TW364207B - Method for producing DRAM - Google Patents
Method for producing DRAMInfo
- Publication number
- TW364207B TW364207B TW086119412A TW86119412A TW364207B TW 364207 B TW364207 B TW 364207B TW 086119412 A TW086119412 A TW 086119412A TW 86119412 A TW86119412 A TW 86119412A TW 364207 B TW364207 B TW 364207B
- Authority
- TW
- Taiwan
- Prior art keywords
- implant
- region
- punch
- memory cell
- field
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086119412A TW364207B (en) | 1997-12-20 | 1997-12-20 | Method for producing DRAM |
US09/040,553 US6017799A (en) | 1997-12-20 | 1998-03-18 | Method of fabricating dynamic random memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086119412A TW364207B (en) | 1997-12-20 | 1997-12-20 | Method for producing DRAM |
Publications (1)
Publication Number | Publication Date |
---|---|
TW364207B true TW364207B (en) | 1999-07-11 |
Family
ID=21627453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086119412A TW364207B (en) | 1997-12-20 | 1997-12-20 | Method for producing DRAM |
Country Status (2)
Country | Link |
---|---|
US (1) | US6017799A (zh) |
TW (1) | TW364207B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11330385A (ja) * | 1998-05-20 | 1999-11-30 | Mitsumi Electric Co Ltd | Cmosデバイス |
JP2000269458A (ja) * | 1999-03-17 | 2000-09-29 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6501131B1 (en) * | 1999-07-22 | 2002-12-31 | International Business Machines Corporation | Transistors having independently adjustable parameters |
US6514807B1 (en) * | 2001-09-18 | 2003-02-04 | Macronix International Co., Ltd. | Method for fabricating semiconductor device applied system on chip |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2682425B2 (ja) * | 1993-12-24 | 1997-11-26 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH08172187A (ja) * | 1994-12-16 | 1996-07-02 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US5939762A (en) * | 1997-06-26 | 1999-08-17 | Integrated Device Technology, Inc. | SRAM cell using thin gate oxide pulldown transistors |
-
1997
- 1997-12-20 TW TW086119412A patent/TW364207B/zh not_active IP Right Cessation
-
1998
- 1998-03-18 US US09/040,553 patent/US6017799A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6017799A (en) | 2000-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |