TW278138B - - Google Patents

Info

Publication number
TW278138B
TW278138B TW084111405A TW84111405A TW278138B TW 278138 B TW278138 B TW 278138B TW 084111405 A TW084111405 A TW 084111405A TW 84111405 A TW84111405 A TW 84111405A TW 278138 B TW278138 B TW 278138B
Authority
TW
Taiwan
Application number
TW084111405A
Original Assignee
Micromodule Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micromodule Systems Inc filed Critical Micromodule Systems Inc
Application granted granted Critical
Publication of TW278138B publication Critical patent/TW278138B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW084111405A 1994-10-28 1995-10-28 TW278138B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33105594A 1994-10-28 1994-10-28

Publications (1)

Publication Number Publication Date
TW278138B true TW278138B (zh) 1996-06-11

Family

ID=23292443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111405A TW278138B (zh) 1994-10-28 1995-10-28

Country Status (6)

Country Link
US (1) US5973504A (zh)
EP (1) EP0788729A4 (zh)
JP (1) JP3685498B2 (zh)
KR (1) KR100384265B1 (zh)
TW (1) TW278138B (zh)
WO (1) WO1996013967A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418162B (zh) * 2009-10-26 2013-12-01 Elektrobit System Test Oy 空中測試
WO2018068627A1 (zh) * 2016-10-12 2018-04-19 肖敏 用于芯片测试和编程的装置及其制造方法

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US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
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US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
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US6847203B1 (en) * 2003-07-02 2005-01-25 International Business Machines Corporation Applying parametric test patterns for high pin count ASICs on low pin count testers
JP4465995B2 (ja) * 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
US6853205B1 (en) * 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US7224173B2 (en) * 2003-10-01 2007-05-29 Taiwan Semiconductor Manufacturing Co., Ltd. Electrical bias electrical test apparatus and method
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KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US20060087331A1 (en) * 2004-10-22 2006-04-27 Young Michael E System and method for a multisite, integrated, combination probe card and spider card
KR100688517B1 (ko) * 2005-01-11 2007-03-02 삼성전자주식회사 전압공급유닛 분할을 통한 반도체 소자의 병렬검사 방법
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7541819B2 (en) * 2005-10-28 2009-06-02 Teradyne, Inc. Modularized device interface with grounding insert between two strips
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
JP2007205960A (ja) * 2006-02-03 2007-08-16 Tokyo Electron Ltd プローブカード及びプローブ装置
US7859277B2 (en) * 2006-04-24 2010-12-28 Verigy (Singapore) Pte. Ltd. Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
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US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP5427536B2 (ja) * 2009-10-01 2014-02-26 東京エレクトロン株式会社 プローブカード
KR102016427B1 (ko) * 2013-09-10 2019-09-02 삼성전자주식회사 포고 핀 및 이를 포함하는 프로브 카드
TWI779586B (zh) * 2021-04-30 2022-10-01 瑞昱半導體股份有限公司 測試電路系統的方法及相關電路系統

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418162B (zh) * 2009-10-26 2013-12-01 Elektrobit System Test Oy 空中測試
WO2018068627A1 (zh) * 2016-10-12 2018-04-19 肖敏 用于芯片测试和编程的装置及其制造方法

Also Published As

Publication number Publication date
EP0788729A1 (en) 1997-08-13
JP3685498B2 (ja) 2005-08-17
KR100384265B1 (ko) 2003-08-14
JPH10508380A (ja) 1998-08-18
EP0788729A4 (en) 1998-06-03
KR970707708A (ko) 1997-12-01
WO1996013967A1 (en) 1996-05-09
US5973504A (en) 1999-10-26

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