TW337555B - Opto-electronic converter and its production method - Google Patents

Opto-electronic converter and its production method

Info

Publication number
TW337555B
TW337555B TW085107987A TW85107987A TW337555B TW 337555 B TW337555 B TW 337555B TW 085107987 A TW085107987 A TW 085107987A TW 85107987 A TW85107987 A TW 85107987A TW 337555 B TW337555 B TW 337555B
Authority
TW
Taiwan
Prior art keywords
carrier
plate
opto
electronic converter
production method
Prior art date
Application number
TW085107987A
Other languages
English (en)
Inventor
Spath Werner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW337555B publication Critical patent/TW337555B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
TW085107987A 1995-07-24 1996-07-02 Opto-electronic converter and its production method TW337555B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19527026A DE19527026C2 (de) 1995-07-24 1995-07-24 Optoelektronischer Wandler und Herstellverfahren

Publications (1)

Publication Number Publication Date
TW337555B true TW337555B (en) 1998-08-01

Family

ID=7767658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107987A TW337555B (en) 1995-07-24 1996-07-02 Opto-electronic converter and its production method

Country Status (6)

Country Link
EP (1) EP0842543B1 (zh)
JP (1) JP3386817B2 (zh)
KR (1) KR19990035849A (zh)
DE (2) DE19527026C2 (zh)
TW (1) TW337555B (zh)
WO (1) WO1997004491A1 (zh)

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US5990498A (en) * 1997-09-16 1999-11-23 Polaroid Corporation Light-emitting diode having uniform irradiance distribution
FI105606B (fi) 1997-10-13 2000-09-15 Nokia Mobile Phones Ltd Optinen tiedonsiirtoyksikkö
US6588949B1 (en) 1998-12-30 2003-07-08 Honeywell Inc. Method and apparatus for hermetically sealing photonic devices
US7004644B1 (en) * 1999-06-29 2006-02-28 Finisar Corporation Hermetic chip-scale package for photonic devices
DE19935496C1 (de) * 1999-07-28 2001-01-18 Siemens Ag Optoelektronisches Bauelement und Verfahren zur Herstellung
DE19952712A1 (de) * 1999-11-02 2001-05-10 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
US6792178B1 (en) 2000-01-12 2004-09-14 Finisar Corporation Fiber optic header with integrated power monitor
DE10034865B4 (de) * 2000-07-18 2006-06-01 Infineon Technologies Ag Optoelektronisches oberflächenmontierbares Modul
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002151781A (ja) 2000-11-10 2002-05-24 Mitsubishi Electric Corp 光素子モジュール
DE10101554A1 (de) * 2001-01-15 2002-08-01 Osram Opto Semiconductors Gmbh Lumineszenzdiode
DE10104715B4 (de) * 2001-02-02 2006-04-13 Osram Opto Semiconductors Gmbh Optisches Bauelement
DE10111501B4 (de) 2001-03-09 2019-03-21 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung
WO2002084358A1 (de) 2001-04-18 2002-10-24 Infineon Technologies Ag Sendemodul für eine optische signalübertragung
DE10122134A1 (de) * 2001-05-08 2002-12-05 Sick Ag Optischer Sensor
FR2824955B1 (fr) * 2001-05-18 2004-07-09 St Microelectronics Sa Boitier semi-conducteur optique blinde
KR100439399B1 (ko) * 2001-07-19 2004-07-09 삼성전기주식회사 광픽업장치를 위한 포토다이오드 패키지 및 그 제조방법
DE10150986A1 (de) * 2001-10-10 2003-04-30 Infineon Technologies Ag Sende- und/oder Empfangseinrichtung
DE10201102A1 (de) 2002-01-09 2003-07-24 Infineon Technologies Ag Laservorrichtung
JP2004086157A (ja) * 2002-07-01 2004-03-18 Seiko Epson Corp 光トランシーバ及びその製造方法
JP2004086137A (ja) 2002-07-01 2004-03-18 Seiko Epson Corp 光トランシーバ及びその製造方法
JP2004086136A (ja) 2002-07-01 2004-03-18 Seiko Epson Corp 光トランシーバの製造方法及び調整装置
JP4152684B2 (ja) * 2002-07-17 2008-09-17 松下電器産業株式会社 受光モジュールとその製造方法
DE10236376A1 (de) 2002-08-02 2004-02-26 Infineon Technologies Ag Träger für optoelektronische Bauelemente sowie optische Sendeeinrichtung und optische Empfangseinrichtung
JP2004158557A (ja) * 2002-11-05 2004-06-03 Shurai Kagi Kofun Yugenkoshi 類似フリップチップ型の発光ダイオード装置パッケージ
EP1420462A1 (en) * 2002-11-13 2004-05-19 Heptagon Oy Light emitting device
US6969204B2 (en) 2002-11-26 2005-11-29 Hymite A/S Optical package with an integrated lens and optical assemblies incorporating the package
DE10308890A1 (de) * 2003-02-28 2004-09-09 Opto Tech Corporation Gehäusestruktur für eine Lichtemissionsdiode und Verfahren zu dessen Herstellung
DE10351349A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Verfahren zum Hestellen eines Lumineszenzdiodenchips
DE10351397A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
JP2005159296A (ja) * 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
JP4540382B2 (ja) * 2004-04-05 2010-09-08 Ｈｏｙａ株式会社 撮影用照明装置
DE102005006052A1 (de) 2004-12-21 2006-07-06 Osram Opto Semiconductors Gmbh Linse, Laseranordnung und Verfahren zur Herstellung einer Laseranordnung
DE102005008885B4 (de) * 2005-02-26 2008-11-27 Sick Ag Lichtgitter
CN101248535B (zh) 2005-08-24 2011-09-07 皇家飞利浦电子股份有限公司 带有彩色变换器的发光二极管和激光器的电接触系统
US7525126B2 (en) 2006-05-02 2009-04-28 3M Innovative Properties Company LED package with converging optical element
US20070258241A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with non-bonded converging optical element
DE102008005345A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Halbleiterbasiertes Bauelement, Aufnahme für ein halbleiterbasiertes Bauelement und Verfahren zur Herstellung eines halbleiterbasierten Bauelements
DE102007062042A1 (de) * 2007-12-21 2009-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil, Verkapselung für ein optoelektronisches Bauteil und Herstellungsverfahren
DE102009005709A1 (de) * 2009-01-22 2010-07-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102010032512A1 (de) * 2010-07-28 2012-02-02 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
JP6137839B2 (ja) * 2013-01-15 2017-05-31 三菱電機株式会社 受信光学系
DE102016100563B4 (de) * 2016-01-14 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung
JP2018182172A (ja) * 2017-04-18 2018-11-15 日本電信電話株式会社 受光素子およびその作製方法
DE102017112235A1 (de) 2017-06-02 2018-12-06 Osram Opto Semiconductors Gmbh Laserdiode und Verfahren zum Herstellen einer Laserdiode
JP6850212B2 (ja) * 2017-07-04 2021-03-31 日本電信電話株式会社 受光素子の製造方法
FR3070793B1 (fr) * 2017-09-05 2022-07-22 Commissariat Energie Atomique Procede de fabrication d'un dispositif d'affichage emissif a led
DE102017126109A1 (de) * 2017-11-08 2019-05-09 Osram Opto Semiconductors Gmbh Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
JP7003818B2 (ja) * 2018-04-05 2022-02-04 日本電信電話株式会社 受光素子および素子の製造方法

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DE3925189C1 (en) * 1989-07-29 1990-12-13 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De Optical transmission detector using optical fibre and PIN-diode - is mounted in V-shaped trench of crystalline silicon chip with vaporised counter-electrode and integrated receiving electronics
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DE4416563C1 (de) * 1994-05-11 1995-07-20 Ant Nachrichtentech Anordnung zur Ankopplung von optoelektronischen Komponenten und Lichtwellenleitern aneinander

Also Published As

Publication number Publication date
WO1997004491A1 (de) 1997-02-06
JPH11509687A (ja) 1999-08-24
EP0842543A1 (de) 1998-05-20
DE19527026C2 (de) 1997-12-18
JP3386817B2 (ja) 2003-03-17
EP0842543B1 (de) 2002-02-13
DE59608735D1 (de) 2002-03-21
KR19990035849A (ko) 1999-05-25
DE19527026A1 (de) 1997-02-06

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