TW370764B - Method for producing an apparatus that includes a print circuit board - Google Patents

Method for producing an apparatus that includes a print circuit board

Info

Publication number
TW370764B
TW370764B TW084111097A TW84111097A TW370764B TW 370764 B TW370764 B TW 370764B TW 084111097 A TW084111097 A TW 084111097A TW 84111097 A TW84111097 A TW 84111097A TW 370764 B TW370764 B TW 370764B
Authority
TW
Taiwan
Prior art keywords
circuit board
print circuit
producing
master print
regions
Prior art date
Application number
TW084111097A
Other languages
English (en)
Inventor
Hiroshi Mugiya
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW370764B publication Critical patent/TW370764B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW084111097A 1995-03-17 1995-10-20 Method for producing an apparatus that includes a print circuit board TW370764B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05857495A JP3368451B2 (ja) 1995-03-17 1995-03-17 回路基板の製造方法と回路検査装置

Publications (1)

Publication Number Publication Date
TW370764B true TW370764B (en) 1999-09-21

Family

ID=13088221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111097A TW370764B (en) 1995-03-17 1995-10-20 Method for producing an apparatus that includes a print circuit board

Country Status (7)

Country Link
US (2) US5671531A (zh)
JP (1) JP3368451B2 (zh)
KR (1) KR100227206B1 (zh)
CN (2) CN1053315C (zh)
DE (1) DE19541334C2 (zh)
FR (2) FR2731869B1 (zh)
TW (1) TW370764B (zh)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
KR0178255B1 (ko) * 1995-11-17 1999-03-20 황인길 Bga 반도체 패키지의 pcb캐리어 프레임 및 그 제조방법
JP2937188B2 (ja) * 1997-05-12 1999-08-23 松下電器産業株式会社 電子ユニットの製造装置と製造方法
US6002263A (en) * 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
TW421980B (en) * 1997-12-22 2001-02-11 Citizen Watch Co Ltd Electronic component device, its manufacturing process, and collective circuits
US6223091B1 (en) * 1998-05-29 2001-04-24 Siemens Energy & Automation, Inc. Alarm event generator apparatus, means and system
US6314328B1 (en) * 1998-05-29 2001-11-06 Siemens Energy & Automation, Inc. Method for an alarm event generator
JP3617368B2 (ja) * 1999-04-02 2005-02-02 株式会社村田製作所 マザー基板および子基板ならびにその製造方法
NL1012420C2 (nl) * 1999-06-23 2000-12-28 Johannes Nicolaas Peperkamp Werkwijze voor het doormeten van elektronische componenten, in het bijzonder ge´ntegreerde schakelingen, en daarvoor bestemde inrichting.
US7004644B1 (en) * 1999-06-29 2006-02-28 Finisar Corporation Hermetic chip-scale package for photonic devices
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
JP2001124961A (ja) * 1999-10-29 2001-05-11 Kyocera Corp 光部品実装用基板及びその製造方法
US6368147B1 (en) * 2000-03-02 2002-04-09 Microhelix, Inc. Zero insertion force percutaneous connector and flexible brain probe assembly
US6719582B1 (en) 2000-03-02 2004-04-13 Micro Helix, Inc. Method of making a flexible electrode bio-probe assembly
JP4511002B2 (ja) * 2000-08-23 2010-07-28 京セラ株式会社 半導体素子収納用パッケージの製造方法
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
JP2004047759A (ja) * 2002-07-12 2004-02-12 Alps Electric Co Ltd 電子ユニットの集合基板
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
JP4194918B2 (ja) * 2003-10-31 2008-12-10 シャープ株式会社 受光装置の製造方法
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
CN100441067C (zh) * 2003-12-24 2008-12-03 上海贝岭股份有限公司 一种抑制电磁干扰的地线布图方法
US20050172178A1 (en) * 2004-01-15 2005-08-04 Elias Gedamu Cache-testable processor identification
US20050159925A1 (en) * 2004-01-15 2005-07-21 Elias Gedamu Cache testing for a processor design
US20050172182A1 (en) * 2004-01-15 2005-08-04 Elias Gedamu Optimal operational voltage identification for a processor design
US20080112151A1 (en) 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US8399972B2 (en) * 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
JP4969113B2 (ja) * 2006-02-22 2012-07-04 オンセミコンダクター・トレーディング・リミテッド 回路装置の製造方法
US7498646B2 (en) * 2006-07-19 2009-03-03 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
US7954215B2 (en) * 2007-03-19 2011-06-07 Epson Toyocom Corporation Method for manufacturing acceleration sensing unit
JP5157357B2 (ja) * 2007-10-10 2013-03-06 日亜化学工業株式会社 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
CN102036477B (zh) * 2009-09-24 2012-08-29 鸿富锦精密工业（深圳）有限公司 印刷电路板组合
EP2432303B1 (en) * 2010-01-29 2013-04-24 Huawei Technologies Co., Ltd. Electromagnetic shielding method and device
AT511757B1 (de) * 2011-08-12 2013-06-15 Eaton Gmbh Verfahren zur herstellung eines elektrischen kontaktträgers
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
KR101921686B1 (ko) 2012-06-14 2018-11-26 스카이워크스 솔루션즈, 인코포레이티드 와이어 본드 패드 및 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈
CN104885216B (zh) 2012-07-13 2017-04-12 天工方案公司 在射频屏蔽应用中的轨道设计
US20140218851A1 (en) * 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
JP6193622B2 (ja) * 2013-05-28 2017-09-06 日本特殊陶業株式会社 配線基板ユニットおよびリード付き配線基板の製造方法
CN105163517B (zh) * 2015-08-06 2018-01-05 常州嘉诚数码科技有限公司 柔性线路板与导线焊接工艺
WO2019138904A1 (ja) * 2018-01-11 2019-07-18 株式会社村田製作所 スイッチモジュール
US11588268B1 (en) 2018-11-28 2023-02-21 Titan3 Technology LLC Extendable electrical outlet enclosure
US11217977B1 (en) 2018-11-28 2022-01-04 Jeffrey P. Baldwin Color changing floor outlet cover
US20230010770A1 (en) * 2021-07-09 2023-01-12 Cree, Inc. High Performance Semiconductor Device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780431A (en) * 1972-09-25 1973-12-25 Bowmar Ali Inc Process for producing computer circuits utilizing printed circuit boards
GB2034527B (en) * 1978-10-11 1983-03-02 Matsushita Electric Ind Co Ltd Method of manufacturing flexible printed circuit sheets
GB2034127B (en) * 1978-10-13 1983-05-18 Matsushita Electric Ind Co Ltd Printed circuits and methods their manufacture
US4343084A (en) * 1980-02-08 1982-08-10 Rca Corporation Method for making printed circuit boards with connector terminals
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
JPS57190339A (en) * 1981-05-19 1982-11-22 Pioneer Electronic Corp Manufacture of printed circuit board unit
US4641112A (en) * 1985-03-12 1987-02-03 Toko, Inc. Delay line device and method of making same
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法
JPH01165196A (ja) * 1987-12-22 1989-06-29 Nec Corp プリント板実装方法
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same
FI113937B (fi) * 1989-02-21 2004-06-30 Tatsuta Electric Wire & Gable Painettu piirilevy ja menetelmä sen valmistamiseksi
JPH031470A (ja) * 1989-05-30 1991-01-08 Murata Mfg Co Ltd 電子部品の製造方法
DE3925814A1 (de) * 1989-08-04 1991-02-07 Broadcast Television Syst Verfahren zum verloeten von elektrischen bauelementen mit einer leiterplatte
US5031073A (en) * 1990-05-02 1991-07-09 Hewlett-Packard Company Fault-isolating apparatus and method for connecting circuitry
US5424633A (en) * 1991-01-22 1995-06-13 Advanced Test Technologies Inc. Contactless test method and system for testing printed circuit boards
CA2049616C (en) * 1991-01-22 2000-04-04 Jacob Soiferman Contactless test method and system for testing printed circuit boards
JPH04359463A (ja) * 1991-06-05 1992-12-11 Oki Electric Ind Co Ltd モールドパッケージ形ハイブリッドｉｃの製造方法
US5512710A (en) * 1992-08-21 1996-04-30 Cts Corporation Multilayer package with second layer via test connections
JP2541465B2 (ja) * 1993-07-31 1996-10-09 日本電気株式会社 混成集積回路装置
US5399969A (en) * 1993-08-05 1995-03-21 General Electric Company Analyzer of gradient power usage for oblique MRI imaging
KR960009111B1 (en) * 1993-09-23 1996-07-10 Lg Electronic Components Co Hybrid ic structure
US5517110A (en) * 1995-04-06 1996-05-14 Yentec Inc. Contactless test method and system for testing printed circuit boards

Also Published As

Publication number Publication date
FR2731869B1 (fr) 1999-08-27
US5940964A (en) 1999-08-24
JPH08255861A (ja) 1996-10-01
CN1131897A (zh) 1996-09-25
DE19541334C2 (de) 2003-05-22
FR2786276A1 (fr) 2000-05-26
CN1053315C (zh) 2000-06-07
FR2731869A1 (fr) 1996-09-20
CN1112088C (zh) 2003-06-18
CN1221313A (zh) 1999-06-30
US5671531A (en) 1997-09-30
DE19541334A1 (de) 1996-09-19
FR2786276B1 (fr) 2001-11-30
JP3368451B2 (ja) 2003-01-20
KR100227206B1 (ko) 1999-10-15

Similar Documents

Publication Publication Date Title
TW370764B (en) Method for producing an apparatus that includes a print circuit board
TW342579B (en) Manufacturing method of printed circuit board and printed circuit board
GB2025910B (en) Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
KR970706714A (ko) 프린트 배선판 및 그 제조방법과 전자기기(printed wiring board, method of producing the same and electronic devices)
DE59400691D1 (de) Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung
CA2073911A1 (en) Stepped multilayer interconnection apparatus and method of making the same
EP0247575A3 (en) Multilayer printed wiring board and method for producing the same
KR960009816A (ko) 인쇄 회로 기판상에 미세 피치 땜납 피착 방법 및 그 제품
EP0598914A4 (en) CIRCUIT BOARD PRINTED IN RELIEF, ELECTRONIC CIRCUIT BOX USING THE SAME, AND METHOD FOR PRODUCING THE SAME.
HK33297A (en) High mix printed circuit assembly technique
DE69524364D1 (de) Mehrzahl-Anschluss für elektronische Dickschichtkomponente und Herstellungsverfahren
EP0361752A3 (en) Selective solder formation on printed circuit boards
EP0178864A3 (en) Process for producing copper through-hole printed circuit board
EP0883173A4 (en) CIRCUIT BOARD FOR MOUNTING ELECTRONIC PARTS
DE59201356D1 (de) Verfahren zur Herstellung elektrisch leitender Verbindungen an Leiterplatten.
GB2251129B (en) Printed wiring board, printed circuit board and electronic apparatus
ES8204908A1 (es) Disposicion de, al menos, dos tarjetas de circuitos impresos.
AU6700396A (en) Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
ES8309032A1 (es) Un metodo para conectar los bordes de la tarjetas de circuito impreso.
AU2935789A (en) Apparatus and method for the manufacture of printed circuit board prototypes
EP0542149A3 (en) Process for producing solder areas on printed circuit board and solder paste foil for performing such process
EP0743681A3 (en) Printed circuit board for electronic components with high-density connections and their manufacture
DE3363638D1 (en) Method for making electrical connections between the two faces of a printed circuit board and a printing stamp for the same
DE3373775D1 (en) Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards
AU554348B2 (en) Apparatus for mounting chip type circuits on printed circuit boards

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees