TW301761B - - Google Patents

Download PDF

Info

Publication number
TW301761B
TW301761B TW084112564A TW84112564A TW301761B TW 301761 B TW301761 B TW 301761B TW 084112564 A TW084112564 A TW 084112564A TW 84112564 A TW84112564 A TW 84112564A TW 301761 B TW301761 B TW 301761B
Authority
TW
Taiwan
Prior art keywords
heat
steam
organic solvent
please
machine
Prior art date
Application number
TW084112564A
Other languages
English (en)
Chinese (zh)
Original Assignee
Sharp Kk
Kimmon Quartz Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk, Kimmon Quartz Co Ltd filed Critical Sharp Kk
Application granted granted Critical
Publication of TW301761B publication Critical patent/TW301761B/zh

Links

Classifications

    • H10P72/0408—
    • H10P52/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/145—Condensing the vapour onto the surface of the materials to be dried
    • F26B21/471—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microbiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW084112564A 1994-11-29 1995-11-25 TW301761B (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29527794 1994-11-29

Publications (1)

Publication Number Publication Date
TW301761B true TW301761B (en:Method) 1997-04-01

Family

ID=17818523

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084112564A TW301761B (en:Method) 1994-11-29 1995-11-25

Country Status (4)

Country Link
US (1) US5657553A (en:Method)
JP (1) JP3461642B2 (en:Method)
KR (1) KR100401388B1 (en:Method)
TW (1) TW301761B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113418383A (zh) * 2021-06-24 2021-09-21 湖南智信微电子科技有限公司 一种铬版湿法清洗工艺干燥用异丙醇蒸汽回流装置

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6050275A (en) * 1996-09-27 2000-04-18 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
US5864966A (en) * 1996-12-19 1999-02-02 California Institute Of Technology Two solvent vapor drying technique
JP3171807B2 (ja) * 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
JP3230051B2 (ja) * 1997-05-16 2001-11-19 東京エレクトロン株式会社 乾燥処理方法及びその装置
JPH10321584A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
JPH10321585A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
DE19832038A1 (de) * 1997-07-17 1999-01-28 Tokyo Electron Ltd Verfahren und Einrichtung zum Reinigen und Trocknen
JP3897404B2 (ja) * 1997-07-22 2007-03-22 オメガセミコン電子株式会社 ベーパ乾燥装置及び乾燥方法
US6026589A (en) * 1998-02-02 2000-02-22 Silicon Valley Group, Thermal Systems Llc Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
US6108932A (en) * 1998-05-05 2000-08-29 Steag Microtech Gmbh Method and apparatus for thermocapillary drying
US6199564B1 (en) * 1998-11-03 2001-03-13 Tokyo Electron Limited Substrate processing method and apparatus
GB2346953A (en) * 1999-02-16 2000-08-23 Stephen Rodger Henly Removing water from articles
US6192600B1 (en) 1999-09-09 2001-02-27 Semitool, Inc. Thermocapillary dryer
EP1384254A4 (en) * 2001-03-15 2007-05-23 Akrion Technologies Inc DRYING STEAM GENERATION
US6405452B1 (en) * 2001-03-28 2002-06-18 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for drying wafers after wet bench
US6649883B2 (en) * 2001-04-12 2003-11-18 Memc Electronic Materials, Inc. Method of calibrating a semiconductor wafer drying apparatus
US20030136429A1 (en) * 2002-01-22 2003-07-24 Semitool, Inc. Vapor cleaning and liquid rinsing process vessel
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR20070008533A (ko) 2003-11-10 2007-01-17 블루쉬프트 테크놀로지스, 인코포레이티드. 진공-사용 반도체 핸들링 시스템에서 작업 편을 핸들링하기위한 방법 및 시스템
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4493649B2 (ja) * 2004-04-02 2010-06-30 東京エレクトロン株式会社 基板処理装置、基板処理方法、記録媒体およびソフトウエア
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method
JP2008082569A (ja) * 2006-09-26 2008-04-10 Kojiro Okawa 水切り乾燥装置及び水切り乾燥方法
JP5104174B2 (ja) 2007-10-01 2012-12-19 富士通株式会社 洗浄乾燥装置及び洗浄乾燥方法
JP2009124025A (ja) * 2007-11-16 2009-06-04 Fujitsu Ltd 洗浄乾燥装置及び洗浄乾燥方法
JP5362503B2 (ja) * 2009-09-24 2013-12-11 東京エレクトロン株式会社 洗浄・乾燥処理方法、洗浄・乾燥処理装置、および記録媒体
US9377423B2 (en) 2012-12-31 2016-06-28 Cascade Microtech, Inc. Systems and methods for handling substrates at below dew point temperatures
JP7660446B2 (ja) * 2021-06-29 2025-04-11 株式会社荏原製作所 基板乾燥装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4393657A (en) * 1981-04-29 1983-07-19 Isao Takatama Method for recovering waste heat as motive power
US4800362A (en) * 1986-02-10 1989-01-24 Toyota Jidosha Kabushiki Kaisha Organic solvent cleaning apparatus
JPS62260325A (ja) * 1986-05-07 1987-11-12 Sigma Gijutsu Kogyo Kk 基板乾燥方法
US4822429A (en) * 1986-07-07 1989-04-18 Mccord James W Liquid circulating means for a vapor generating and recovery apparatus
US4977688A (en) * 1989-10-27 1990-12-18 Semifab Incorporated Vapor device and method for drying articles such as semiconductor wafers with substances such as isopropyl alcohol
JP2910402B2 (ja) * 1992-04-27 1999-06-23 三菱電機株式会社 蒸気乾燥方法及び蒸気乾燥槽
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
US5539995A (en) * 1994-03-16 1996-07-30 Verteq, Inc. Continuous flow vapor dryer system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113418383A (zh) * 2021-06-24 2021-09-21 湖南智信微电子科技有限公司 一种铬版湿法清洗工艺干燥用异丙醇蒸汽回流装置
CN113418383B (zh) * 2021-06-24 2022-05-17 长沙韶光铬版有限公司 一种铬版湿法清洗工艺干燥用异丙醇蒸汽回流装置

Also Published As

Publication number Publication date
JP3461642B2 (ja) 2003-10-27
KR100401388B1 (ko) 2003-12-11
JPH08241881A (ja) 1996-09-17
US5657553A (en) 1997-08-19
KR970030433A (ko) 1997-06-26

Similar Documents

Publication Publication Date Title
TW301761B (en:Method)
EP0198169B1 (en) Vapor drying apparatus
JP3003016B2 (ja) 処理装置及び処理方法
TW582065B (en) Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same
JP2003297795A (ja) 半導体ウェーハの洗浄・乾燥装置、及び洗浄・乾燥方法
TW502332B (en) Substrate processing unit
US20230184574A1 (en) Apparatus and method of supplying chemical liquid and substrate treating apparatus
US20100096110A1 (en) Methods and apparatus for recovering heat from processing systems
JPH06283496A (ja) 洗浄処理後の基板の乾燥処理装置
WO1995006504A1 (en) Method of and apparatus for distillation under reduced pressure
JPH06103686B2 (ja) 表面乾燥処理方法および装置
TW529073B (en) Exhaust heat utilization system and exhaust heat utilization method for a semiconductor manufacturing device, and heat exchanger used in exhaust heat utilization for a semiconductor manufacturing device
CN116592592A (zh) 镜片干燥装置及方法
JP4906198B2 (ja) イソプロピルアルコール蒸気乾燥装置及びシリコンウエハの乾燥方法
JPS60125282A (ja) 無塵洗浄乾燥装置
KR0180344B1 (ko) 반도체 웨이퍼의 건조장치
JP2913564B2 (ja) 蒸気洗浄乾燥装置
JPH10125649A (ja) 蒸気発生装置および該装置の処理液排出方法
KR20000008734A (ko) 세정용액 순환 및 필터링 기능을 가지는 웨이퍼 세정장치
JPH01135025A (ja) 乾燥装置
KR20240062931A (ko) 기판 처리 장치, 연마 장치, 및 기판 처리 방법
JPH0574753A (ja) 乾燥方法および装置
JPH06283495A (ja) 洗浄処理後の基板の乾燥処理装置用蒸気発生器
KR200151978Y1 (ko) 반도체 소자 제조를 위한 감광막 제거용 베쓰의 히팅 시스템
KR200148632Y1 (ko) 습식세정장치의 케미컬 베스

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees