WO2001018886A3 - Organische lichtemittierende diode und herstellungsverfahren - Google Patents
Organische lichtemittierende diode und herstellungsverfahren Download PDFInfo
- Publication number
- WO2001018886A3 WO2001018886A3 PCT/DE2000/003108 DE0003108W WO0118886A3 WO 2001018886 A3 WO2001018886 A3 WO 2001018886A3 DE 0003108 W DE0003108 W DE 0003108W WO 0118886 A3 WO0118886 A3 WO 0118886A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting diode
- organic light
- production method
- corresponding production
- glass
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011521 glass Substances 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00974302A EP1210739A2 (de) | 1999-09-09 | 2000-09-07 | Organische lichtemittierende diode und herstellungsverfahren |
US10/070,604 US6798133B1 (en) | 1999-09-09 | 2000-09-07 | Glass cover and process for producing a glass cover |
JP2001522608A JP2003509814A (ja) | 1999-09-09 | 2000-09-07 | 構成エレメントおよびその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19943148.5 | 1999-09-09 | ||
DE19943148 | 1999-09-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001018886A2 WO2001018886A2 (de) | 2001-03-15 |
WO2001018886A3 true WO2001018886A3 (de) | 2001-07-26 |
Family
ID=7921382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/003108 WO2001018886A2 (de) | 1999-09-09 | 2000-09-07 | Organische lichtemittierende diode und herstellungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US6798133B1 (de) |
EP (1) | EP1210739A2 (de) |
JP (1) | JP2003509814A (de) |
TW (1) | TW494590B (de) |
WO (1) | WO2001018886A2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10044841B4 (de) * | 2000-09-11 | 2006-11-30 | Osram Opto Semiconductors Gmbh | Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung |
DE10045204A1 (de) * | 2000-09-13 | 2002-04-04 | Siemens Ag | Träger für eine OLED und Verfahren zur Herstellung eines Trägers für eine OLED |
US6724150B2 (en) * | 2001-02-01 | 2004-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
ATE377257T1 (de) | 2001-03-22 | 2007-11-15 | Lumimove Inc | Beleuchtetes anzeigesystem und prozess |
DE10130992B4 (de) * | 2001-06-27 | 2006-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer hermetisch dichten Verbindung zwischen einem Substrat und einer Dioden-Schutzkappe |
JP2003086355A (ja) * | 2001-09-05 | 2003-03-20 | Kiko Kenji Kagi Kofun Yugenkoshi | 有機el素子の封止構造並びに封止方法及び封止装置 |
DE10219951A1 (de) | 2002-05-03 | 2003-11-13 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter |
DE10236855B4 (de) * | 2002-08-07 | 2006-03-16 | Samsung SDI Co., Ltd., Suwon | Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung |
GB0219223D0 (en) * | 2002-08-17 | 2002-09-25 | Cambridge Display Tech Ltd | Organic optoelectronic device encapsulation package |
US7224116B2 (en) | 2002-09-11 | 2007-05-29 | Osram Opto Semiconductors Gmbh | Encapsulation of active electronic devices |
US7193364B2 (en) | 2002-09-12 | 2007-03-20 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Encapsulation for organic devices |
DE10314161A1 (de) * | 2003-03-28 | 2004-10-28 | Siemens Ag | Feldeffektelektroden für organische optoelektronische Bauelemente |
US7365442B2 (en) | 2003-03-31 | 2008-04-29 | Osram Opto Semiconductors Gmbh | Encapsulation of thin-film electronic devices |
JP2005302605A (ja) * | 2004-04-14 | 2005-10-27 | Canon Inc | 半導体装置 |
FR2871651A1 (fr) * | 2004-06-09 | 2005-12-16 | Thomson Licensing Sa | Capot en verre et boitier d'encapsulation de composants electroniques dote d'un tel capot |
US7220040B2 (en) * | 2004-11-12 | 2007-05-22 | Harris Corporation | LED light engine for backlighting a liquid crystal display |
JP2007035536A (ja) * | 2005-07-29 | 2007-02-08 | Rohm Co Ltd | フラットパネルディスプレイ |
US7982214B2 (en) * | 2006-12-12 | 2011-07-19 | Koninklijke Philips Electronics N.V. | Voltage-operated layered arrangement |
TW201002126A (en) * | 2007-12-21 | 2010-01-01 | Du Pont | Encapsulation assembly for electronic devices |
US8404095B2 (en) * | 2009-06-02 | 2013-03-26 | The United States Of America, As Represented By The Secretary Of The Navy | Preparing electrodes for electroplating |
DE102011003969B4 (de) * | 2011-02-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
KR101574686B1 (ko) * | 2011-06-08 | 2015-12-07 | 엘지디스플레이 주식회사 | 유기 발광장치와 이의 제조방법 |
JP6182909B2 (ja) * | 2013-03-05 | 2017-08-23 | 株式会社リコー | 有機el発光装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1366678A (en) * | 1971-11-05 | 1974-09-11 | Gen Electric Co Ltd | Electroluminescent devices and their manufacture |
EP0776147A1 (de) * | 1995-11-24 | 1997-05-28 | Pioneer Electronic Corporation | Organisches elektrolumineszentes Element |
EP0781075A1 (de) * | 1994-09-08 | 1997-06-25 | Idemitsu Kosan Company Limited | Verfahren zur abdichtung eines organischen elektrolumineszenten elements und organisches elektrolumineszentes element |
EP0910228A1 (de) * | 1997-10-16 | 1999-04-21 | TDK Corporation | Organische elektrolumineszente Vorrichtung |
EP0969700A1 (de) * | 1998-06-12 | 2000-01-05 | TDK Corporation | Organische elektrolumineszente Anzeige-Vorrichtung |
WO2000069002A1 (en) * | 1999-05-11 | 2000-11-16 | The Dow Chemical Company | An electroluminescent or photocell device having protective packaging |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3278611B2 (ja) * | 1998-05-18 | 2002-04-30 | 日本電気株式会社 | 有機el素子の封止方法 |
US7008658B2 (en) | 2002-05-29 | 2006-03-07 | The Boc Group, Inc. | Apparatus and method for providing treatment to a continuous supply of food product by impingement |
-
2000
- 2000-09-07 JP JP2001522608A patent/JP2003509814A/ja not_active Withdrawn
- 2000-09-07 EP EP00974302A patent/EP1210739A2/de not_active Withdrawn
- 2000-09-07 US US10/070,604 patent/US6798133B1/en not_active Expired - Fee Related
- 2000-09-07 WO PCT/DE2000/003108 patent/WO2001018886A2/de not_active Application Discontinuation
- 2000-09-08 TW TW089118424A patent/TW494590B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1366678A (en) * | 1971-11-05 | 1974-09-11 | Gen Electric Co Ltd | Electroluminescent devices and their manufacture |
EP0781075A1 (de) * | 1994-09-08 | 1997-06-25 | Idemitsu Kosan Company Limited | Verfahren zur abdichtung eines organischen elektrolumineszenten elements und organisches elektrolumineszentes element |
EP0776147A1 (de) * | 1995-11-24 | 1997-05-28 | Pioneer Electronic Corporation | Organisches elektrolumineszentes Element |
EP0910228A1 (de) * | 1997-10-16 | 1999-04-21 | TDK Corporation | Organische elektrolumineszente Vorrichtung |
EP0969700A1 (de) * | 1998-06-12 | 2000-01-05 | TDK Corporation | Organische elektrolumineszente Anzeige-Vorrichtung |
WO2000069002A1 (en) * | 1999-05-11 | 2000-11-16 | The Dow Chemical Company | An electroluminescent or photocell device having protective packaging |
Also Published As
Publication number | Publication date |
---|---|
JP2003509814A (ja) | 2003-03-11 |
EP1210739A2 (de) | 2002-06-05 |
WO2001018886A2 (de) | 2001-03-15 |
US6798133B1 (en) | 2004-09-28 |
TW494590B (en) | 2002-07-11 |
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