TW362222B - Coiled component and its production method - Google Patents

Coiled component and its production method

Info

Publication number
TW362222B
TW362222B TW085114587A TW85114587A TW362222B TW 362222 B TW362222 B TW 362222B TW 085114587 A TW085114587 A TW 085114587A TW 85114587 A TW85114587 A TW 85114587A TW 362222 B TW362222 B TW 362222B
Authority
TW
Taiwan
Prior art keywords
production method
coiled component
conductive member
insulating member
coiled
Prior art date
Application number
TW085114587A
Other languages
English (en)
Inventor
Akihiko Ibata
Sinji Harada
Tadashi Kawamata
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30707995A external-priority patent/JPH09148135A/ja
Priority claimed from JP32543595A external-priority patent/JPH09167714A/ja
Priority claimed from JP6595296A external-priority patent/JPH09260143A/ja
Priority claimed from JP8065949A external-priority patent/JPH09260162A/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW362222B publication Critical patent/TW362222B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Insulated Conductors (AREA)
  • Wire Processing (AREA)
TW085114587A 1995-11-27 1996-11-26 Coiled component and its production method TW362222B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP30707995A JPH09148135A (ja) 1995-11-27 1995-11-27 コイル部品
JP32543595A JPH09167714A (ja) 1995-12-14 1995-12-14 コイル部品の製造方法
JP6595296A JPH09260143A (ja) 1996-03-22 1996-03-22 コイル部品およびその製造方法
JP8065949A JPH09260162A (ja) 1996-03-22 1996-03-22 コイル部品およびその製造方法

Publications (1)

Publication Number Publication Date
TW362222B true TW362222B (en) 1999-06-21

Family

ID=27464648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085114587A TW362222B (en) 1995-11-27 1996-11-26 Coiled component and its production method

Country Status (6)

Country Link
US (1) US6169470B1 (zh)
KR (1) KR100297584B1 (zh)
CN (1) CN1130735C (zh)
MY (1) MY120914A (zh)
TW (1) TW362222B (zh)
WO (1) WO1997020327A1 (zh)

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DE19854232A1 (de) * 1998-11-24 2000-05-31 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
FR2802762A1 (fr) * 1999-12-17 2001-06-22 Microspire Composant inductif de faible epaisseur
US6642709B2 (en) * 2001-10-17 2003-11-04 A.J. Rose Manufacturing Co. Signal wheel for generating rotational position signal
JP3745316B2 (ja) * 2002-06-24 2006-02-15 Necエレクトロニクス株式会社 半導体集積回路及びその製造方法
JP4217438B2 (ja) * 2002-07-26 2009-02-04 Fdk株式会社 マイクロコンバータ
KR100818266B1 (ko) * 2002-09-13 2008-03-31 삼성전자주식회사 고주파 집적회로에 사용되는 인덕터
TWI264969B (en) * 2003-11-28 2006-10-21 Murata Manufacturing Co Multilayer ceramic electronic component and its manufacturing method
CN1251255C (zh) * 2004-05-10 2006-04-12 阎跃军 可调电感器
KR100662894B1 (ko) * 2005-05-04 2007-01-02 삼성전자주식회사 복수의 코일 레이어를 갖는 인덕터
JP4408283B2 (ja) * 2006-10-04 2010-02-03 日本碍子株式会社 インダクタ素子及びその製造方法
US7733207B2 (en) * 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
CN101790766B (zh) * 2007-08-31 2015-07-08 胜美达集团株式会社 线圈零件以及该线圈零件的制造方法
CN102187408B (zh) * 2008-10-30 2015-01-14 株式会社村田制作所 电子部件
CN101521087B (zh) * 2008-11-17 2012-12-05 深圳振华富电子有限公司 一种电感器及其制造方法
JP5407404B2 (ja) * 2009-02-19 2014-02-05 ソニー株式会社 配線基板とその製造方法、チューナモジュール、及び電子機器
JP5398676B2 (ja) * 2009-09-24 2014-01-29 日本碍子株式会社 コイル埋設型インダクタおよびその製造方法
CN103107153B (zh) * 2011-11-15 2016-04-06 精材科技股份有限公司 晶片封装体及其形成方法
US9431473B2 (en) 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
CN104134532B (zh) * 2013-05-03 2017-09-08 胜美达电机(香港)有限公司 一种可变内径的线圈及利用其制成的电子模块
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
KR101994731B1 (ko) * 2014-01-27 2019-07-01 삼성전기주식회사 칩 전자부품 및 그 제조방법
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
KR102004788B1 (ko) * 2014-04-22 2019-07-29 삼성전기주식회사 공통 모드 필터 및 그 제조방법
CN104485507B (zh) * 2014-12-05 2018-02-13 广州丰谱信息技术有限公司 一种可控的宽频磁波波束形成装置与方法
KR101832547B1 (ko) 2014-12-12 2018-02-26 삼성전기주식회사 칩 전자부품 및 그 제조방법
KR20160099882A (ko) * 2015-02-13 2016-08-23 삼성전기주식회사 칩 전자부품 및 그 제조방법
JP6376000B2 (ja) 2015-03-02 2018-08-22 株式会社村田製作所 電子部品およびその製造方法
WO2017026320A1 (ja) * 2015-08-07 2017-02-16 株式会社村田製作所 多層基板及びその製造方法
EP3327806B1 (en) * 2016-11-24 2021-07-21 Murata Integrated Passive Solutions Integrated electronic component suitable for broadband biasing
CN106653568B (zh) * 2016-12-02 2019-04-16 昆山纳尔格信息科技有限公司 一种低干扰电感结构的制造方法
CN106783019B (zh) * 2016-12-02 2018-08-28 江苏贺鸿电子有限公司 一种低干扰电感结构
JP6696483B2 (ja) 2017-07-10 2020-05-20 株式会社村田製作所 コイル部品
JP6895333B2 (ja) * 2017-07-10 2021-06-30 株式会社村田製作所 コイル部品
JP6642544B2 (ja) * 2017-09-12 2020-02-05 株式会社村田製作所 コイル部品
JP7115831B2 (ja) * 2017-09-29 2022-08-09 太陽誘電株式会社 積層コイル部品
JP6801795B2 (ja) * 2017-11-28 2020-12-16 株式会社村田製作所 インダクタおよびトランス
US10677857B2 (en) * 2017-12-15 2020-06-09 Biosense Webster (Israel) Ltd. Three-axial sensor including six single-axis sensors
CN110958788A (zh) * 2018-09-27 2020-04-03 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
KR102130677B1 (ko) * 2019-01-09 2020-07-06 삼성전기주식회사 코일 부품
JP7306923B2 (ja) * 2019-08-30 2023-07-11 太陽誘電株式会社 コイル部品
US20210098180A1 (en) * 2019-09-30 2021-04-01 Advanced Semiconductor Engineering, Inc. Inductor structure

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US3971126A (en) 1974-08-05 1976-07-27 Gte Laboratories Incorporated Method of fabricating magnetic field drive coils for field accessed cylindrical domain memories
DE3477438D1 (en) 1984-03-23 1989-04-27 Siemens Ag Electronic component, in particular a chip inductance
MY105486A (en) * 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
JPH03201511A (ja) 1989-12-28 1991-09-03 Toshiba Lighting & Technol Corp 平面インダクタ
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
US5302932A (en) * 1992-05-12 1994-04-12 Dale Electronics, Inc. Monolythic multilayer chip inductor and method for making same
JPH06120024A (ja) 1992-10-05 1994-04-28 Nissin Electric Co Ltd 変圧器用コイル
JP3472329B2 (ja) * 1993-12-24 2003-12-02 株式会社村田製作所 チップ型トランス
JP2006502422A (ja) * 2002-07-12 2006-01-19 ケイデンス デザイン システムズ インコーポレイテッド コンテクスト特定型のマスク検査のための方法及びシステム

Also Published As

Publication number Publication date
CN1207826A (zh) 1999-02-10
CN1130735C (zh) 2003-12-10
US6169470B1 (en) 2001-01-02
KR100297584B1 (ko) 2001-11-02
MY120914A (en) 2005-12-30
WO1997020327A1 (en) 1997-06-05
KR19990071690A (ko) 1999-09-27

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