TWI715401B - Display incorporating optical identification function - Google Patents

Display incorporating optical identification function Download PDF

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TWI715401B
TWI715401B TW109100080A TW109100080A TWI715401B TW I715401 B TWI715401 B TW I715401B TW 109100080 A TW109100080 A TW 109100080A TW 109100080 A TW109100080 A TW 109100080A TW I715401 B TWI715401 B TW I715401B
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emitting diode
light emitting
diode chips
optical sensing
circuit substrate
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TW109100080A
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TW202123874A (en
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王世育
陳俊達
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大陸商業成科技(成都)有限公司
大陸商業成光電(深圳)有限公司
英特盛科技股份有限公司
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/14Vascular patterns

Abstract

A display incorporating an optical identification function includes a circuit substrate, a plurality of pixel micro LEDs of different colors, a plurality of infrared micro LEDs, a plurality of optical sensing elements, a flat transparent member, and a plurality of pinhole imaging elements. The flat transparent member covers the pixel micro LEDs, the infrared micro LEDs, and the optical sensing elements. The pinhole imaging elements are located on the flat transparent member. Each optical sensing element senses lights that are reflected from the object to be tested and emitted from the infrared micro-light emitting diode chips and transmitted via a corresponding one of the pinhole imaging elements.

Description

整合光學辨識功能的顯示器Display with integrated optical recognition function

本發明內容是有關於一種顯示器,且特別是有關於一種整合光學辨識功能的顯示器。The content of the present invention relates to a display, and in particular to a display that integrates an optical recognition function.

傳統用於人體靜脈的生物特徵辨識的裝置都仍是體積大、厚重、價格高的模組,而不利應用於體積輕薄的可攜式或配戴式行動電子裝置上。因此,有需要提供一種改良的生物特徵辨識的裝置,來解決習知技術所面臨的問題。Traditional devices for identifying human veins are still large, heavy, and expensive modules, which are unfavorable to be applied to portable or wearable mobile electronic devices. Therefore, there is a need to provide an improved biometric identification device to solve the problems faced by the conventional technology.

本說明書的一實施例提供一種整合光學辨識功能的顯示器,其包含電路基板、複數不同顏色的像素微型發光二極體晶片、複數紅外線微型發光二極體晶片、複數光學感測元件、平板透光件以及複數針孔成像元件。平板透光件覆蓋於該些像素微型發光二極體晶片、該些紅外線微型發光二極體晶片以及該些光學感測元件上。該些針孔成像元件設置於平板透光件上。每一光學感測元件通過該些針孔成像元件其中之一對應者,感測來自待測物反射該些紅外線微型發光二極體晶片所發出的光線。An embodiment of this specification provides a display with integrated optical recognition function, which includes a circuit substrate, a plurality of pixel micro-light-emitting diode chips of different colors, a plurality of infrared micro-light-emitting diode chips, a plurality of optical sensing elements, and a flat panel Pieces and plural pinhole imaging elements. The flat light-transmitting member covers the pixel micro-light-emitting diode chips, the infrared micro-light-emitting diode chips, and the optical sensing elements. The pinhole imaging elements are arranged on the flat light-transmitting part. Each optical sensing element passes through one of the pinhole imaging elements to sense the light emitted by the infrared micro light emitting diode chips from the object under test.

在本說明書的其他實施例中,每一針孔成像元件於電路基板的垂直投影不覆蓋該些像素微型發光二極體晶片。In other embodiments of this specification, the vertical projection of each pinhole imaging element on the circuit substrate does not cover the pixel micro light emitting diode chip.

在本說明書的其他實施例中,每一針孔成像元件於電路基板的垂直投影不覆蓋該些紅外線微型發光二極體晶片。In other embodiments of this specification, the vertical projection of each pinhole imaging element on the circuit substrate does not cover the infrared micro light emitting diode chips.

在本說明書的其他實施例中,該些像素微型發光二極體晶片包含紅色、綠色以及藍色的像素微型發光二極體晶片。In other embodiments of this specification, the pixel micro light emitting diode chips include red, green and blue pixel micro light emitting diode chips.

在本說明書的其他實施例中,該些光學感測元件為互補式金屬氧化物半導體元件。In other embodiments of this specification, the optical sensing devices are complementary metal oxide semiconductor devices.

在本說明書的其他實施例中,平板透光件具有均勻的厚度。In other embodiments of this specification, the flat light-transmitting member has a uniform thickness.

在本說明書的其他實施例中,每一光學感測元件對準該些針孔成像元件其中之一對應者。In other embodiments of this specification, each optical sensor element is aligned with one of the pinhole imaging elements.

在本說明書的其他實施例中,每一光學感測元件被該些紅外線微型發光二極體晶片其中之一緊鄰者以及該些像素微型發光二極體晶片其中之複數緊鄰者所環繞。In other embodiments of the present specification, each optical sensing element is surrounded by the adjacent one of the infrared micro LED chips and the adjacent ones of the pixel micro LED chips.

在本說明書的其他實施例中,每一像素微型發光二極體晶片之寬度範圍從1微米到100微米。In other embodiments of this specification, the width of each pixel of the micro light emitting diode chip ranges from 1 micrometer to 100 micrometers.

在本說明書的其他實施例中,每一紅外線微型發光二極體晶片之寬度範圍從1微米到100微米。In other embodiments of this specification, the width of each infrared micro light emitting diode chip ranges from 1 micrometer to 100 micrometers.

綜合以上所述,本發明之整合光學辨識功能的發光二極體顯示器將像素微型發光二極體晶片、紅外線微型發光二極體晶片以及微型光學感測元件一同整合在電路基板上,並改以微型針孔成像元件取代曲面光學透鏡,藉以減少顯示器的整體厚度。因此,顯示器便能夠將光學辨識功能整合於其中,而利應用於體積輕薄的可攜式或配戴式行動電子裝置上。In summary, the light-emitting diode display with integrated optical identification function of the present invention integrates pixel micro-light-emitting diode chips, infrared micro-light-emitting diode chips, and micro-optical sensing elements on a circuit substrate, and is modified to Miniature pinhole imaging elements replace curved optical lenses to reduce the overall thickness of the display. Therefore, the display can integrate the optical recognition function into it, and it can be applied to portable or wearable mobile electronic devices with a small volume.

以下將以實施方式對上述之說明作詳細的描述,並對本發明之技術方案提供更進一步的解釋。Hereinafter, the above description will be described in detail by way of implementation, and further explanation will be provided for the technical solution of the present invention.

請同時參照第1、2圖,第1圖繪示依照本發明之一實施例的整合光學辨識功能的發光二極體顯示器的示意圖(移除平板透光件與針孔成像元件等元件),第2圖繪示依照本發明之一實施例的整合光學辨識功能的發光二極體顯示器的剖面示意圖。Please refer to Figures 1 and 2 at the same time. Figure 1 is a schematic diagram of a light-emitting diode display with integrated optical recognition function according to an embodiment of the present invention (with flat light-transmitting parts and pinhole imaging elements removed), FIG. 2 is a schematic cross-sectional view of a light-emitting diode display with integrated optical recognition function according to an embodiment of the present invention.

發光二極體顯示器100包含複數不同顏色的像素微型發光二極體晶片(例如紅色微型發光二極體晶片106R、綠色微型發光二極體晶片106G以及藍色微型發光二極體晶片106B),作為其顯示像素以實現其顯示功能。顯示器的光學辨識功能另外透過光學感測元件104、紅外線微型發光二極體晶片108以及針孔成像元件112等實現相關功能。The light emitting diode display 100 includes a plurality of pixel micro light emitting diode chips of different colors (for example, red micro light emitting diode chip 106R, green micro light emitting diode chip 106G, and blue micro light emitting diode chip 106B), as Its display pixels to achieve its display function. The optical recognition function of the display additionally realizes related functions through the optical sensing element 104, the infrared micro light emitting diode chip 108, and the pinhole imaging element 112.

在本實施例中,光學感測元件104可以是互補式金屬氧化物半導體元件(CMOS sensor),但不以此為限。In this embodiment, the optical sensing element 104 may be a complementary metal oxide semiconductor element (CMOS sensor), but it is not limited to this.

在本實施例中,每一光學感測元件104被緊鄰的紅外線微型發光二極體晶片108以及緊鄰的紅色微型發光二極體晶片106R、綠色微型發光二極體晶片106G以及藍色微型發光二極體晶片106B所環繞,但不以此為限。In this embodiment, each optical sensing element 104 is connected to the infrared micro light emitting diode chip 108 and the adjacent red micro light emitting diode chip 106R, green micro light emitting diode chip 106G, and blue micro light emitting diode chip. The polar body chip 106B is surrounded, but not limited to this.

具體而言,上述的晶片與元件均設置於電路基板102上,以獲得電源並受其相關功能的控制。電路基板102可以是印刷電路板或軟性電路板,但不以此為限。Specifically, the aforementioned chips and components are all disposed on the circuit substrate 102 to obtain power and be controlled by their related functions. The circuit substrate 102 may be a printed circuit board or a flexible circuit board, but is not limited to this.

這裡所謂的「微型」意謂著這些晶片的尺寸均在微米等級。具體而言,像素微型發光二極體晶片106之寬度W2的範圍從1微米到100微米,紅外線微型發光二極體晶片108之寬度W3的範圍從1微米到100微米。光學感測元件104的尺寸也可以是微米等級的,即光學感測元件104之寬度W1的範圍也在1微米到100微米。The so-called "micro" here means that the size of these chips are all in the micron level. Specifically, the width W2 of the pixel micro light emitting diode chip 106 ranges from 1 micrometer to 100 micrometers, and the width W3 of the infrared micro light emitting diode chip 108 ranges from 1 micrometer to 100 micrometers. The size of the optical sensing element 104 can also be on the order of micrometers, that is, the width W1 of the optical sensing element 104 also ranges from 1 micrometer to 100 micrometers.

當上述的晶片與元件固晶於電路基板102上後,以封裝膠109(例如光學透光膠)將這些晶片與元件密封以杜絕水氣,再以平板透光件110覆蓋於封裝膠109上。在本實施例中,平板透光件110具有一均勻的厚度T,但不以此為限。After the above-mentioned chips and components are solidified on the circuit substrate 102, the chips and components are sealed with encapsulant 109 (for example, optically transparent glue) to prevent moisture, and then the flat transparent member 110 is covered on the encapsulant 109 . In this embodiment, the flat transparent member 110 has a uniform thickness T, but it is not limited to this.

在平板透光件110上設置複數微型的針孔成像元件112。每一針孔成像元件112係對準一光學感測元件104,換言之,每一針孔成像元件112於電路基板102的垂直投影覆蓋或重疊於光學感測元件104。因此,每一光學感測元件104通過對應針孔成像元件112(的針孔112a)感測來自待測物150(例如人體皮膚下的靜脈組織)反射紅外線微型發光二極體晶片108所發出的光線,即能感測待測物150的局部影像。電路基板102上的多個光學感測元件104、多個紅外線微型發光二極體晶片108以及多個針孔成像元件112所構成的陣列,即能執行待測物150之大面積感應、靜脈辨識或非接觸式辨識。A plurality of micro pinhole imaging elements 112 are provided on the flat light-transmitting member 110. Each pinhole imaging element 112 is aligned with an optical sensing element 104. In other words, the vertical projection of each pinhole imaging element 112 on the circuit substrate 102 covers or overlaps the optical sensing element 104. Therefore, each optical sensing element 104 senses the infrared micro light emitting diode chip 108 emitted from the object 150 (such as the vein tissue under the skin of the human body) reflected by the corresponding pinhole imaging element 112 (the pinhole 112a) The light can sense the partial image of the object 150 under test. The array of multiple optical sensing elements 104, multiple infrared micro light emitting diode chips 108 and multiple pinhole imaging elements 112 on the circuit substrate 102 can perform large-area sensing and vein recognition of the test object 150 Or non-contact identification.

針孔成像元件112是以針孔成像原理將測待測物150的影像投射至光學感測元件104。針孔成像元件112除其針孔112a外均為阻光,因此需控制其佔平板透光件110表面的比例。The pinhole imaging element 112 projects the image of the test object 150 to the optical sensing element 104 based on the pinhole imaging principle. The pinhole imaging element 112 is light-blocking except for the pinhole 112a, so it is necessary to control its proportion to the surface of the flat light-transmitting member 110.

雖然平板透光件110上設置複數針孔成像元件112,但控制針孔成像元件112只佔平板透光件110的表面小部份的比例,能使針孔成像元件112不會影響像素微型發光二極體晶片(例如紅色微型發光二極體晶片106R、綠色微型發光二極體晶片106G以及藍色微型發光二極體晶片106B)的顯像功能。在本實施例中,每一針孔成像元件112於電路基板102的垂直投影不覆蓋任何像素微型發光二極體晶片106,但不以此為限。在本實施例中,每一針孔成像元件112於電路基板102的垂直投影不覆蓋任何紅外線微型發光二極體晶片108,但不以此為限。Although a plurality of pinhole imaging elements 112 are provided on the flat light-transmitting member 110, the proportion of the pinhole imaging element 112 that only occupies a small part of the surface of the flat light-transmitting member 110 can be controlled so that the pinhole imaging element 112 will not affect the micro-luminescence of pixels The imaging function of the diode chip (for example, the red micro light emitting diode chip 106R, the green micro light emitting diode chip 106G, and the blue micro light emitting diode chip 106B). In this embodiment, the vertical projection of each pinhole imaging element 112 on the circuit substrate 102 does not cover any pixel micro light emitting diode chip 106, but it is not limited to this. In this embodiment, the vertical projection of each pinhole imaging element 112 on the circuit substrate 102 does not cover any infrared micro light emitting diode chip 108, but it is not limited to this.

請參照第3圖,其繪示依照本發明之一實施例整合光學辨識功能的腕帶之應用示意圖。當前述的整合光學辨識功能的顯示器應用於腕帶200時,即能用以感測手部160靜脈組織的生物特徵,而能達成各種相關的應用。Please refer to FIG. 3, which shows a schematic diagram of the application of the wristband with integrated optical identification function according to an embodiment of the present invention. When the aforementioned display with integrated optical recognition function is applied to the wristband 200, it can be used to sense the biological characteristics of the vein tissue of the hand 160, and various related applications can be achieved.

請參照第4圖,其繪示依照本發明之一實施例整合光學辨識功能的行動電話之應用示意圖。當前述的整合光學辨識功能的顯示器應用於行動電話300時,使其螢幕302能用以感測手部160靜脈組織的生物特徵,而能達成各種相關的應用。Please refer to FIG. 4, which illustrates an application schematic diagram of a mobile phone with integrated optical recognition function according to an embodiment of the present invention. When the aforementioned display with integrated optical recognition function is applied to the mobile phone 300, its screen 302 can be used to sense the biological characteristics of the vein tissue of the hand 160, and various related applications can be achieved.

請參照第5圖,其繪示依照本發明之一實施例整合光學辨識功能的門禁管制裝置之應用示意圖。當前述的整合光學辨識功能的顯示器應用於門禁管制裝置400時,使其面板402能用以感測手部160靜脈組織的生物特徵,而能達成各種相關的應用。Please refer to FIG. 5, which illustrates an application schematic diagram of an access control device with integrated optical identification function according to an embodiment of the present invention. When the aforementioned display with integrated optical recognition function is applied to the access control device 400, its panel 402 can be used to sense the biological characteristics of the vein tissue of the hand 160, and various related applications can be achieved.

綜合以上,本發明之整合光學辨識功能的發光二極體顯示器將像素微型發光二極體晶片、紅外線微型發光二極體晶片以及微型光學感測元件一同整合在電路基板上,並改以微型針孔成像元件取代曲面光學透鏡,藉以減少顯示器的整體厚度。因此,顯示器便能夠將光學辨識功能整合於其中,而利應用於體積輕薄的可攜式或配戴式行動電子裝置上。In summary, the light-emitting diode display with integrated optical identification function of the present invention integrates pixel micro-light-emitting diode chips, infrared micro-light-emitting diode chips, and micro-optical sensing elements on a circuit substrate, and uses micro-needles. The aperture imaging element replaces the curved optical lens, thereby reducing the overall thickness of the display. Therefore, the display can integrate the optical recognition function into it, and it can be applied to portable or wearable mobile electronic devices with a small volume.

雖然本發明已以較佳實施例發明如上,然其並非用以限定本發明,任何該技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been invented by the preferred embodiment as described above, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent scope.

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附符號之說明如下: 100:顯示器 102:電路基板 104:光學感測元件 106:像素微型發光二極體晶片 106R:紅色微型發光二極體晶片 106G:綠色微型發光二極體晶片 106B:藍色微型發光二極體晶片 108:紅外線微型發光二極體晶片 109:封裝膠 110:平板透光件 112:針孔成像元件 112a:針孔 150:待測物 160:手部 200:腕帶 300:行動電話 302:螢幕 400:門禁管制裝置 402:面板 T:厚度 W1:寬度 W2:寬度 W3:寬度 In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the description of the attached symbols is as follows: 100: display 102: circuit board 104: Optical sensing element 106: Pixel micro light emitting diode chip 106R: Red miniature LED chip 106G: Green micro light emitting diode chip 106B: blue miniature light emitting diode chip 108: Infrared micro light emitting diode chip 109: Encapsulation glue 110: Flat transparent parts 112: Pinhole imaging element 112a: pinhole 150: DUT 160: hand 200: Wristband 300: mobile phone 302: screen 400: Access control device 402: Panel T: thickness W1: width W2: width W3: width

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖係繪示依照本發明之一實施例的整合光學辨識功能的微型發光二極體顯示器的示意圖;以及 第2圖係繪示依照本發明之一實施例的整合光學辨識功能的微型發光二極體顯示器的剖面示意圖; 第3圖係繪示依照本發明之一實施例整合光學辨識功能的腕帶之應用示意圖; 第4圖係繪示依照本發明之一實施例整合光學辨識功能的行動電話之應用示意圖;以及 第5圖係繪示依照本發明之一實施例整合光學辨識功能的門禁管制裝置之應用示意圖。 In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: FIG. 1 is a schematic diagram of a miniature light-emitting diode display integrated with an optical recognition function according to an embodiment of the present invention; and Figure 2 is a schematic cross-sectional view of a miniature light emitting diode display with integrated optical recognition function according to an embodiment of the present invention; Figure 3 is a schematic diagram showing the application of a wristband with integrated optical identification function according to an embodiment of the present invention; Fig. 4 is a schematic diagram of the application of a mobile phone with integrated optical recognition function according to an embodiment of the present invention; and FIG. 5 is a schematic diagram showing the application of an access control device with integrated optical identification function according to an embodiment of the present invention.

100:顯示器 100: display

102:電路基板 102: circuit board

104:光學感測元件 104: Optical sensing element

106:像素微型發光二極體晶片 106: Pixel micro light emitting diode chip

108:紅外線微型發光二極體晶片 108: Infrared micro light emitting diode chip

109:封裝膠 109: Encapsulation glue

110:平板透光件 110: Flat transparent parts

112:針孔成像元件 112: Pinhole imaging element

112a:針孔 112a: pinhole

150:待測物 150: DUT

T:厚度 T: thickness

W1:寬度 W1: width

W2:寬度 W2: width

W3:寬度 W3: width

Claims (7)

一種整合光學辨識功能的顯示器,包含:電路基板;複數不同顏色的像素微型發光二極體晶片,設置於該電路基板,其中每一該像素微型發光二極體晶片之寬度範圍從1微米到100微米;複數紅外線微型發光二極體晶片,設置於該電路基板,其中每一該紅外線微型發光二極體晶片之寬度範圍從1微米到100微米;複數光學感測元件,設置於該電路基板,其中每一該光學感測元件之寬度範圍從1微米到100微米;平板透光件,覆蓋於該些像素微型發光二極體晶片、該些紅外線微型發光二極體晶片以及該些光學感測元件上,其中該些像素微型發光二極體晶片、該些紅外線微型發光二極體晶片以及該些光學感測元件位於該電路基板與該平板透光件之間;以及複數針孔成像元件,設置於該平板透光件上,其中每一該光學感測元件對準該些針孔成像元件其中之一對應者,其中每一該光學感測元件通過該些針孔成像元件其中之一對應者,感測來自待測物反射該些紅外線微型發光二極體晶片所發出的光線,每一該針孔成像元件裸露地設置於該平板透光件上,用以直接接收待測物反射的光線。 A display with integrated optical identification function, comprising: a circuit substrate; a plurality of pixel micro light emitting diode chips of different colors are arranged on the circuit substrate, wherein the width of each pixel micro light emitting diode chip ranges from 1 micron to 100 Micrometers; a plurality of infrared micro light emitting diode chips are arranged on the circuit substrate, wherein the width of each of the infrared micro light emitting diode chips ranges from 1 micron to 100 micrometers; a plurality of optical sensing elements are arranged on the circuit substrate, The width of each of the optical sensing elements ranges from 1 micron to 100 micrometers; the flat light-transmitting part covers the pixel micro LED chips, the infrared micro LED chips, and the optical sensors On the device, the pixel micro-light-emitting diode chips, the infrared micro-light-emitting diode chips, and the optical sensing elements are located between the circuit substrate and the flat light-transmitting part; and a plurality of pinhole imaging elements, Disposed on the flat light-transmitting member, wherein each of the optical sensing elements is aligned with one of the pinhole imaging elements, and each of the optical sensing elements is corresponding to one of the pinhole imaging elements Furthermore, to sense the light emitted by the infrared micro light-emitting diode chips from the object under test, each of the pinhole imaging elements is exposed on the flat light-transmitting part to directly receive the light reflected by the object under test Light. 如請求項1所述之顯示器,其中每一該針孔成像元件於該電路基板的垂直投影不覆蓋該些像素微型發光二極 體晶片。 The display according to claim 1, wherein the vertical projection of each pinhole imaging element on the circuit substrate does not cover the pixel micro light emitting diodes Body wafer. 如請求項1所述之顯示器,其中每一該針孔成像元件於該電路基板的垂直投影不覆蓋該些紅外線微型發光二極體晶片。 The display according to claim 1, wherein the vertical projection of each pinhole imaging element on the circuit substrate does not cover the infrared micro light emitting diode chips. 如請求項1所述之顯示器,其中該些像素微型發光二極體晶片包含紅色、綠色以及藍色的像素微型發光二極體晶片。 The display according to claim 1, wherein the pixel micro light emitting diode chips comprise red, green and blue pixel micro light emitting diode chips. 如請求項1所述之顯示器,其中該些光學感測元件為互補式金屬氧化物半導體元件。 The display according to claim 1, wherein the optical sensing elements are complementary metal oxide semiconductor elements. 如請求項1所述之顯示器,其中該平板透光件具有均勻的厚度。 The display according to claim 1, wherein the flat light-transmitting member has a uniform thickness. 如請求項1所述之顯示器,其中每一該光學感測元件被該些紅外線微型發光二極體晶片其中之一緊鄰者以及該些像素微型發光二極體晶片其中之複數緊鄰者所環繞。 The display according to claim 1, wherein each of the optical sensing elements is surrounded by an adjacent one of the infrared micro light emitting diode chips and a plurality of adjacent ones of the pixel micro light emitting diode chips.
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