TW360626B - Metallized ceramic substrate having smooth plating layer and method for producing the same - Google Patents

Metallized ceramic substrate having smooth plating layer and method for producing the same

Info

Publication number
TW360626B
TW360626B TW084107926A TW84107926A TW360626B TW 360626 B TW360626 B TW 360626B TW 084107926 A TW084107926 A TW 084107926A TW 84107926 A TW84107926 A TW 84107926A TW 360626 B TW360626 B TW 360626B
Authority
TW
Taiwan
Prior art keywords
layer
plating layer
ceramic substrate
metallized
producing
Prior art date
Application number
TW084107926A
Other languages
English (en)
Inventor
Kouhei Shimoda
Hirohiko Nakata
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW360626B publication Critical patent/TW360626B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00Layered products essentially comprising ceramics, e.g. refractory products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00241Physical properties of the materials not provided for elsewhere in C04B2111/00
    • C04B2111/00336Materials with a smooth surface, e.g. obtained by using glass-surfaced moulds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049Nonmetal component
    • Y10T428/12056Entirely inorganic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12146Nonmetal particles in a component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/1216Continuous interengaged phases of plural metals, or oriented fiber containing
    • Y10T428/12174Mo or W containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576Boride, carbide or nitride component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • Y10T428/1284W-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12889Au-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12944Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW084107926A 1994-08-02 1995-07-31 Metallized ceramic substrate having smooth plating layer and method for producing the same TW360626B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18131094A JP3575068B2 (ja) 1994-08-02 1994-08-02 平滑なめっき層を有するセラミックスメタライズ基板およびその製造方法

Publications (1)

Publication Number Publication Date
TW360626B true TW360626B (en) 1999-06-11

Family

ID=16098448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084107926A TW360626B (en) 1994-08-02 1995-07-31 Metallized ceramic substrate having smooth plating layer and method for producing the same

Country Status (8)

Country Link
US (1) US5679469A (zh)
EP (1) EP0695732B1 (zh)
JP (1) JP3575068B2 (zh)
KR (1) KR100241688B1 (zh)
CN (1) CN1050592C (zh)
CA (1) CA2154833C (zh)
DE (1) DE69514435T2 (zh)
TW (1) TW360626B (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6783867B2 (en) * 1996-02-05 2004-08-31 Sumitomo Electric Industries, Ltd. Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
JP3845925B2 (ja) * 1996-02-05 2006-11-15 住友電気工業株式会社 窒化アルミニウム基材を用いた半導体装置用部材及びその製造方法
JPH1065294A (ja) * 1996-08-14 1998-03-06 Toshiba Corp セラミックス配線基板およびその製造方法
EP0935286A4 (en) 1997-05-26 2008-04-09 Sumitomo Electric Industries COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME
TW487742B (en) 1999-05-10 2002-05-21 Matsushita Electric Ind Co Ltd Electrode for PTC thermistor, manufacture thereof, and PTC thermistor
US6641860B1 (en) * 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
CA2313438C (en) 2000-07-06 2003-03-11 B-Con Engineering Inc. High quality optical surface and method of producing same
JP3847219B2 (ja) * 2002-06-17 2006-11-22 京セラ株式会社 配線基板
JP4979944B2 (ja) * 2003-08-26 2012-07-18 株式会社トクヤマ 素子接合用基板、素子接合基板及びその製造方法
JP2005194562A (ja) * 2004-01-06 2005-07-21 Murata Mfg Co Ltd 無電解ニッケルめっき液、及びセラミック電子部品の製造方法
US20050276992A1 (en) * 2004-06-09 2005-12-15 Tung-Hsin Wu Method for metallizing a non-metallic surface and the metallized surface structure thereof
CN1301935C (zh) * 2005-07-29 2007-02-28 四川艺精长运超硬材料有限公司 一种ain陶瓷材料的制备方法
US20070180689A1 (en) * 2006-02-08 2007-08-09 Day Michael J Nonazeotropic terpineol-based spray suspensions for the deposition of electrolytes and electrodes and electrochemical cells including the same
WO2009109652A1 (de) * 2008-03-06 2009-09-11 Ceramtec Ag Metallisierte spulenkörper (induktoren) mit hohem q-wert
KR20130062898A (ko) * 2010-05-07 2013-06-13 아사히 가라스 가부시키가이샤 소자 탑재용 기판 및 그 제조 방법
CN102045951B (zh) * 2010-11-29 2012-10-17 上海申和热磁电子有限公司 陶瓷金属化基板金属表面电镀镍金处理方法及制成的陶瓷金属化基板
CN102850091B (zh) * 2011-06-28 2014-04-30 比亚迪股份有限公司 一种陶瓷表面选择性金属化方法和一种陶瓷
CN102276152B (zh) * 2011-06-28 2013-04-24 北京科技大学 一种氧化铝陶瓷表面金属化的组合物
CN102515874A (zh) * 2011-12-26 2012-06-27 中国电子科技集团公司第十二研究所 一种氮化铝陶瓷的表面金属化方法
WO2016171530A1 (ko) * 2015-04-24 2016-10-27 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
US11236427B2 (en) 2017-12-06 2022-02-01 Polyvision Corporation Systems and methods for in-line thermal flattening and enameling of steel sheets
CN109734469A (zh) * 2018-12-31 2019-05-10 深圳硅基仿生科技有限公司 陶瓷与金属的钎焊方法
JP7449768B2 (ja) * 2020-04-23 2024-03-14 新光電気工業株式会社 セラミックス基板及びその製造方法、静電チャック、基板固定装置、半導体装置用パッケージ
CN112874042A (zh) * 2021-01-12 2021-06-01 中国人民解放军国防科技大学 一种高强高韧耐超高温金属陶瓷的制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
US4567110A (en) * 1979-11-13 1986-01-28 Massachusetts Institute Of Technology High-temperature brazed ceramic joints
JPS60142547A (ja) * 1983-12-28 1985-07-27 Ngk Spark Plug Co Ltd 無電解メツキによるicパツケ−ジの製造法
JPS62197379A (ja) * 1986-02-20 1987-09-01 株式会社東芝 窒化アルミニウム基板
JPS62225886A (ja) * 1986-03-27 1987-10-03 株式会社東芝 ルツボ
JPS6379781A (ja) * 1986-09-24 1988-04-09 電気化学工業株式会社 メタライズ板の製造方法
JPS63222085A (ja) * 1987-03-10 1988-09-14 三菱電機株式会社 窒化物系セラミツクスの金属化方法
US5010388A (en) * 1987-07-03 1991-04-23 Sumitomo Electric Industries, Ltd. Connection structure between components for semiconductor apparatus
JP2525837B2 (ja) * 1987-11-11 1996-08-21 住友電気工業株式会社 金属化面を有する窒化アルミニウム焼結体の製造方法
DD267840A1 (de) * 1987-12-09 1989-05-10 Robotron Elektronik Verfahren zur herstellung hartloetbarer duennschichtkeramiksubstrate
JP2606716B2 (ja) * 1988-01-29 1997-05-07 株式会社トーキン 窒化アルミニウム表面に金属層を形成する方法
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
JPH0679995B2 (ja) * 1988-08-18 1994-10-12 株式会社村田製作所 AlN基板のWメタライズ構造
JP2781017B2 (ja) * 1989-09-04 1998-07-30 新光電気工業株式会社 セラミックパッケージ
JP2760107B2 (ja) * 1989-12-07 1998-05-28 住友電気工業株式会社 セラミックス基板の表面構造およびその製造方法
JP2822518B2 (ja) * 1989-12-20 1998-11-11 住友電気工業株式会社 窒化アルミニウム焼結体への金属化層形成方法
US5132185A (en) * 1991-06-21 1992-07-21 General Electric Company Ceramic articles having heat-sealable metallic coatings
US5256609A (en) * 1991-12-18 1993-10-26 W. R. Grace & Co.-Conn. Clean burning green ceramic tape cast system using atactic polypropylene binder
JP2578283B2 (ja) * 1992-02-27 1997-02-05 川崎製鉄株式会社 窒化アルミニウム基板のメタライズ方法
US5306891A (en) * 1992-04-02 1994-04-26 Motorola, Inc. Laser welding process for attaching metal to ceramic substrate

Also Published As

Publication number Publication date
US5679469A (en) 1997-10-21
CA2154833A1 (en) 1996-02-03
DE69514435D1 (de) 2000-02-17
CN1050592C (zh) 2000-03-22
DE69514435T2 (de) 2000-06-15
KR100241688B1 (ko) 2000-02-01
EP0695732A2 (en) 1996-02-07
EP0695732B1 (en) 2000-01-12
JPH0840789A (ja) 1996-02-13
KR960009810A (ko) 1996-03-22
EP0695732A3 (en) 1997-02-26
CN1121499A (zh) 1996-05-01
JP3575068B2 (ja) 2004-10-06
CA2154833C (en) 2001-04-17

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