TW280983B - - Google Patents

Info

Publication number
TW280983B
TW280983B TW084110485A TW84110485A TW280983B TW 280983 B TW280983 B TW 280983B TW 084110485 A TW084110485 A TW 084110485A TW 84110485 A TW84110485 A TW 84110485A TW 280983 B TW280983 B TW 280983B
Authority
TW
Taiwan
Application number
TW084110485A
Other languages
Chinese (zh)
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW280983B publication Critical patent/TW280983B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Wire Bonding (AREA)
TW084110485A 1994-10-06 1995-10-05 TW280983B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24279094A JP3206331B2 (ja) 1994-10-06 1994-10-06 異方性導電テープの貼着装置及び異方性導電テープの貼着方法

Publications (1)

Publication Number Publication Date
TW280983B true TW280983B (fr) 1996-07-11

Family

ID=17094337

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110485A TW280983B (fr) 1994-10-06 1995-10-05

Country Status (4)

Country Link
JP (1) JP3206331B2 (fr)
KR (1) KR100293893B1 (fr)
TW (1) TW280983B (fr)
WO (1) WO1996011494A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104221487A (zh) * 2012-04-18 2014-12-17 富士机械制造株式会社 自动拼接装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000015583A (ko) * 1998-08-31 2000-03-15 김규현 반도체 패키지 제조를 위한 회로필름과 일레스토마테이프 접착장치
KR20000015592A (ko) * 1998-08-31 2000-03-15 김규현 반도체패키지 제조용 써킷테이프와 웨이퍼 접착장치
KR100370847B1 (ko) * 1998-08-31 2003-07-10 앰코 테크놀로지 코리아 주식회사 반도체패키지제조를위한웨이퍼와써킷테이프의라미네이션장치및그방법
JP3704502B2 (ja) 2002-01-15 2005-10-12 松下電器産業株式会社 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。
KR100861507B1 (ko) * 2002-04-15 2008-10-02 삼성테크윈 주식회사 필름형 리이드 프레임을 캐리어 프레임에 부착시키는 장치 및 방법
JP4137725B2 (ja) 2002-07-10 2008-08-20 松下電器産業株式会社 接合部材の加工寸法決定方法および装置
JP4546820B2 (ja) * 2004-12-24 2010-09-22 立山マシン株式会社 フィルム貼付装置
KR100802660B1 (ko) * 2006-02-28 2008-02-13 주식회사 탑 엔지니어링 본딩 장비의 테잎 가이드 폭 조정장치
JP2007302398A (ja) * 2006-05-11 2007-11-22 Matsushita Electric Ind Co Ltd 接合シート貼付装置及び方法
JP4607815B2 (ja) * 2006-05-11 2011-01-05 パナソニック株式会社 接合シート貼付装置及び方法
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
JP5266582B2 (ja) * 2008-12-26 2013-08-21 Ｎｌｔテクノロジー株式会社 Ａｃｆ貼付装置及び表示装置の製造方法
JP2012119418A (ja) 2010-11-30 2012-06-21 Hitachi High-Technologies Corp 導電性フィルム貼り付け装置、結晶系太陽電池モジュール組立装置及び結晶系太陽電池セルの接続方法
KR20210050622A (ko) 2019-10-28 2021-05-10 삼성디스플레이 주식회사 표시 장치의 제조 방법, 이에 의해 제조된 표시 장치 및 acf 부착 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293721A (ja) * 1989-05-08 1990-12-04 Sharp Corp 異方性導電膜貼り付け方法
JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置
JP2769263B2 (ja) * 1992-06-22 1998-06-25 ケル株式会社 転写用異方性接着剤テープの作成方法および装置
KR100706601B1 (ko) * 2003-12-03 2007-04-11 한국전자통신연구원 객체 기반 컨텐츠 부가 데이터 변환 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104221487A (zh) * 2012-04-18 2014-12-17 富士机械制造株式会社 自动拼接装置
CN104221487B (zh) * 2012-04-18 2017-03-01 富士机械制造株式会社 自动拼接装置

Also Published As

Publication number Publication date
JP3206331B2 (ja) 2001-09-10
KR100293893B1 (ko) 2001-11-30
JPH08107268A (ja) 1996-04-23
WO1996011494A1 (fr) 1996-04-18
KR970706600A (ko) 1997-11-03

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