TW345707B - Semiconductor device packages - Google Patents

Semiconductor device packages

Info

Publication number
TW345707B
TW345707B TW086110276A TW86110276A TW345707B TW 345707 B TW345707 B TW 345707B TW 086110276 A TW086110276 A TW 086110276A TW 86110276 A TW86110276 A TW 86110276A TW 345707 B TW345707 B TW 345707B
Authority
TW
Taiwan
Prior art keywords
chip
internal
package
leads
semiconductor device
Prior art date
Application number
TW086110276A
Other languages
English (en)
Inventor
Hyeong Kim Tae
Sun Rho Hee
Sik Cho In
Su Yoo Gi
Hyeop Lee Sang
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW345707B publication Critical patent/TW345707B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW086110276A 1996-10-04 1997-07-19 Semiconductor device packages TW345707B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960044028A KR100195513B1 (ko) 1996-10-04 1996-10-04 반도체 칩 패키지

Publications (1)

Publication Number Publication Date
TW345707B true TW345707B (en) 1998-11-21

Family

ID=19476280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110276A TW345707B (en) 1996-10-04 1997-07-19 Semiconductor device packages

Country Status (7)

Country Link
US (1) US5932923A (zh)
JP (1) JP3155729B2 (zh)
KR (1) KR100195513B1 (zh)
CN (1) CN1094257C (zh)
DE (1) DE19728617C2 (zh)
FR (1) FR2754387B1 (zh)
TW (1) TW345707B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515359B1 (en) * 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6329705B1 (en) * 1998-05-20 2001-12-11 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes
TW419810B (en) * 1998-06-18 2001-01-21 Hitachi Ltd Semiconductor device
JP3105200B2 (ja) * 1998-10-07 2000-10-30 沖電気工業株式会社 半導体装置およびその製造方法
US6278175B1 (en) * 2000-01-21 2001-08-21 Micron Technology, Inc. Leadframe alteration to direct compound flow into package
IT1319406B1 (it) * 2000-04-28 2003-10-10 St Microelectronics Srl Involucro protettivo per il contenimento di un circuito integrato susemiconduttore.
US6414379B1 (en) * 2000-09-29 2002-07-02 Siliconware Precision Industries Co., Ltd. Structure of disturbing plate having down set
JP2006024812A (ja) * 2004-07-09 2006-01-26 Sony Corp 半導体素子搭載のリードフレームとそれを用いた半導体装置
JP2006066008A (ja) * 2004-08-30 2006-03-09 Hitachi Global Storage Technologies Netherlands Bv 磁気ディスクおよび磁気ディスクの製造方法
JP4953619B2 (ja) * 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
US7927923B2 (en) * 2006-09-25 2011-04-19 Micron Technology, Inc. Method and apparatus for directing molding compound flow and resulting semiconductor device packages
JP2017170627A (ja) * 2016-03-18 2017-09-28 富士電機株式会社 モールド製品の製造方法およびモールド製品
CN108735701B (zh) * 2017-04-13 2021-12-24 恩智浦美国有限公司 具有用于包封期间的毛刺缓解的虚设引线的引线框架
JP7109347B2 (ja) * 2018-12-03 2022-07-29 三菱電機株式会社 半導体装置および電力変換装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168251A (ja) * 1985-01-21 1986-07-29 Mitsubishi Electric Corp 半導体装置
JPS63265454A (ja) * 1987-12-24 1988-11-01 Nec Corp 半導体装置
JPH01192154A (ja) * 1988-01-28 1989-08-02 Nippon Motoroola Kk リードフレーム
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
JPH0468557A (ja) * 1990-07-10 1992-03-04 Hitachi Ltd 半導体装置及びそのモールド用金型
JPH04239164A (ja) * 1991-01-11 1992-08-27 Fujitsu Ltd 半導体装置
JP3006285B2 (ja) * 1991-05-27 2000-02-07 株式会社日立製作所 半導体装置
US5293065A (en) * 1992-08-27 1994-03-08 Texas Instruments, Incorporated Lead frame having an outlet with a larger cross sectional area than the inlet
JPH0846119A (ja) * 1994-08-02 1996-02-16 Sony Corp リードフレームおよびこれを用いた半導体装置

Also Published As

Publication number Publication date
DE19728617A1 (de) 1998-04-09
KR19980025782A (ko) 1998-07-15
FR2754387A1 (fr) 1998-04-10
JPH10112518A (ja) 1998-04-28
JP3155729B2 (ja) 2001-04-16
US5932923A (en) 1999-08-03
DE19728617C2 (de) 2002-10-31
CN1094257C (zh) 2002-11-13
KR100195513B1 (ko) 1999-06-15
CN1179011A (zh) 1998-04-15
FR2754387B1 (fr) 2003-08-08

Similar Documents

Publication Publication Date Title
TW345707B (en) Semiconductor device packages
TW358234B (en) Semiconductor device package having twice bent tie bar and a small die pad
KR100214463B1 (ko) 클립형 리드프레임과 이를 사용한 패키지의 제조방법
TW344873B (en) Semiconductor device, manufacture thereof, and its mounting method
TW200512944A (en) Overmolded optical package
TW200607034A (en) Power semiconductor package
TW344889B (en) Lead frame with increased strength and manufacture of semiconductor device
TW200503209A (en) Semiconductor package
TW353790B (en) Resin packaged type semiconductor device having a heat sink and its manufacturing process
TW200518297A (en) Structure of chip package and the process thereof
TW545698U (en) LED packaging structure with a static charge protecting device
TW200419764A (en) Multi-chips stacked package
WO2005124858A3 (en) Package and method for packaging an integrated circuit die
EP1235275A4 (en) SEMICONDUCTOR DEVICE
EP1111738A4 (en) SEMICONDUCTOR DEVICE AND SUBSTRATE APPLYING THEREFOR
TW344870B (en) Semiconductor package and manufacturing method of lead frame
EP0902475A3 (en) A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
SG77704A1 (en) Semiconductor device and method of fabricating the same
TW200746386A (en) System in package
TWI256091B (en) A semiconductor package having stacked chip package and a method
EP0872886A3 (en) Plastic-encapsulated semiconductor device and fabrication method thereof
TW200711151A (en) Multi-chip package structure
TW430956B (en) Method for manufacturing semiconductor device
TW330337B (en) Semiconductor package with detached die pad
US20080191330A1 (en) Stacked semiconductor package

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees