TW351007B - Integrated electro-optical package - Google Patents

Integrated electro-optical package

Info

Publication number
TW351007B
TW351007B TW086100797A TW86100797A TW351007B TW 351007 B TW351007 B TW 351007B TW 086100797 A TW086100797 A TW 086100797A TW 86100797 A TW86100797 A TW 86100797A TW 351007 B TW351007 B TW 351007B
Authority
TW
Taiwan
Prior art keywords
leds
mounting
substrate
pads
driver
Prior art date
Application number
TW086100797A
Other languages
Chinese (zh)
Inventor
Michael S Lebby
John W Stafford
Fred V Richard
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW351007B publication Critical patent/TW351007B/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)

Abstract

A sort of integrated electro-optical package, including a light emitting device display chip, with an array of light emitting devices formed thereon and cooperating to generate a complete image, being the LEDs positioned in rows and columns and connected to connection/mounting pads adjacent outer edges of the chip, having an opaque mounting substrate a central opening, and a driver substrate mounting pads, bump bonded to a plurality of pads and on the mounting substrate, a plurality of driver circuits connected to the LEDs through terminals on the driver substrate.A lens mounted to the mounting substrate over the array of LEDs and on a side opposite the LED display chip to magnify, or server as one element of an optical magnifier system, the complete image and produce an easily viewable virtual image.
TW086100797A 1996-03-04 1997-01-24 Integrated electro-optical package TW351007B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/610,506 US5739800A (en) 1996-03-04 1996-03-04 Integrated electro-optical package with LED display chip and substrate with drivers and central opening

Publications (1)

Publication Number Publication Date
TW351007B true TW351007B (en) 1999-01-21

Family

ID=24445293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100797A TW351007B (en) 1996-03-04 1997-01-24 Integrated electro-optical package

Country Status (5)

Country Link
US (1) US5739800A (en)
JP (1) JPH09244553A (en)
KR (1) KR100455969B1 (en)
FR (1) FR2745677A1 (en)
TW (1) TW351007B (en)

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KR100853410B1 (en) * 2001-04-11 2008-08-21 소니 가부시키가이샤 Method of transferring element, method of arranging element using same, method of manufacturing image display device
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US8138027B2 (en) * 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
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US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
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Also Published As

Publication number Publication date
JPH09244553A (en) 1997-09-19
FR2745677A1 (en) 1997-09-05
US5739800A (en) 1998-04-14
KR970067059A (en) 1997-10-13
KR100455969B1 (en) 2004-12-17

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