TW299487B - - Google Patents

Download PDF

Info

Publication number
TW299487B
TW299487B TW085107304A TW85107304A TW299487B TW 299487 B TW299487 B TW 299487B TW 085107304 A TW085107304 A TW 085107304A TW 85107304 A TW85107304 A TW 85107304A TW 299487 B TW299487 B TW 299487B
Authority
TW
Taiwan
Prior art keywords
item
circuit package
digital
package
scope
Prior art date
Application number
TW085107304A
Other languages
English (en)
Chinese (zh)
Original Assignee
Circuit Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Components Inc filed Critical Circuit Components Inc
Application granted granted Critical
Publication of TW299487B publication Critical patent/TW299487B/zh

Links

Classifications

    • H10W76/153—
    • H10W70/60—
    • H10W40/228—
    • H10W70/635—
    • H10W70/692—
    • H10W74/117—
    • H10W70/682—
    • H10W70/685—
    • H10W72/884—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW085107304A 1995-06-06 1996-06-17 TW299487B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47109595A 1995-06-06 1995-06-06

Publications (1)

Publication Number Publication Date
TW299487B true TW299487B (OSRAM) 1997-03-01

Family

ID=23870234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107304A TW299487B (OSRAM) 1995-06-06 1996-06-17

Country Status (6)

Country Link
JP (1) JPH09213829A (OSRAM)
KR (1) KR970003879A (OSRAM)
DE (1) DE19622650A1 (OSRAM)
GB (1) GB2301937A (OSRAM)
MX (1) MXPA96002171A (OSRAM)
TW (1) TW299487B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10115674B2 (en) 2015-09-11 2018-10-30 Toshiba Memory Corporation Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284566B1 (en) 1996-05-17 2001-09-04 National Semiconductor Corporation Chip scale package and method for manufacture thereof
US5783866A (en) * 1996-05-17 1998-07-21 National Semiconductor Corporation Low cost ball grid array device and method of manufacture thereof
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
JPH11219984A (ja) * 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
GB9818474D0 (en) * 1998-08-26 1998-10-21 Hughes John E Multi-layer interconnect package for optical devices & standard semiconductor chips
US6198166B1 (en) * 1999-07-01 2001-03-06 Intersil Corporation Power semiconductor mounting package containing ball grid array
DE10010461A1 (de) * 2000-03-03 2001-09-13 Infineon Technologies Ag Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik
GB2377080B (en) * 2001-09-11 2003-05-07 Sendo Int Ltd Integrated circuit package and printed circuit board arrangement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5490324A (en) * 1993-09-15 1996-02-13 Lsi Logic Corporation Method of making integrated circuit package having multiple bonding tiers
TW272311B (OSRAM) * 1994-01-12 1996-03-11 At & T Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10115674B2 (en) 2015-09-11 2018-10-30 Toshiba Memory Corporation Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor device

Also Published As

Publication number Publication date
JPH09213829A (ja) 1997-08-15
MXPA96002171A (es) 2002-04-19
KR970003879A (ko) 1997-01-29
DE19622650A1 (de) 1996-12-12
GB2301937A (en) 1996-12-18
GB9611726D0 (en) 1996-08-07

Similar Documents

Publication Publication Date Title
EP0498446B1 (en) Multichip packaged semiconductor device and method for manufacturing the same
US5289346A (en) Peripheral to area adapter with protective bumper for an integrated circuit chip
US5646828A (en) Thin packaging of multi-chip modules with enhanced thermal/power management
US5379191A (en) Compact adapter package providing peripheral to area translation for an integrated circuit chip
KR100269528B1 (ko) 고성능 멀티 칩 모듈 패키지
US5620928A (en) Ultra thin ball grid array using a flex tape or printed wiring board substrate and method
EP0734065B1 (en) Chip sized semiconductor device and multi-chip-sized semiconductor device
US6621156B2 (en) Semiconductor device having stacked multi chip module structure
US6552416B1 (en) Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
TWI505420B (zh) 覆晶、面向上型及面向下型中心接合記憶體導線接合總成
US9123869B2 (en) Semiconductor device with a light emitting semiconductor die
US8168477B2 (en) Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
US20040135243A1 (en) Semiconductor device, its manufacturing method and electronic device
EP1025589A1 (en) Three-dimensional packaging configuration for multi-chip module assembly
JPH05502337A (ja) 半導体チップ用のくぼんだ空洞を持った多層パッケージ
JP2005252278A (ja) 下側に設けられた接触部を有する半導体構成素子の製造方法
TW569403B (en) Multi-chip module and its manufacturing method
TW299487B (OSRAM)
CN1319138C (zh) 封装的半导体器件的形成方法
US6351389B1 (en) Device and method for packaging an electronic device
JP2699929B2 (ja) 半導体装置
US5982026A (en) Inexpensive resin molded semiconductor device
TW466725B (en) Multiple chip package
JP3418759B2 (ja) 半導体パッケージ
JP3466354B2 (ja) 半導体装置