TW371775B - Method for the selective removal of silicon dioxide - Google Patents

Method for the selective removal of silicon dioxide

Info

Publication number
TW371775B
TW371775B TW085103156A TW85103156A TW371775B TW 371775 B TW371775 B TW 371775B TW 085103156 A TW085103156 A TW 085103156A TW 85103156 A TW85103156 A TW 85103156A TW 371775 B TW371775 B TW 371775B
Authority
TW
Taiwan
Prior art keywords
gas
etching
chamber
specimen
water vapor
Prior art date
Application number
TW085103156A
Other languages
English (en)
Inventor
Thomas Scheiter
Ulrich Naeher
Christofer Hierold
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW371775B publication Critical patent/TW371775B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/12—Gaseous compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/935—Gas flow control

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
TW085103156A 1995-04-28 1996-03-16 Method for the selective removal of silicon dioxide TW371775B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19515796 1995-04-28

Publications (1)

Publication Number Publication Date
TW371775B true TW371775B (en) 1999-10-11

Family

ID=7760686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103156A TW371775B (en) 1995-04-28 1996-03-16 Method for the selective removal of silicon dioxide

Country Status (6)

Country Link
US (1) US5662772A (zh)
EP (1) EP0746016B1 (zh)
JP (1) JPH08306674A (zh)
KR (1) KR100430926B1 (zh)
DE (1) DE59611182D1 (zh)
TW (1) TW371775B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682510B2 (ja) * 1995-05-09 1997-11-26 日本電気株式会社 半導体装置の製造方法
US5935877A (en) * 1995-09-01 1999-08-10 Applied Materials, Inc. Etch process for forming contacts over titanium silicide
US5783495A (en) * 1995-11-13 1998-07-21 Micron Technology, Inc. Method of wafer cleaning, and system and cleaning solution regarding same
US6153358A (en) 1996-12-23 2000-11-28 Micorn Technology, Inc. Polyimide as a mask in vapor hydrogen fluoride etching and method of producing a micropoint
US6097092A (en) * 1998-04-22 2000-08-01 International Business Machines Corporation Freestanding multilayer IC wiring structure
DE69934986T2 (de) * 1998-07-23 2007-11-08 Surface Technoloy Systems Plc Verfahren für anisotropes ätzen
US6740247B1 (en) 1999-02-05 2004-05-25 Massachusetts Institute Of Technology HF vapor phase wafer cleaning and oxide etching
DE19941042A1 (de) * 1999-08-28 2001-03-15 Bosch Gmbh Robert Verfahren zur Herstellung oberflächenmikromechanischer Strukturen durch Ätzung mit einem dampfförmigen, flußsäurehaltigen Ätzmedium
US6337277B1 (en) * 2000-06-28 2002-01-08 Lam Research Corporation Clean chemistry low-k organic polymer etch
US6534413B1 (en) * 2000-10-27 2003-03-18 Air Products And Chemicals, Inc. Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch
JP3882806B2 (ja) * 2003-10-29 2007-02-21 ソニー株式会社 エッチング方法
JP2005150332A (ja) * 2003-11-14 2005-06-09 Sony Corp エッチング方法
JP2005212032A (ja) * 2004-01-29 2005-08-11 M Fsi Kk Ｍｅｍｓデバイス向け基板表面の処理方法
JP2006167849A (ja) * 2004-12-15 2006-06-29 Denso Corp マイクロ構造体の製造方法
US8071486B2 (en) 2005-07-18 2011-12-06 Teledyne Dalsa Semiconductor Inc. Method for removing residues formed during the manufacture of MEMS devices
WO2007025039A2 (en) * 2005-08-23 2007-03-01 Xactix, Inc. Pulsed etching cooling
US7952901B2 (en) * 2007-08-09 2011-05-31 Qualcomm Incorporated Content addressable memory
US20080152437A1 (en) * 2006-12-26 2008-06-26 Illinois Tool Works Inc. Pulverulent material transport
US20080205189A1 (en) 2007-02-27 2008-08-28 Illinois Tool Works Inc. Dense phase pump for pulverulent material
JP6024272B2 (ja) * 2011-12-22 2016-11-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920471A (en) * 1974-10-10 1975-11-18 Teletype Corp Prevention of aluminum etching during silox photoshaping
WO1987001508A1 (en) * 1985-08-28 1987-03-12 Fsi Corporation Gaseous process and apparatus for removing films from substrates
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
US5458724A (en) * 1989-03-08 1995-10-17 Fsi International, Inc. Etch chamber with gas dispersing membrane
US5174855A (en) * 1989-04-28 1992-12-29 Dainippon Screen Mfg. Co. Ltd. Surface treating apparatus and method using vapor
US5022961B1 (en) * 1989-07-26 1997-05-27 Dainippon Screen Mfg Method for removing a film on a silicon layer surface
KR0161674B1 (ko) * 1989-11-03 1999-02-01 한스 피터 후크숀 수분 존재하에 반도체 기판을 할로겐 에칭하는 방법
US5294568A (en) * 1990-10-12 1994-03-15 Genus, Inc. Method of selective etching native oxide
JP2833946B2 (ja) * 1992-12-08 1998-12-09 日本電気株式会社 エッチング方法および装置
WO1994027315A1 (en) * 1993-05-13 1994-11-24 Interuniversitair Microelektronica Centrum Method for semiconductor processing using mixtures of hf and carboxylic acid
DE4317274A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen
DE4432210A1 (de) * 1994-09-09 1996-03-14 Siemens Ag Verfahren zur Rückseitenätzung einer mit Siliziumdioxid beschichteten Halbleiterscheibe mit Fluorwasserstoffgas
US5635102A (en) * 1994-09-28 1997-06-03 Fsi International Highly selective silicon oxide etching method

Also Published As

Publication number Publication date
EP0746016A3 (de) 1997-06-04
EP0746016B1 (de) 2005-01-19
KR960037867A (ko) 1996-11-19
KR100430926B1 (ko) 2004-07-15
JPH08306674A (ja) 1996-11-22
DE59611182D1 (de) 2005-02-24
US5662772A (en) 1997-09-02
EP0746016A2 (de) 1996-12-04

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