JP4408283B2 - インダクタ素子及びその製造方法 - Google Patents
インダクタ素子及びその製造方法 Download PDFInfo
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- JP4408283B2 JP4408283B2 JP2006272721A JP2006272721A JP4408283B2 JP 4408283 B2 JP4408283 B2 JP 4408283B2 JP 2006272721 A JP2006272721 A JP 2006272721A JP 2006272721 A JP2006272721 A JP 2006272721A JP 4408283 B2 JP4408283 B2 JP 4408283B2
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 68
- 239000000919 ceramic Substances 0.000 claims description 165
- 239000000758 substrate Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 36
- 239000004020 conductor Substances 0.000 claims description 33
- 238000010304 firing Methods 0.000 claims description 18
- 238000004804 winding Methods 0.000 claims description 16
- 241000206607 Porphyra umbilicalis Species 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 241001474374 Blennius Species 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241000972773 Aulopiformes Species 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XVNRSQASUCMHGX-UHFFFAOYSA-N O[Si](O)(O)O.OP(O)(O)=O Chemical compound O[Si](O)(O)O.OP(O)(O)=O XVNRSQASUCMHGX-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- JYSOTTHMQQDBFC-UHFFFAOYSA-N boric acid phosphoric acid silicic acid Chemical compound P(O)(O)(O)=O.B(O)(O)O.[Si](O)(O)(O)O JYSOTTHMQQDBFC-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
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- 235000009566 rice Nutrition 0.000 description 1
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- 238000007650 screen-printing Methods 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Description
4 切り欠け
5 段差
10 インダクタ素子
11 切断線
12 コイル
13 セラミック基体
14 セラミック層
Claims (5)
- セラミック基体と、そのセラミック基体と相補形状をなす導電体からなるコイルと、を有し、そのコイルと対面する前記セラミック基体の内壁面に、一の方向に向けて複数の段差が形成され、
前記段差の底側に、段差の深さ方向と同じ方向に、更に、切り欠けが形成され、その切り欠けの寸法が、切り欠けの深さ方向と同じ方向における前記セラミック基体の最大幅に対して、1/5〜1/200であるとともに、その切り欠けの寸法が、2〜20μmであり、
複数の段差の向きである前記一の方向の長さに対する、複数の段差の向きとは異なる他の方向の長さの比が、0.4〜1.0である、四角型海苔巻形状を呈するインダクタ素子。 - 前記セラミック基体が、磁性体からなる磁性セラミック基体である請求項1に記載のインダクタ素子。
- 請求項1に記載のインダクタ素子を製造する方法であって、
複数のセラミックグリーンシートを用意し、それらセラミックグリーンシートの各々に打抜加工を施して所定形状の孔部を開け、孔部を開けた複数のセラミックグリーンシートを積層してグリーン積層体を得て、そのグリーン積層体を焼成し、
前記孔部の集合によってコイルの形状となったキャビティを有し、前記複数の段差及び切り欠けが形成された、型を兼ねたセラミック基体を得て、
その型を兼ねたセラミック基体のキャビティに導電材料を充填した後に焼成して、前記キャビティの中にコイルを一体成形する工程を有するインダクタ素子の製造方法。 - 請求項1に記載のインダクタ素子を製造する方法であって、
複数のセラミックグリーンシートを用意し、それらセラミックグリーンシートの各々に打抜加工を施して所定形状の孔部を開け、その孔部に導電材料を埋め込み、孔部に導電材料を埋め込んだ複数のセラミックグリーンシートを積層してグリーン積層体を得て、そのグリーン積層体を焼成し、
前記孔部の集合によってコイルの形状となったキャビティの中でコイルが一体成形されるとともに前記複数の段差及び切り欠けが形成されたセラミック基体を得る工程を有するインダクタ素子の製造方法。 - 前記セラミックグリーンシートが、磁性セラミック材料からなる磁性セラミックグリーンシートである請求項3又は4に記載のインダクタ素子の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272721A JP4408283B2 (ja) | 2006-10-04 | 2006-10-04 | インダクタ素子及びその製造方法 |
US11/853,860 US7701319B2 (en) | 2006-10-04 | 2007-09-12 | Inductor element and method of manufacturing the same |
EP07253926A EP1923894B1 (en) | 2006-10-04 | 2007-10-03 | Inductor element and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272721A JP4408283B2 (ja) | 2006-10-04 | 2006-10-04 | インダクタ素子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008091760A JP2008091760A (ja) | 2008-04-17 |
JP4408283B2 true JP4408283B2 (ja) | 2010-02-03 |
Family
ID=39247773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006272721A Expired - Fee Related JP4408283B2 (ja) | 2006-10-04 | 2006-10-04 | インダクタ素子及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7701319B2 (ja) |
EP (1) | EP1923894B1 (ja) |
JP (1) | JP4408283B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8068004B1 (en) * | 2010-02-03 | 2011-11-29 | Xilinx, Inc. | Embedded inductor |
US8823133B2 (en) | 2011-03-29 | 2014-09-02 | Xilinx, Inc. | Interposer having an inductor |
US9406738B2 (en) | 2011-07-20 | 2016-08-02 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
US9330823B1 (en) | 2011-12-19 | 2016-05-03 | Xilinx, Inc. | Integrated circuit structure with inductor in silicon interposer |
US9337138B1 (en) | 2012-03-09 | 2016-05-10 | Xilinx, Inc. | Capacitors within an interposer coupled to supply and ground planes of a substrate |
DE102012113018A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Verfahren zur Herstellung eines Mehrschichtträgerkörpers |
JP6519561B2 (ja) * | 2016-09-23 | 2019-05-29 | 株式会社村田製作所 | インダクタ部品およびその製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US770432A (en) * | 1904-09-20 | High-potential induction-coil | ||
JPH07326515A (ja) | 1994-05-30 | 1995-12-12 | Kyocera Corp | 積層コイル基板 |
JP3102287B2 (ja) | 1994-12-19 | 2000-10-23 | 住友金属工業株式会社 | セラミックス多層基板 |
TW362222B (en) * | 1995-11-27 | 1999-06-21 | Matsushita Electric Ind Co Ltd | Coiled component and its production method |
JPH09199370A (ja) | 1996-01-18 | 1997-07-31 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
JPH1012455A (ja) | 1996-06-24 | 1998-01-16 | Tdk Corp | 積層型コイル部品とその製造方法 |
JP3351738B2 (ja) | 1998-05-01 | 2002-12-03 | 太陽誘電株式会社 | 積層インダクタ及びその製造方法 |
US6633912B1 (en) * | 1998-10-12 | 2003-10-14 | Freshwater Software, Inc. | System, method and apparatus for providing an enterprise portal |
US6413340B1 (en) | 1998-10-20 | 2002-07-02 | Tdk Corporation | Method for the preparation of laminated inductor device |
JP3662749B2 (ja) | 1998-10-20 | 2005-06-22 | Tdk株式会社 | 積層インダクタ素子の製造方法 |
US6988138B1 (en) * | 1999-06-30 | 2006-01-17 | Blackboard Inc. | Internet-based education support system and methods |
JP2001167930A (ja) | 1999-12-08 | 2001-06-22 | Fuji Electric Co Ltd | インダクタ用コイルとその製造方法 |
JP3933844B2 (ja) | 2000-05-09 | 2007-06-20 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
US6864774B2 (en) | 2000-10-19 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Inductance component and method of manufacturing the same |
JP2002171064A (ja) | 2000-11-29 | 2002-06-14 | Kyocera Corp | 多層配線基板の製造方法 |
US6813474B2 (en) * | 2001-02-24 | 2004-11-02 | Echalk: L.L.C. | System and method for creating, processing and managing educational content within and between schools |
KR100818266B1 (ko) * | 2002-09-13 | 2008-03-31 | 삼성전자주식회사 | 고주파 집적회로에 사용되는 인덕터 |
JP4191506B2 (ja) | 2003-02-21 | 2008-12-03 | Tdk株式会社 | 高密度インダクタおよびその製造方法 |
JP2005142302A (ja) | 2003-11-05 | 2005-06-02 | Murata Mfg Co Ltd | 積層コイル部品およびその製造方法 |
US7196607B2 (en) | 2004-03-26 | 2007-03-27 | Harris Corporation | Embedded toroidal transformers in ceramic substrates |
US9892650B2 (en) * | 2006-09-11 | 2018-02-13 | Houghton Mifflin Harcourt Publishing Company | Recovery of polled data after an online test platform failure |
-
2006
- 2006-10-04 JP JP2006272721A patent/JP4408283B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-12 US US11/853,860 patent/US7701319B2/en not_active Expired - Fee Related
- 2007-10-03 EP EP07253926A patent/EP1923894B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
US20080084265A1 (en) | 2008-04-10 |
EP1923894B1 (en) | 2011-06-22 |
US7701319B2 (en) | 2010-04-20 |
EP1923894A1 (en) | 2008-05-21 |
JP2008091760A (ja) | 2008-04-17 |
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