TW267243B - - Google Patents

Info

Publication number
TW267243B
TW267243B TW084105275A TW84105275A TW267243B TW 267243 B TW267243 B TW 267243B TW 084105275 A TW084105275 A TW 084105275A TW 84105275 A TW84105275 A TW 84105275A TW 267243 B TW267243 B TW 267243B
Authority
TW
Taiwan
Application number
TW084105275A
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW267243B publication Critical patent/TW267243B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31764—Dividing into sub-patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31769—Proximity effect correction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31776—Shaped beam
TW084105275A 1994-05-25 1995-05-25 TW267243B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6110646A JP2647000B2 (ja) 1994-05-25 1994-05-25 電子ビームの露光方法

Publications (1)

Publication Number Publication Date
TW267243B true TW267243B (zh) 1996-01-01

Family

ID=14540973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105275A TW267243B (zh) 1994-05-25 1995-05-25

Country Status (4)

Country Link
US (1) US5563419A (zh)
JP (1) JP2647000B2 (zh)
KR (1) KR0148647B1 (zh)
TW (1) TW267243B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730305B1 (en) * 2000-05-08 2004-05-04 The Uab Research Foundation Nucleotide sequences encoding bovine respiratory syncytial virus immunogenic proteins
JP3348586B2 (ja) * 1995-12-28 2002-11-20 ソニー株式会社 電子線リソグラフィ技術における近接効果補正法
JP2914264B2 (ja) * 1996-01-16 1999-06-28 日本電気株式会社 電子ビーム描画方法
US5847959A (en) * 1997-01-28 1998-12-08 Etec Systems, Inc. Method and apparatus for run-time correction of proximity effects in pattern generation
JP2950280B2 (ja) * 1997-03-31 1999-09-20 日本電気株式会社 電子線の描画方法
US6376847B1 (en) * 1998-08-24 2002-04-23 Matsushia Electric Industrial Co., Ltd. Charged particle lithography method and system
JP3686367B2 (ja) * 2001-11-15 2005-08-24 株式会社ルネサステクノロジ パターン形成方法および半導体装置の製造方法
KR100459697B1 (ko) * 2001-12-27 2004-12-04 삼성전자주식회사 가변적인 후방 산란 계수를 이용하는 전자빔 노광 방법 및이를 기록한 컴퓨터로 읽을 수 있는 기록 매체
JP4773224B2 (ja) * 2006-02-14 2011-09-14 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置、荷電粒子ビーム描画方法及びプログラム
JP4976071B2 (ja) * 2006-02-21 2012-07-18 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画方法及び荷電粒子ビーム描画装置
US7902528B2 (en) * 2006-11-21 2011-03-08 Cadence Design Systems, Inc. Method and system for proximity effect and dose correction for a particle beam writing device
US7824828B2 (en) * 2007-02-22 2010-11-02 Cadence Design Systems, Inc. Method and system for improvement of dose correction for particle beam writers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493364A (en) * 1977-12-30 1979-07-24 Fujitsu Ltd Exposure system for electron beam
JPS57204125A (en) * 1981-06-10 1982-12-14 Hitachi Ltd Electron-ray drawing device
JPS59167018A (ja) * 1983-03-11 1984-09-20 Hitachi Ltd 電子線描画方法
JP2680074B2 (ja) * 1988-10-24 1997-11-19 富士通株式会社 荷電粒子ビーム露光を用いた半導体装置の製造方法
JP2658399B2 (ja) * 1989-06-15 1997-09-30 松下電器産業株式会社 空気調和機
JP2512184B2 (ja) * 1990-01-31 1996-07-03 株式会社日立製作所 荷電粒子線描画装置及び描画方法
JPH04137520A (ja) * 1990-09-28 1992-05-12 Hitachi Ltd 電子線描画装置および描画方法
IL97021A0 (en) * 1991-01-24 1992-03-29 Ibm Israel Partitioning method for e-beam lithography
IL97022A0 (en) * 1991-01-24 1992-03-29 Ibm Israel Partitioning method for e-beam lithography
JP3218468B2 (ja) * 1992-06-24 2001-10-15 株式会社ニコン 電子線描画装置

Also Published As

Publication number Publication date
KR950033698A (ko) 1995-12-26
KR0148647B1 (ko) 1998-11-02
JPH07321011A (ja) 1995-12-08
JP2647000B2 (ja) 1997-08-27
US5563419A (en) 1996-10-08

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