TW327677B - Treatment of glass substrates to compensate for warpage and distortion - Google Patents

Treatment of glass substrates to compensate for warpage and distortion

Info

Publication number
TW327677B
TW327677B TW086104261A TW86104261A TW327677B TW 327677 B TW327677 B TW 327677B TW 086104261 A TW086104261 A TW 086104261A TW 86104261 A TW86104261 A TW 86104261A TW 327677 B TW327677 B TW 327677B
Authority
TW
Taiwan
Prior art keywords
layer
glassy
substrate
forming
warpage
Prior art date
Application number
TW086104261A
Other languages
English (en)
Inventor
M Trouchet Denis
Marcel Jean Beguin Alain
Orr Maschmeyer Richard
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of TW327677B publication Critical patent/TW327677B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/02—Re-forming glass sheets
    • C03B23/023—Re-forming glass sheets by bending
    • C03B23/025—Re-forming glass sheets by bending by gravity
    • C03B23/0258—Gravity bending involving applying local or additional heating, cooling or insulating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12038—Glass (SiO2 based materials)
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12169—Annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S65/00—Glass manufacturing
    • Y10S65/08—Quartz

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optical Integrated Circuits (AREA)
  • Surface Treatment Of Glass (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW086104261A 1996-04-30 1997-03-31 Treatment of glass substrates to compensate for warpage and distortion TW327677B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1700196P 1996-04-30 1996-04-30

Publications (1)

Publication Number Publication Date
TW327677B true TW327677B (en) 1998-03-01

Family

ID=21780175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104261A TW327677B (en) 1996-04-30 1997-03-31 Treatment of glass substrates to compensate for warpage and distortion

Country Status (10)

Country Link
US (1) US5827342A (zh)
EP (1) EP0805364A1 (zh)
JP (1) JPH10123345A (zh)
KR (1) KR970072031A (zh)
CN (1) CN1167094A (zh)
AU (1) AU708513B2 (zh)
CA (1) CA2202216A1 (zh)
FR (1) FR2759465B1 (zh)
MX (1) MX9703234A (zh)
TW (1) TW327677B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19805170A1 (de) * 1998-02-10 1999-08-12 Cit Alcatel Planarer optischer Wellenleiter und Verfahren zu seiner Herstellung
US6377732B1 (en) 1999-01-22 2002-04-23 The Whitaker Corporation Planar waveguide devices and fiber attachment
US6389209B1 (en) 1999-09-07 2002-05-14 Agere Systems Optoelectronics Guardian Corp. Strain free planar optical waveguides
AUPR368201A0 (en) 2001-03-13 2001-04-12 Redfern Integrated Optics Pty Ltd Silica-based optical device fabrication
WO2002073257A1 (en) * 2001-03-13 2002-09-19 Redfern Integrated Optics Pty Ltd Silica-based optical device fabrication
US6603916B1 (en) * 2001-07-26 2003-08-05 Lightwave Microsystems Corporation Lightwave circuit assembly having low deformation balanced sandwich substrate
EP1579477A2 (en) * 2002-10-11 2005-09-28 Tessera, Inc. Components, methods and assemblies for multi-chip packages
JP5330245B2 (ja) * 2006-09-20 2013-10-30 コーニング インコーポレイテッド ガラス基板の形状誘起面内応力温度補償
US20080147110A1 (en) * 2006-12-19 2008-06-19 Lalith Hiran Wijeratne Embolic protection device with distal tubular member for improved torque response
US8154099B2 (en) * 2009-08-19 2012-04-10 Raytheon Company Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate
CN106933098B (zh) * 2017-02-24 2019-10-01 上海理工大学 平板型机械结构热变形补偿系统设计方法
US20190367402A1 (en) * 2018-05-30 2019-12-05 Corning Incorporated Methods to compensate for warp in glass articles
JP7178594B2 (ja) * 2018-05-31 2022-11-28 パナソニックＩｐマネジメント株式会社 ガラスパネルユニットの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501602A (en) * 1982-09-15 1985-02-26 Corning Glass Works Process for making sintered glasses and ceramics
JPS6090838A (ja) * 1983-10-25 1985-05-22 Shin Etsu Chem Co Ltd 光伝送用石英ガラス母材の製造方法
EP0146659B1 (en) * 1983-12-22 1988-03-30 Shin-Etsu Chemical Co., Ltd. A method for the preparation of synthetic quartz glass suitable as a material of optical fibers
JPS60180338A (ja) * 1984-02-28 1985-09-14 Fujitsu Ltd 並直列変換方式
JPS6457207A (en) * 1987-08-28 1989-03-03 Hitachi Ltd Waveguide type optical device
GB8905966D0 (en) * 1989-03-15 1989-04-26 Tsl Group Plc Improved vitreous silica products
US5152819A (en) * 1990-08-16 1992-10-06 Corning Incorporated Method of making fused silica
US5043002A (en) * 1990-08-16 1991-08-27 Corning Incorporated Method of making fused silica by decomposing siloxanes
US5154744A (en) * 1991-08-26 1992-10-13 Corning Incorporated Method of making titania-doped fused silica
DE69224454T2 (de) * 1991-09-30 1998-07-30 At & T Corp Verfahren zur Herstellung von planaren optischen Wellenleitern
US5261022A (en) * 1991-10-21 1993-11-09 Photonic Integration Research, Inc. Optical waveguide of silica glass film on ceramic substrate
JPH05273426A (ja) * 1991-12-06 1993-10-22 Sumitomo Electric Ind Ltd 光導波膜の作製方法およびこれを用いた光導波路の作製方法
JPH05345619A (ja) * 1992-06-16 1993-12-27 Furukawa Electric Co Ltd:The 石英導波路型光部品の製造方法
US5492843A (en) * 1993-07-31 1996-02-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating semiconductor device and method of processing substrate
JPH07109573A (ja) * 1993-10-12 1995-04-25 Semiconductor Energy Lab Co Ltd ガラス基板および加熱処理方法
US5483613A (en) * 1994-08-16 1996-01-09 At&T Corp. Optical device with substrate and waveguide structure having thermal matching interfaces
DE4433738B4 (de) * 1994-09-21 2006-04-06 Infineon Technologies Ag Doppelbrechungsarmer planarer optischer Wellenleiter und Verfahren zu seiner Herstellung
US5800860A (en) * 1995-06-28 1998-09-01 Lucent Technologies Inc. Method of manufacturing planar optical waveguides

Also Published As

Publication number Publication date
JPH10123345A (ja) 1998-05-15
FR2759465A1 (fr) 1998-08-14
MX9703234A (es) 1998-04-30
EP0805364A1 (en) 1997-11-05
CA2202216A1 (en) 1997-10-30
KR970072031A (ko) 1997-11-07
AU1908697A (en) 1997-11-06
US5827342A (en) 1998-10-27
AU708513B2 (en) 1999-08-05
CN1167094A (zh) 1997-12-10
FR2759465B1 (fr) 1999-04-30

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