JP4492544B2 (ja) * | 2006-01-17 | 2010-06-30 | ブラザー工業株式会社 | 回路基板の製造方法 |
DE602007007201D1 (de) * | 2006-04-07 | 2010-07-29 | Koninkl Philips Electronics Nv | Elastisch verformbare integrierte schaltung |
KR101292569B1 (ko) * | 2006-06-29 | 2013-08-12 | 엘지디스플레이 주식회사 | 액정표시소자 |
JP4806313B2 (ja) | 2006-08-18 | 2011-11-02 | Nec液晶テクノロジー株式会社 | テープキャリア、液晶表示装置用テープキャリア、及び液晶表示装置 |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8851356B1 (en) * | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US8011950B2 (en) | 2009-02-18 | 2011-09-06 | Cinch Connectors, Inc. | Electrical connector |
JP2010223690A (ja) * | 2009-03-23 | 2010-10-07 | Seiko Epson Corp | フレキシブル基板、並びに電気光学装置及び電子機器 |
US9553254B2 (en) * | 2011-03-01 | 2017-01-24 | Parker-Hannifin Corporation | Automated manufacturing processes for producing deformable polymer devices and films |
US20160172428A1 (en) * | 2014-12-11 | 2016-06-16 | Lg Display Co., Ltd. | Flexible display device with corrosion resistant printed circuit film |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2557385B1 (fr) * | 1983-12-23 | 1986-10-17 | Nozick Jacques | Connecteur electrique multipolaire et son procede de fabrication |
JPH0444148U (ja) * | 1990-08-20 | 1992-04-15 | ||
US5274195A (en) * | 1992-06-02 | 1993-12-28 | Advanced Circuit Technology, Inc. | Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
JPH0651331A (ja) * | 1992-08-04 | 1994-02-25 | Nec Corp | Lcdモジュール |
JP3011255B2 (ja) * | 1993-04-14 | 2000-02-21 | アルプス電気株式会社 | 液晶表示装置 |
JPH0837351A (ja) * | 1994-07-21 | 1996-02-06 | Amp Japan Ltd | フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板 |
JPH08160446A (ja) * | 1994-12-08 | 1996-06-21 | Hitachi Ltd | テープキャリアとその製造方法およびこのテープキャリアを用いた液晶表示装置 |
US5936850A (en) * | 1995-03-03 | 1999-08-10 | Canon Kabushiki Kaisha | Circuit board connection structure and method, and liquid crystal device including the connection structure |
US5975944A (en) * | 1996-06-28 | 1999-11-02 | The Whitaker Corporation | Connector for pitch spaced electrical cables |
KR200171894Y1 (ko) * | 1997-03-13 | 2000-03-02 | 윤종용 | 액정표시장치의 테이프 캐리어 패키지 |
US5924875A (en) * | 1997-07-01 | 1999-07-20 | Trw Inc. | Cryogenic flex cable connector |
-
1997
- 1997-12-31 KR KR1019970079902A patent/KR100476524B1/ko active IP Right Grant
-
1998
- 1998-08-07 TW TW087113039A patent/TW404148B/zh not_active IP Right Cessation
- 1998-10-09 JP JP28777798A patent/JP3330547B2/ja not_active Expired - Lifetime
- 1998-11-09 US US09/188,512 patent/US6319019B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6319019B1 (en) | 2001-11-20 |
KR100476524B1 (ko) | 2005-08-29 |
JP3330547B2 (ja) | 2002-09-30 |
KR19990059690A (ko) | 1999-07-26 |
JPH11204588A (ja) | 1999-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |