TW288194B - - Google Patents

Info

Publication number
TW288194B
TW288194B TW084113772A TW84113772A TW288194B TW 288194 B TW288194 B TW 288194B TW 084113772 A TW084113772 A TW 084113772A TW 84113772 A TW84113772 A TW 84113772A TW 288194 B TW288194 B TW 288194B
Authority
TW
Taiwan
Application number
TW084113772A
Other languages
Chinese (zh)
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6322032A external-priority patent/JPH08181144A/ja
Priority claimed from JP00752395A external-priority patent/JP3365879B2/ja
Priority claimed from JP00940195A external-priority patent/JP3363639B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of TW288194B publication Critical patent/TW288194B/zh

Links

Classifications

    • H10W72/20—
    • H10P95/00—
    • H10W72/01215—
    • H10W72/01225—
    • H10W72/01251—
    • H10W72/072—
    • H10W72/07251—
    • H10W72/227—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W72/5522—
    • H10W72/90—
    • H10W72/926—
    • H10W72/9415—
TW084113772A 1994-12-26 1995-12-22 TW288194B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6322032A JPH08181144A (ja) 1994-12-26 1994-12-26 半導体装置の実装方法
JP00752395A JP3365879B2 (ja) 1995-01-20 1995-01-20 半導体装置の製造方法
JP00940195A JP3363639B2 (ja) 1995-01-25 1995-01-25 集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW288194B true TW288194B (cg-RX-API-DMAC10.html) 1996-10-11

Family

ID=27277639

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084113772A TW288194B (cg-RX-API-DMAC10.html) 1994-12-26 1995-12-22

Country Status (6)

Country Link
US (1) US5686353A (cg-RX-API-DMAC10.html)
EP (1) EP0720226B1 (cg-RX-API-DMAC10.html)
KR (1) KR100239286B1 (cg-RX-API-DMAC10.html)
CN (2) CN1051641C (cg-RX-API-DMAC10.html)
DE (1) DE69535551T2 (cg-RX-API-DMAC10.html)
TW (1) TW288194B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580510B (zh) * 2011-02-15 2017-05-01 東麗工程股份有限公司 Installation method and installation device

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JP2951882B2 (ja) 1996-03-06 1999-09-20 松下電器産業株式会社 半導体装置の製造方法及びこれを用いて製造した半導体装置
JPH09252005A (ja) * 1996-03-15 1997-09-22 Shinkawa Ltd バンプ形成方法
DE69737621T2 (de) * 1996-10-01 2007-12-20 Matsushita Electric Industrial Co., Ltd., Kadoma Halbleiterelement mit einer Höckerelektrode
JP3400279B2 (ja) * 1997-01-13 2003-04-28 株式会社新川 バンプ形成方法
JP3377934B2 (ja) * 1997-07-22 2003-02-17 松下電器産業株式会社 バンプボンディング方法およびバンプボンディング装置
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JP3942738B2 (ja) * 1998-07-17 2007-07-11 松下電器産業株式会社 バンプ接合装置及び方法、並びに半導体部品製造装置
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US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6984576B1 (en) 2000-10-13 2006-01-10 Bridge Semiconductor Corporation Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
US7129113B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
US6699780B1 (en) 2000-10-13 2004-03-02 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
US7262082B1 (en) 2000-10-13 2007-08-28 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
US6492252B1 (en) 2000-10-13 2002-12-10 Bridge Semiconductor Corporation Method of connecting a bumped conductive trace to a semiconductor chip
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US7414319B2 (en) 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
US7075186B1 (en) 2000-10-13 2006-07-11 Bridge Semiconductor Corporation Semiconductor chip assembly with interlocked contact terminal
US6949408B1 (en) 2000-10-13 2005-09-27 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7190080B1 (en) 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US7264991B1 (en) 2000-10-13 2007-09-04 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
US7132741B1 (en) 2000-10-13 2006-11-07 Bridge Semiconductor Corporation Semiconductor chip assembly with carved bumped terminal
US6673710B1 (en) 2000-10-13 2004-01-06 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US6667229B1 (en) 2000-10-13 2003-12-23 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US7319265B1 (en) 2000-10-13 2008-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with precision-formed metal pillar
US6548393B1 (en) 2000-10-13 2003-04-15 Charles W. C. Lin Semiconductor chip assembly with hardened connection joint
US6872591B1 (en) 2000-10-13 2005-03-29 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a conductive trace and a substrate
US6576493B1 (en) 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7129575B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped metal pillar
US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US7094676B1 (en) 2000-10-13 2006-08-22 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
JP3765778B2 (ja) * 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
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US7993983B1 (en) 2003-11-17 2011-08-09 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7538415B1 (en) 2003-11-20 2009-05-26 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal, filler and insulative base
US7425759B1 (en) 2003-11-20 2008-09-16 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal and filler
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US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7268421B1 (en) 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7446419B1 (en) 2004-11-10 2008-11-04 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar of stacked metal balls
US7518384B2 (en) * 2005-01-31 2009-04-14 Agilent Technologies, Inc. Method and apparatus for manufacturing and probing test probe access structures on vias
JP4110421B2 (ja) * 2005-07-27 2008-07-02 セイコーエプソン株式会社 半導体装置の製造方法
JP4343177B2 (ja) 2006-02-06 2009-10-14 富士通マイクロエレクトロニクス株式会社 半導体装置
US7494843B1 (en) 2006-12-26 2009-02-24 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US7811863B1 (en) 2006-10-26 2010-10-12 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
KR101896972B1 (ko) 2011-09-19 2018-09-11 삼성전자주식회사 패키지 기판 및 이를 갖는 반도체 패키지
DE102013222433A1 (de) * 2013-11-05 2015-05-21 Robert Bosch Gmbh Verfahren zum Herstellen einer Flip-Chip-Schaltungsanordnung und Flip-Chip-Schaltungsanordnung
US9087815B2 (en) * 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
DE102014201166A1 (de) * 2014-01-23 2015-08-06 Robert Bosch Gmbh Verfahren zum Herstellen einer Flip-Chip-Schaltungsanordnung und Flip-Chip-Schaltungsanordnung

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JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS61219159A (ja) * 1985-03-25 1986-09-29 Toshiba Corp 金ボ−ルバンプの製造方法
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GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
JP2830109B2 (ja) * 1989-07-19 1998-12-02 日本電気株式会社 バンプ形成方法およびバンプ形成装置
JPH03208354A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
JP3116412B2 (ja) * 1991-05-16 2000-12-11 セイコーエプソン株式会社 半導体装置のバンプ電極形成方法、表示装置及び電子印字装置
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580510B (zh) * 2011-02-15 2017-05-01 東麗工程股份有限公司 Installation method and installation device

Also Published As

Publication number Publication date
KR100239286B1 (ko) 2000-01-15
CN1051641C (zh) 2000-04-19
EP0720226A2 (en) 1996-07-03
US5686353A (en) 1997-11-11
CN1153267C (zh) 2004-06-09
DE69535551D1 (de) 2007-09-20
CN1248062A (zh) 2000-03-22
EP0720226B1 (en) 2007-08-08
CN1130306A (zh) 1996-09-04
DE69535551T2 (de) 2008-04-30
EP0720226A3 (en) 1997-11-19
KR960028730A (ko) 1996-07-22

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