TW353236B - Photo interruptor - Google Patents
Photo interruptorInfo
- Publication number
- TW353236B TW353236B TW086115739A TW86115739A TW353236B TW 353236 B TW353236 B TW 353236B TW 086115739 A TW086115739 A TW 086115739A TW 86115739 A TW86115739 A TW 86115739A TW 353236 B TW353236 B TW 353236B
- Authority
- TW
- Taiwan
- Prior art keywords
- leads
- emitting device
- light emitting
- photodetector
- package
- Prior art date
Links
- 238000005452 bending Methods 0.000 abstract 1
- 230000003449 preventive effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27920096 | 1996-10-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW353236B true TW353236B (en) | 1999-02-21 |
Family
ID=17607836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086115739A TW353236B (en) | 1996-10-22 | 1997-10-22 | Photo interruptor |
Country Status (5)
Country | Link |
---|---|
US (1) | US6097084A (zh) |
JP (1) | JP3367078B2 (zh) |
KR (1) | KR100542869B1 (zh) |
TW (1) | TW353236B (zh) |
WO (1) | WO1998018168A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012892A (ja) * | 1998-06-17 | 2000-01-14 | Shichizun Denshi:Kk | フォトインタラプタ |
JP4534398B2 (ja) * | 2001-08-08 | 2010-09-01 | パナソニック株式会社 | ヒューズ保持具 |
US7416701B2 (en) * | 2001-09-12 | 2008-08-26 | Ecolab Inc. | Calibrator for fluorosensor |
KR100474389B1 (ko) * | 2001-12-29 | 2005-03-08 | 한국 고덴시 주식회사 | 포토 인터럽트의 제작공법 |
US7550746B2 (en) * | 2006-06-01 | 2009-06-23 | Ecolab Inc. | UV fluorometric sensor and method for using the same |
JP2009130022A (ja) * | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |
US8946875B2 (en) * | 2012-01-20 | 2015-02-03 | Intersil Americas LLC | Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems |
JP6094361B2 (ja) * | 2013-04-24 | 2017-03-15 | オムロン株式会社 | フォトセンサ |
JP6380244B2 (ja) * | 2015-06-15 | 2018-08-29 | 三菱電機株式会社 | 半導体装置、電力変換装置 |
JP6488056B1 (ja) * | 2018-07-31 | 2019-03-20 | メトラス株式会社 | 光照射装置及び光照射装置の製造方法 |
JP7271270B2 (ja) * | 2019-04-04 | 2023-05-11 | ローム株式会社 | フォトインタラプタ及び電子部品 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5242256A (en) * | 1975-10-01 | 1977-04-01 | Murata Manufacturing Co | Method of mounting electronic parts to substrate |
JPS5839087U (ja) * | 1981-09-07 | 1983-03-14 | パイオニア株式会社 | 電子部品 |
JPS5918683A (ja) * | 1982-07-22 | 1984-01-31 | Toshiba Corp | フオトインタラプタ |
JPS6181169U (zh) * | 1984-11-01 | 1986-05-29 | ||
JPS61186293U (zh) * | 1985-05-10 | 1986-11-20 | ||
JPS6278887A (ja) * | 1985-10-01 | 1987-04-11 | Sharp Corp | ホトインタラプタ |
JPH0638514B2 (ja) * | 1985-11-21 | 1994-05-18 | 日本電気株式会社 | フオトインタラプタ |
JPS62170872A (ja) * | 1986-01-23 | 1987-07-27 | Nec Corp | ホトインタラプタ |
JPS62251616A (ja) * | 1986-04-24 | 1987-11-02 | Sharp Corp | ホトインタラプタ |
JPH062301Y2 (ja) * | 1986-09-19 | 1994-01-19 | シャープ株式会社 | 部品取付装置 |
JPS6420479A (en) * | 1987-07-14 | 1989-01-24 | Nec Corp | Photosensor |
JP2778054B2 (ja) * | 1988-10-27 | 1998-07-23 | 日本電気株式会社 | 樹脂封止型フォトインタラプタ |
JPH0397947U (zh) * | 1990-01-25 | 1991-10-09 | ||
JPH0749815Y2 (ja) * | 1990-07-23 | 1995-11-13 | シャープ株式会社 | 表面実装型光結合装置 |
US5391346A (en) * | 1991-11-20 | 1995-02-21 | Rohm Co., Ltd. | Method for making molded photointerrupters |
JP2693345B2 (ja) * | 1991-11-20 | 1997-12-24 | ローム株式会社 | ホトインタラプタにおけるモールド部の成形方法及びその装置 |
JP3001750B2 (ja) * | 1992-09-09 | 2000-01-24 | シャープ株式会社 | プラグ・ジャック式光電共用伝送装置 |
JP2834984B2 (ja) * | 1993-09-20 | 1998-12-14 | ローム株式会社 | ホトインタラプタの製造方法 |
JPH07106627A (ja) * | 1993-09-29 | 1995-04-21 | Toshiba Corp | 半導体光結合装置 |
-
1997
- 1997-10-22 WO PCT/JP1997/003834 patent/WO1998018168A1/ja not_active Application Discontinuation
- 1997-10-22 US US09/077,893 patent/US6097084A/en not_active Expired - Lifetime
- 1997-10-22 JP JP51923198A patent/JP3367078B2/ja not_active Expired - Lifetime
- 1997-10-22 KR KR1019980704625A patent/KR100542869B1/ko not_active IP Right Cessation
- 1997-10-22 TW TW086115739A patent/TW353236B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1998018168A1 (fr) | 1998-04-30 |
JP3367078B2 (ja) | 2003-01-14 |
KR100542869B1 (ko) | 2006-05-23 |
KR19990072227A (ko) | 1999-09-27 |
US6097084A (en) | 2000-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |