TW326099B - Semiconductor device and the process of manufacturing the same - Google Patents

Semiconductor device and the process of manufacturing the same

Info

Publication number
TW326099B
TW326099B TW085105149A TW85105149A TW326099B TW 326099 B TW326099 B TW 326099B TW 085105149 A TW085105149 A TW 085105149A TW 85105149 A TW85105149 A TW 85105149A TW 326099 B TW326099 B TW 326099B
Authority
TW
Taiwan
Prior art keywords
oxidized membrane
film
silicon substrate
specified area
oxidized
Prior art date
Application number
TW085105149A
Other languages
English (en)
Chinese (zh)
Inventor
Hideo Miura
Shuji Ikeda
Norio Suzuki
Naoudo Saitou
Asao Nishimura
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW326099B publication Critical patent/TW326099B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Formation Of Insulating Films (AREA)
TW085105149A 1995-05-08 1996-04-30 Semiconductor device and the process of manufacturing the same TW326099B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7109585A JPH08306678A (ja) 1995-05-08 1995-05-08 半導体装置の製造方法及び半導体装置

Publications (1)

Publication Number Publication Date
TW326099B true TW326099B (en) 1998-02-01

Family

ID=14514002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105149A TW326099B (en) 1995-05-08 1996-04-30 Semiconductor device and the process of manufacturing the same

Country Status (6)

Country Link
JP (1) JPH08306678A (ko)
KR (1) KR19990008315A (ko)
IN (1) IN187708B (ko)
MY (1) MY132186A (ko)
TW (1) TW326099B (ko)
WO (1) WO1996036073A1 (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139263A (en) * 1975-05-28 1976-12-01 Hitachi Ltd Method of selective oxidation of silicon substrate
JPS5249771A (en) * 1975-10-17 1977-04-21 Matsushita Electric Ind Co Ltd Process for production of semiconductor device
JPS5739551A (en) * 1980-08-21 1982-03-04 Seiko Epson Corp Manufacture of selectively oxidized mask
JPH0628282B2 (ja) * 1984-09-19 1994-04-13 ソニー株式会社 半導体装置の製造方法
JP3403210B2 (ja) * 1992-02-14 2003-05-06 富士通株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR19990008315A (ko) 1999-01-25
IN187708B (ko) 2002-06-08
JPH08306678A (ja) 1996-11-22
WO1996036073A1 (fr) 1996-11-14
MY132186A (en) 2007-09-28

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