TW337597B - A heat treatment and the processing device - Google Patents
A heat treatment and the processing deviceInfo
- Publication number
- TW337597B TW337597B TW084103144A TW84103144A TW337597B TW 337597 B TW337597 B TW 337597B TW 084103144 A TW084103144 A TW 084103144A TW 84103144 A TW84103144 A TW 84103144A TW 337597 B TW337597 B TW 337597B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat treatment
- holder
- processing device
- vertical
- aforementioned
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Furnace Charging Or Discharging (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
- Furnace Details (AREA)
- Tunnel Furnaces (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8240094A JP3273694B2 (ja) | 1994-03-29 | 1994-03-29 | 処理装置及び処理方法 |
JP08909994A JP3565577B2 (ja) | 1994-04-04 | 1994-04-04 | 処理装置 |
JP17608094A JP3495788B2 (ja) | 1994-07-05 | 1994-07-05 | 熱処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW337597B true TW337597B (en) | 1998-08-01 |
Family
ID=27303906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084103144A TW337597B (en) | 1994-03-29 | 1995-03-31 | A heat treatment and the processing device |
Country Status (4)
Country | Link |
---|---|
US (1) | US5645419A (zh) |
EP (1) | EP0675523A3 (zh) |
KR (1) | KR100269414B1 (zh) |
TW (1) | TW337597B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493627B (zh) * | 2012-09-10 | 2015-07-21 | Koyo Thermo Sys Co Ltd | Heat treatment device |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5527390A (en) * | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
KR100203782B1 (ko) * | 1996-09-05 | 1999-06-15 | 윤종용 | 반도체 웨이퍼 열처리장치 |
US5964561A (en) * | 1996-12-11 | 1999-10-12 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6540466B2 (en) | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
JPH10233426A (ja) * | 1997-02-20 | 1998-09-02 | Tokyo Electron Ltd | 自動ティ−チング方法 |
US6499933B2 (en) * | 1997-04-03 | 2002-12-31 | Tokyo Electron Limited | Elevating mechanism, carrier conveying apparatus and heat treatment installation |
TW415913B (en) * | 1997-04-03 | 2000-12-21 | Tokyo Electron Ltd | Elevating mechanism and carrier conveying apparatus |
US6252202B1 (en) | 1998-02-10 | 2001-06-26 | Jeneric/Pentron, Inc. | Furnace for heat treatment of dental materials |
US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
JP3664897B2 (ja) | 1998-11-18 | 2005-06-29 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
US6442867B2 (en) * | 2000-01-04 | 2002-09-03 | Texas Instruments Incorporated | Apparatus and method for cleaning a vertical furnace pedestal and cap |
US6395648B1 (en) * | 2000-02-25 | 2002-05-28 | Wafermasters, Inc. | Wafer processing system |
TW501194B (en) * | 2000-08-23 | 2002-09-01 | Tokyo Electron Ltd | Processing system for object to be processed |
US20020090282A1 (en) | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
JP4124449B2 (ja) * | 2003-03-28 | 2008-07-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100527671B1 (ko) * | 2004-02-19 | 2005-11-28 | 삼성전자주식회사 | 웨이퍼 상에 막을 형성하는 방법 |
WO2007002204A2 (en) * | 2005-06-21 | 2007-01-04 | The Trustees Of Columbia University In The City Of New York | Pyrosequencing methods and related compostions |
WO2009001466A1 (ja) * | 2007-06-28 | 2008-12-31 | Fujitsu Microelectronics Limited | 熱処理装置、及び半導体装置の製造方法 |
JP2012054392A (ja) * | 2010-09-01 | 2012-03-15 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
JP5770042B2 (ja) * | 2011-08-04 | 2015-08-26 | 東京エレクトロン株式会社 | 熱処理装置 |
JP6323141B2 (ja) * | 2014-04-18 | 2018-05-16 | 東京エレクトロン株式会社 | 基板処理装置 |
CN111790582B (zh) * | 2020-07-28 | 2021-06-29 | 苏州市鑫达试验设备有限公司 | 一种立式多层高精度多腔式加热装置 |
CN112071775B (zh) * | 2020-08-14 | 2024-08-09 | 南方科技大学 | 一种用于功率器件封装的烧结设备 |
CN115976456B (zh) * | 2022-12-07 | 2024-09-27 | 镇江市博驰汽车配件有限公司 | 一种氛围循环的井式氮化炉及液压马达输出轴渗氮工艺 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5110248A (en) * | 1989-07-17 | 1992-05-05 | Tokyo Electron Sagami Limited | Vertical heat-treatment apparatus having a wafer transfer mechanism |
US5181819A (en) * | 1990-10-09 | 1993-01-26 | Tokyo Electron Sagami Limited | Apparatus for processing semiconductors |
JPH04133422A (ja) * | 1990-09-26 | 1992-05-07 | Tokyo Electron Sagami Ltd | 縦型熱処理装置 |
US5219464A (en) * | 1990-10-09 | 1993-06-15 | Tokyo Electron Limited | Clean air apparatus |
US5261167A (en) * | 1990-09-27 | 1993-11-16 | Tokyo Electron Sagami Limited | Vertical heat treating apparatus |
JP2963950B2 (ja) * | 1990-10-11 | 1999-10-18 | 東京エレクトロン株式会社 | 半導体製造装置 |
-
1995
- 1995-03-23 US US08/409,098 patent/US5645419A/en not_active Expired - Lifetime
- 1995-03-28 EP EP95104581A patent/EP0675523A3/en not_active Withdrawn
- 1995-03-29 KR KR1019950006860A patent/KR100269414B1/ko active IP Right Grant
- 1995-03-31 TW TW084103144A patent/TW337597B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493627B (zh) * | 2012-09-10 | 2015-07-21 | Koyo Thermo Sys Co Ltd | Heat treatment device |
Also Published As
Publication number | Publication date |
---|---|
EP0675523A3 (en) | 1995-11-15 |
KR950034405A (ko) | 1995-12-28 |
EP0675523A2 (en) | 1995-10-04 |
KR100269414B1 (ko) | 2001-01-15 |
US5645419A (en) | 1997-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |