TW333551B - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
TW333551B
TW333551B TW084105170A TW84105170A TW333551B TW 333551 B TW333551 B TW 333551B TW 084105170 A TW084105170 A TW 084105170A TW 84105170 A TW84105170 A TW 84105170A TW 333551 B TW333551 B TW 333551B
Authority
TW
Taiwan
Prior art keywords
carboxyl group
nitrile rubber
epoxy resin
dicyandiamide
aromatic amine
Prior art date
Application number
TW084105170A
Other languages
English (en)
Inventor
Toshikazu Furihata
Akio Ikeda
Wataru Soejima
Original Assignee
Mitsui Detroleum Chemicals Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Detroleum Chemicals Industry Co Ltd filed Critical Mitsui Detroleum Chemicals Industry Co Ltd
Application granted granted Critical
Publication of TW333551B publication Critical patent/TW333551B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW084105170A 1994-05-24 1995-05-23 Adhesive composition TW333551B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6109920A JPH07316525A (ja) 1994-05-24 1994-05-24 フレキシブルプリント配線板用接着剤組成物

Publications (1)

Publication Number Publication Date
TW333551B true TW333551B (en) 1998-06-11

Family

ID=14522484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105170A TW333551B (en) 1994-05-24 1995-05-23 Adhesive composition

Country Status (5)

Country Link
US (1) US5859155A (zh)
JP (1) JPH07316525A (zh)
KR (1) KR950032555A (zh)
CA (1) CA2149972A1 (zh)
TW (1) TW333551B (zh)

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JP4423694B2 (ja) * 1999-02-08 2010-03-03 宇部興産株式会社 カバ−レイフィルム用接着剤及びカバ−レイフィルム
DE10102047A1 (de) * 2001-01-17 2002-07-18 Bayer Ag Kautschukmischungen für Walzenbeläge
KR100420213B1 (ko) * 2001-05-07 2004-03-04 산양전기주식회사 연성인쇄회로기판용 점착성도료와 그 사용방법
US6762260B2 (en) 2002-03-05 2004-07-13 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions
US6797376B2 (en) * 2002-05-09 2004-09-28 The Boeing Company Fiber-metal laminate adhesive coating
CA2413636A1 (en) * 2002-12-05 2004-06-05 Bayer Inc. Adhesive compositions
US6777512B1 (en) * 2003-02-28 2004-08-17 Dow Global Technologies Inc. Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components
RU2358992C2 (ru) * 2003-06-09 2009-06-20 Дау Глобал Текнолоджиз Инк. Стабилизированные органоборановые инициаторы полимеризации и способные к полимеризации композиции
EP1699625B1 (en) * 2003-12-22 2008-08-13 Dow Global Technologies Inc. Accelerated organoborane amine complex initiated polymerizable compositions
US8501886B2 (en) * 2003-12-22 2013-08-06 Dow Global Technologies Llc Accelerated organoborane amine complex initiated polymerizable compositions
CA2462006A1 (en) * 2004-02-23 2005-08-23 Bayer Inc. Curable plasticizer composition
CA2458752A1 (en) * 2004-02-23 2005-08-23 Bayer Inc. Crosslinking of carboxylated nitrile polymers using compounds with at least two epoxy groups
JP4475034B2 (ja) * 2004-06-23 2010-06-09 住友ベークライト株式会社 樹脂組成物、プリプレグおよび積層板
US7204574B2 (en) * 2004-06-30 2007-04-17 Lexmark International, Inc. Polyimide thickfilm flow feature photoresist and method of applying same
DE102004057650A1 (de) * 2004-11-29 2006-06-01 Tesa Ag Hitzeaktivierbares Klebeband auf Basis carboxylierter Nitrilkautschuke für die Verklebung von elektronischen Bauteilen und Leiterbahnen
US20070073008A1 (en) * 2005-09-28 2007-03-29 Cookson Singapore Pte, Ltd. Compositions effective to suppress void formation
CA2624322A1 (en) 2005-10-07 2007-04-19 Dow Global Technologies Inc. Amido-organoborate initiator systems
KR101141852B1 (ko) * 2005-10-07 2012-05-08 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물 및 이것을 이용한 감광성 엘리먼트
WO2007059152A1 (en) * 2005-11-14 2007-05-24 World Properties, Inc. Circuit material, multi-layer circuits, and methods of manufacture thereof
CN101130679B (zh) * 2006-08-25 2011-11-16 比亚迪股份有限公司 一种胶粘剂及其制备方法
US20080103274A1 (en) * 2006-10-12 2008-05-01 Jialanella Gary L Accelerated organoborane initiated polymerizable compositions
US7524907B2 (en) * 2006-10-12 2009-04-28 Dow Global Technologies, Inc. Accelerated organoborane initiated polymerizable compositions
CN101932668B (zh) * 2007-10-30 2015-03-25 汉高股份及两合公司 抗洗脱的环氧糊状粘合剂
CN101544879B (zh) * 2009-04-30 2012-06-13 东华大学 一种高强度无溶剂环氧粘合剂的制备方法
CN101575489B (zh) * 2009-06-15 2012-07-18 新高电子材料（中山）有限公司 一种柔性印刷电路用的白色胶粘剂及其制备方法
CN101921531B (zh) * 2010-09-08 2012-12-05 东华大学 一种活性酞酰亚胺环氧型无溶剂滴浸漆及其制备方法
JP2013091774A (ja) * 2011-10-05 2013-05-16 Canon Inc エポキシ樹脂組成物
US9163136B2 (en) 2011-11-18 2015-10-20 Zeon Corporation Nitrile rubber composition and cross-linked rubber
CN116614940A (zh) * 2016-11-15 2023-08-18 株式会社力森诺科 导体基板、布线基板及布线基板的制造方法
JP6541283B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP6542920B2 (ja) * 2018-01-18 2019-07-10 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP6448160B2 (ja) * 2018-01-18 2019-01-09 藤森工業株式会社 接着性組成物及びｆｐｃ用導電性接着シート
JP7338621B2 (ja) * 2018-05-11 2023-09-05 株式会社レゾナック 導体基板、配線基板、ストレッチャブルデバイス及び配線基板の製造方法
JP6761884B2 (ja) * 2019-06-12 2020-09-30 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
CN111535034A (zh) * 2020-04-09 2020-08-14 安徽福斯特渔具有限公司 耐高温型消防防护服复合材料的制备方法
CN115160966B (zh) * 2022-08-08 2023-06-30 山东北方现代化学工业有限公司 一种高强度、耐候性汽车结构胶粘剂及其制备方法

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JPH04171753A (ja) * 1990-11-02 1992-06-18 Nitto Denko Corp 多層リードフレーム基板
JP3159390B2 (ja) * 1990-12-25 2001-04-23 住友ベークライト株式会社 積層板の製造方法
JP3009947B2 (ja) * 1991-08-26 2000-02-14 松下電工株式会社 エポキシ樹脂組成物
JPH05287255A (ja) * 1992-04-03 1993-11-02 Mitsui Petrochem Ind Ltd 接着剤組成物

Also Published As

Publication number Publication date
KR950032555A (ko) 1995-12-22
US5859155A (en) 1999-01-12
JPH07316525A (ja) 1995-12-05
CA2149972A1 (en) 1995-11-25

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