TW351007B - Integrated electro-optical package - Google Patents

Integrated electro-optical package

Info

Publication number
TW351007B
TW351007B TW086100797A TW86100797A TW351007B TW 351007 B TW351007 B TW 351007B TW 086100797 A TW086100797 A TW 086100797A TW 86100797 A TW86100797 A TW 86100797A TW 351007 B TW351007 B TW 351007B
Authority
TW
Taiwan
Prior art keywords
leds
mounting
substrate
pads
driver
Prior art date
Application number
TW086100797A
Other languages
English (en)
Chinese (zh)
Inventor
Michael S Lebby
John W Stafford
Fred V Richard
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW351007B publication Critical patent/TW351007B/zh

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
TW086100797A 1996-03-04 1997-01-24 Integrated electro-optical package TW351007B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/610,506 US5739800A (en) 1996-03-04 1996-03-04 Integrated electro-optical package with LED display chip and substrate with drivers and central opening

Publications (1)

Publication Number Publication Date
TW351007B true TW351007B (en) 1999-01-21

Family

ID=24445293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100797A TW351007B (en) 1996-03-04 1997-01-24 Integrated electro-optical package

Country Status (5)

Country Link
US (1) US5739800A (2)
JP (1) JPH09244553A (2)
KR (1) KR100455969B1 (2)
FR (1) FR2745677A1 (2)
TW (1) TW351007B (2)

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US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6439731B1 (en) * 1999-04-05 2002-08-27 Honeywell International, Inc. Flat panel liquid crystal display
EP1076357A1 (de) * 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
JP2001092381A (ja) * 1999-09-27 2001-04-06 Nec Corp 有機ｅｌディスプレイおよびその製造方法
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP4461616B2 (ja) 2000-12-14 2010-05-12 ソニー株式会社 素子の転写方法、素子保持基板の形成方法、及び素子保持基板
JP4649745B2 (ja) 2001-02-01 2011-03-16 ソニー株式会社 発光素子の転写方法
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
US6573660B2 (en) * 2001-04-30 2003-06-03 Intel Corporation Driving emissive displays
KR100806806B1 (ko) * 2001-05-29 2008-02-22 엘지.필립스 엘시디 주식회사 평판형 표시장치의 결합장치
JP3659407B2 (ja) * 2001-08-03 2005-06-15 ソニー株式会社 発光装置
US7855708B2 (en) * 2001-09-05 2010-12-21 Honeywell International Inc. LED backlight luminance sensing for LCDs
JP2003077940A (ja) * 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2003255850A (ja) * 2002-03-05 2003-09-10 Pioneer Electronic Corp 表示パネル基板及び表示装置
JP4259979B2 (ja) 2003-10-22 2009-04-30 新光電気工業株式会社 光透過性カバー及びこれを備えたデバイス並びにそれらの製造方法
EP1999800A1 (en) * 2006-03-21 2008-12-10 Koninklijke Philips Electronics N.V. Light emitting diode module and method for the manufacturing of such an led module
TWI363432B (en) * 2007-02-26 2012-05-01 Everlight Electronics Co Ltd A structure of a light emitting diode and a method to assemble thereof
US8138027B2 (en) 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
WO2010088553A2 (en) * 2009-01-30 2010-08-05 Ndsu Research Foundation Infra-extensible led array controller for light emission and/or light sensing
US8456586B2 (en) 2009-06-11 2013-06-04 Apple Inc. Portable computer display structures
TWI423483B (zh) * 2009-09-28 2014-01-11 Silicon Base Dev Inc 光二極體封裝結構
US8408780B2 (en) * 2009-11-03 2013-04-02 Apple Inc. Portable computer housing with integral display
US8743309B2 (en) 2009-11-10 2014-06-03 Apple Inc. Methods for fabricating display structures
US9143668B2 (en) 2010-10-29 2015-09-22 Apple Inc. Camera lens structures and display structures for electronic devices
US8467177B2 (en) 2010-10-29 2013-06-18 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
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US8710630B2 (en) * 2011-07-11 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for marking the orientation of a sawed die
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US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
EP3602626B1 (en) * 2017-03-21 2023-05-03 Lumileds LLC Lighting device with led elements on a mounting element on a flat carrier and method of manufacturing the same
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
CN109064913B (zh) * 2017-07-19 2022-05-20 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元
JP2020008813A (ja) * 2018-07-12 2020-01-16 富士通コンポーネント株式会社 光モジュール
US11164934B2 (en) 2019-03-12 2021-11-02 X Display Company Technology Limited Tiled displays with black-matrix support screens
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US5612549A (en) * 1994-03-24 1997-03-18 Motorola Integrated electro-optical package
US5432358A (en) * 1994-03-24 1995-07-11 Motorola, Inc. Integrated electro-optical package
US5467215A (en) * 1994-12-21 1995-11-14 Motorola Integrated electro-optic package for reflective spatial light modulators
US5621225A (en) * 1996-01-18 1997-04-15 Motorola Light emitting diode display package

Also Published As

Publication number Publication date
US5739800A (en) 1998-04-14
JPH09244553A (ja) 1997-09-19
KR100455969B1 (ko) 2004-12-17
FR2745677A1 (fr) 1997-09-05
KR970067059A (ko) 1997-10-13

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