TW337597B - A heat treatment and the processing device - Google Patents

A heat treatment and the processing device

Info

Publication number
TW337597B
TW337597B TW084103144A TW84103144A TW337597B TW 337597 B TW337597 B TW 337597B TW 084103144 A TW084103144 A TW 084103144A TW 84103144 A TW84103144 A TW 84103144A TW 337597 B TW337597 B TW 337597B
Authority
TW
Taiwan
Prior art keywords
heat treatment
holder
processing device
vertical
aforementioned
Prior art date
Application number
TW084103144A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsu Oozawa
Hiroyuki Iwai
Nobugo Watanabe
Tsutomu Haraoka
Masaru Nakao
Original Assignee
Tokyo Electron Co Ltd
Tokyo Electron Tohoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8240094A external-priority patent/JP3273694B2/ja
Priority claimed from JP08909994A external-priority patent/JP3565577B2/ja
Priority claimed from JP17608094A external-priority patent/JP3495788B2/ja
Application filed by Tokyo Electron Co Ltd, Tokyo Electron Tohoku Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW337597B publication Critical patent/TW337597B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Furnace Details (AREA)
  • Tunnel Furnaces (AREA)
TW084103144A 1994-03-29 1995-03-31 A heat treatment and the processing device TW337597B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8240094A JP3273694B2 (ja) 1994-03-29 1994-03-29 処理装置及び処理方法
JP08909994A JP3565577B2 (ja) 1994-04-04 1994-04-04 処理装置
JP17608094A JP3495788B2 (ja) 1994-07-05 1994-07-05 熱処理方法

Publications (1)

Publication Number Publication Date
TW337597B true TW337597B (en) 1998-08-01

Family

ID=27303906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084103144A TW337597B (en) 1994-03-29 1995-03-31 A heat treatment and the processing device

Country Status (4)

Country Link
US (1) US5645419A (ko)
EP (1) EP0675523A3 (ko)
KR (1) KR100269414B1 (ko)
TW (1) TW337597B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493627B (zh) * 2012-09-10 2015-07-21 Koyo Thermo Sys Co Ltd Heat treatment device

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527390A (en) * 1993-03-19 1996-06-18 Tokyo Electron Kabushiki Treatment system including a plurality of treatment apparatus
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
KR100203782B1 (ko) * 1996-09-05 1999-06-15 윤종용 반도체 웨이퍼 열처리장치
US6540466B2 (en) 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
US5964561A (en) * 1996-12-11 1999-10-12 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JPH10233426A (ja) * 1997-02-20 1998-09-02 Tokyo Electron Ltd 自動ティ−チング方法
TW415913B (en) * 1997-04-03 2000-12-21 Tokyo Electron Ltd Elevating mechanism and carrier conveying apparatus
US6499933B2 (en) 1997-04-03 2002-12-31 Tokyo Electron Limited Elevating mechanism, carrier conveying apparatus and heat treatment installation
US6252202B1 (en) 1998-02-10 2001-06-26 Jeneric/Pentron, Inc. Furnace for heat treatment of dental materials
US6079927A (en) * 1998-04-22 2000-06-27 Varian Semiconductor Equipment Associates, Inc. Automated wafer buffer for use with wafer processing equipment
JP3664897B2 (ja) * 1998-11-18 2005-06-29 東京エレクトロン株式会社 縦型熱処理装置
US6442867B2 (en) * 2000-01-04 2002-09-03 Texas Instruments Incorporated Apparatus and method for cleaning a vertical furnace pedestal and cap
US6395648B1 (en) * 2000-02-25 2002-05-28 Wafermasters, Inc. Wafer processing system
TW501194B (en) * 2000-08-23 2002-09-01 Tokyo Electron Ltd Processing system for object to be processed
US20020090282A1 (en) 2001-01-05 2002-07-11 Applied Materials, Inc. Actuatable loadport system
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
JP4124449B2 (ja) * 2003-03-28 2008-07-23 大日本スクリーン製造株式会社 基板処理装置
KR100527671B1 (ko) * 2004-02-19 2005-11-28 삼성전자주식회사 웨이퍼 상에 막을 형성하는 방법
US9169510B2 (en) * 2005-06-21 2015-10-27 The Trustees Of Columbia University In The City Of New York Pyrosequencing methods and related compositions
JP5304647B2 (ja) * 2007-06-28 2013-10-02 富士通セミコンダクター株式会社 熱処理装置、及び半導体装置の製造方法
JP2012054392A (ja) * 2010-09-01 2012-03-15 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP5770042B2 (ja) * 2011-08-04 2015-08-26 東京エレクトロン株式会社 熱処理装置
JP6323141B2 (ja) * 2014-04-18 2018-05-16 東京エレクトロン株式会社 基板処理装置
CN111790582B (zh) * 2020-07-28 2021-06-29 苏州市鑫达试验设备有限公司 一种立式多层高精度多腔式加热装置
CN112071775A (zh) * 2020-08-14 2020-12-11 深圳第三代半导体研究院 一种用于功率器件封装的烧结设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
US5181819A (en) * 1990-10-09 1993-01-26 Tokyo Electron Sagami Limited Apparatus for processing semiconductors
JPH04133422A (ja) * 1990-09-26 1992-05-07 Tokyo Electron Sagami Ltd 縦型熱処理装置
US5219464A (en) * 1990-10-09 1993-06-15 Tokyo Electron Limited Clean air apparatus
US5261167A (en) * 1990-09-27 1993-11-16 Tokyo Electron Sagami Limited Vertical heat treating apparatus
JP2963950B2 (ja) * 1990-10-11 1999-10-18 東京エレクトロン株式会社 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493627B (zh) * 2012-09-10 2015-07-21 Koyo Thermo Sys Co Ltd Heat treatment device

Also Published As

Publication number Publication date
US5645419A (en) 1997-07-08
KR950034405A (ko) 1995-12-28
KR100269414B1 (ko) 2001-01-15
EP0675523A3 (en) 1995-11-15
EP0675523A2 (en) 1995-10-04

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Legal Events

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