TW373117B - Laser work machine and method of fabricating liquid crystal display component by using this laser work machine - Google Patents
Laser work machine and method of fabricating liquid crystal display component by using this laser work machineInfo
- Publication number
- TW373117B TW373117B TW085111976A TW85111976A TW373117B TW 373117 B TW373117 B TW 373117B TW 085111976 A TW085111976 A TW 085111976A TW 85111976 A TW85111976 A TW 85111976A TW 373117 B TW373117 B TW 373117B
- Authority
- TW
- Taiwan
- Prior art keywords
- work machine
- laser
- laser work
- transparent electrode
- color filter
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/33—Acousto-optical deflection devices
- G02F1/335—Acousto-optical deflection devices having an optical waveguide structure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27438695A JP3159906B2 (ja) | 1995-10-23 | 1995-10-23 | 液晶表示素子の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW373117B true TW373117B (en) | 1999-11-01 |
Family
ID=17540951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085111976A TW373117B (en) | 1995-10-23 | 1996-10-01 | Laser work machine and method of fabricating liquid crystal display component by using this laser work machine |
Country Status (4)
Country | Link |
---|---|
US (2) | US6028288A (zh) |
JP (1) | JP3159906B2 (zh) |
KR (1) | KR100203524B1 (zh) |
TW (1) | TW373117B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3309046B2 (ja) * | 1996-04-26 | 2002-07-29 | アルプス電気株式会社 | レーザ加工機 |
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
JP2002141301A (ja) * | 2000-11-02 | 2002-05-17 | Mitsubishi Electric Corp | レーザアニーリング用光学系とこれを用いたレーザアニーリング装置 |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
JP3855684B2 (ja) * | 2001-06-05 | 2006-12-13 | 松下電器産業株式会社 | レーザ加工装置およびレーザ加工方法 |
JP2004066327A (ja) * | 2002-08-09 | 2004-03-04 | Tdk Corp | レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 |
US6867388B2 (en) * | 2003-04-08 | 2005-03-15 | Branson Ultrasonics Corporation | Electronic masking laser imaging system |
US20040245225A1 (en) * | 2003-06-04 | 2004-12-09 | Alexander Kastalsky | Making color in two - and three - dimensional images created in glass with laser induced micro-explosions |
JP4887086B2 (ja) * | 2006-07-19 | 2012-02-29 | 武井電機工業株式会社 | 薄膜除去方法及び薄膜除去装置 |
US7732351B2 (en) | 2006-09-21 | 2010-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device and laser processing apparatus |
JP4954836B2 (ja) * | 2006-09-21 | 2012-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2008194729A (ja) * | 2007-02-13 | 2008-08-28 | Fujitsu Ltd | 小型デバイスの製造方法、レーザ加工方法及びレーザ加工装置 |
US8189902B1 (en) | 2007-12-21 | 2012-05-29 | Doug Carson & Associates | Creating an XY image pattern on a rotating substrate |
TWI393602B (zh) * | 2010-08-04 | 2013-04-21 | Hortek Crystal Co Ltd | 雷射加工製程裝置 |
US8482713B2 (en) | 2011-02-04 | 2013-07-09 | Apple Inc. | Laser processing of display components for electronic devices |
US10239160B2 (en) * | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
US8988636B2 (en) | 2012-09-20 | 2015-03-24 | Apple Inc. | Methods for trimming polarizers in displays |
US9703139B2 (en) | 2012-09-20 | 2017-07-11 | Apple Inc. | Methods for trimming polarizers in displays |
US9753317B2 (en) | 2012-12-21 | 2017-09-05 | Apple Inc. | Methods for trimming polarizers in displays using edge protection structures |
PL3165615T3 (pl) * | 2014-07-03 | 2023-05-08 | Nippon Steel Corporation | Zastosowanie urządzenia dla procesów obróbki laserowej dla rafinacji domen magnetycznych blachy cienkiej ze stali elektromagnetycznej o ziarnach zorientowanych |
JP6803189B2 (ja) * | 2016-10-06 | 2020-12-23 | 株式会社日本製鋼所 | レーザ照射装置及び半導体装置の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE207347C (zh) * | ||||
JPS5373692A (en) * | 1976-12-13 | 1978-06-30 | Toshiba Corp | Laser processing device |
JPS55153327A (en) * | 1979-05-18 | 1980-11-29 | Nec Corp | Laser annealing device |
US4533813A (en) * | 1983-09-06 | 1985-08-06 | Illinois Tool Works Inc. | Optical selective demetallization apparatus |
US4680855A (en) * | 1984-10-29 | 1987-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
JPS6326287A (ja) * | 1986-07-16 | 1988-02-03 | Nec Corp | プリント板の裏面リ−ドカツト機構 |
US5708252A (en) * | 1986-09-26 | 1998-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Excimer laser scanning system |
JPH0228395A (ja) * | 1988-03-22 | 1990-01-30 | Hitachi Constr Mach Co Ltd | 導体箔除去方法及び装置 |
DK0435825T3 (da) * | 1989-12-27 | 1996-02-12 | Ciba Geigy Ag | Apparat til homogenisering af den inhomogene lysfordeling i et laserstrålelysbundt |
JPH05203807A (ja) * | 1991-11-29 | 1993-08-13 | Seiko Instr Inc | カラーフィルターの製造方法 |
US5237149A (en) * | 1992-03-26 | 1993-08-17 | John Macken | Laser machining utilizing a spacial filter |
WO1994029069A1 (fr) * | 1993-06-04 | 1994-12-22 | Seiko Epson Corporation | Appareil et procede d'usinage au laser, et panneau a cristaux liquides |
US5340619A (en) * | 1993-10-18 | 1994-08-23 | Brewer Science, Inc. | Method of manufacturing a color filter array |
US5373137A (en) * | 1994-01-28 | 1994-12-13 | Litton Systems, Inc. | Multiple-line laser writing apparatus and method |
-
1995
- 1995-10-23 JP JP27438695A patent/JP3159906B2/ja not_active Expired - Fee Related
-
1996
- 1996-10-01 TW TW085111976A patent/TW373117B/zh active
- 1996-10-16 US US08/731,526 patent/US6028288A/en not_active Expired - Fee Related
- 1996-10-22 KR KR1019960047483A patent/KR100203524B1/ko not_active IP Right Cessation
-
1999
- 1999-08-31 US US09/387,017 patent/US6060684A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6060684A (en) | 2000-05-09 |
KR100203524B1 (ko) | 1999-06-15 |
KR970022404A (ko) | 1997-05-28 |
US6028288A (en) | 2000-02-22 |
JP3159906B2 (ja) | 2001-04-23 |
JPH09113892A (ja) | 1997-05-02 |
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