TW270902B - - Google Patents

Info

Publication number
TW270902B
TW270902B TW083100976A TW83100976A TW270902B TW 270902 B TW270902 B TW 270902B TW 083100976 A TW083100976 A TW 083100976A TW 83100976 A TW83100976 A TW 83100976A TW 270902 B TW270902 B TW 270902B
Authority
TW
Taiwan
Application number
TW083100976A
Other languages
Chinese (zh)
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of TW270902B publication Critical patent/TW270902B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H10P14/6522—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H10P14/6529—
    • H10P95/08—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00—Other type of polymers
    • B05D2518/10—Silicon-containing polymers
    • B05D2518/12—Ceramic precursors (polysiloxanes, polysilazanes)
    • H10P14/6342—
    • H10P14/6689—
    • H10P14/69215—
    • H10P14/6922—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW083100976A 1993-02-05 1994-02-05 TW270902B (Direct)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1387393A 1993-02-05 1993-02-05

Publications (1)

Publication Number Publication Date
TW270902B true TW270902B (Direct) 1996-02-21

Family

ID=21762247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100976A TW270902B (Direct) 1993-02-05 1994-02-05

Country Status (6)

Country Link
US (1) US5358739A (Direct)
EP (1) EP0611067B1 (Direct)
JP (1) JPH072511A (Direct)
KR (1) KR100313382B1 (Direct)
DE (1) DE69416881T2 (Direct)
TW (1) TW270902B (Direct)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2790163B2 (ja) * 1993-07-29 1998-08-27 富士通株式会社 シリコン酸化膜の形成方法、半導体装置の製造方法及びフラットディスプレイ装置の製造方法
US5837318A (en) * 1995-04-26 1998-11-17 Mcdonnell Douglas Corporation Process for production of low dielectric ceramic composites
DE69622928T2 (de) * 1995-05-29 2002-12-12 Fuji Photo Film Co., Ltd. Verfahren zur Herstellung von Schutzschichten aus Siliziumdioxid
TW353108B (en) * 1995-06-16 1999-02-21 Dow Corning Composite electronic coatings
US5635240A (en) * 1995-06-19 1997-06-03 Dow Corning Corporation Electronic coating materials using mixed polymers
US5661092A (en) * 1995-09-01 1997-08-26 The University Of Connecticut Ultra thin silicon oxide and metal oxide films and a method for the preparation thereof
JP2825077B2 (ja) * 1996-01-26 1998-11-18 日本電気株式会社 半導体装置の製造方法および製造装置
JP3420590B2 (ja) * 1996-11-11 2003-06-23 触媒化成工業株式会社 基材の平坦化方法、被膜付基材および半導体装置の製造方法
US5924005A (en) * 1997-02-18 1999-07-13 Motorola, Inc. Process for forming a semiconductor device
EP0862202A1 (en) * 1997-02-27 1998-09-02 Nec Corporation Method for making a semiconductor device with a planarizing SOG layer and apparatus used in the same method
US5932283A (en) * 1998-05-01 1999-08-03 Nec Corporation Method for fabricating SiO2 film
JP2000012536A (ja) 1998-06-24 2000-01-14 Tokyo Ohka Kogyo Co Ltd シリカ被膜形成方法
US5935638A (en) * 1998-08-06 1999-08-10 Dow Corning Corporation Silicon dioxide containing coating
EP1085578B1 (en) * 1999-03-30 2007-04-18 Seiko Epson Corporation Method of manufacturing thin-film transistor
KR100362834B1 (ko) 2000-05-02 2002-11-29 삼성전자 주식회사 반도체 장치의 산화막 형성 방법 및 이에 의하여 제조된 반도체 장치
US6576964B1 (en) * 2000-08-31 2003-06-10 Micron Technology, Inc. Dielectric layer for a semiconductor device having less current leakage and increased capacitance
US6410968B1 (en) * 2000-08-31 2002-06-25 Micron Technology, Inc. Semiconductor device with barrier layer
US6521544B1 (en) 2000-08-31 2003-02-18 Micron Technology, Inc. Method of forming an ultra thin dielectric film
US6479405B2 (en) 2000-10-12 2002-11-12 Samsung Electronics Co., Ltd. Method of forming silicon oxide layer in semiconductor manufacturing process using spin-on glass composition and isolation method using the same method
US6376431B1 (en) 2001-03-15 2002-04-23 Honeywell International Inc. Reduced wear carbon brake material
US20040070704A1 (en) * 2001-10-02 2004-04-15 Lazarev Pavel I. Multilayer plate for the fabrication of a display panel
US7317499B2 (en) * 2002-08-22 2008-01-08 Nitto Denko Corporation Multilayer plate and display panel with anisotropic crystal film and conducting protective layer
JP2005116546A (ja) * 2003-10-02 2005-04-28 Toshiba Corp 半導体装置およびその製造方法
JP4501519B2 (ja) * 2004-04-23 2010-07-14 凸版印刷株式会社 Ｐｄｐ用金属隔壁の製造方法
US7439111B2 (en) * 2004-09-29 2008-10-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
DE102006008308A1 (de) 2006-02-23 2007-08-30 Clariant International Limited Polysilazane enthaltende Beschichtungen zur Vermeidung von Zunderbildung und Korrosion
JP5100077B2 (ja) * 2006-10-04 2012-12-19 敏夫 寺中 シリカ膜の製造方法
JP5160189B2 (ja) * 2007-10-26 2013-03-13 ＡｚエレクトロニックマテリアルズＩｐ株式会社 緻密なシリカ質膜を得ることができるポリシラザン化合物含有組成物
JP5069582B2 (ja) * 2008-02-05 2012-11-07 有限会社コンタミネーション・コントロール・サービス シリカ膜の形成方法
JP5329825B2 (ja) 2008-02-25 2013-10-30 株式会社東芝 半導体装置の製造方法
JP5159680B2 (ja) * 2009-03-24 2013-03-06 株式会社東芝 塗布型膜の形成方法
JP5772822B2 (ja) * 2010-06-18 2015-09-02 Jnc株式会社 流体分離用複合多孔質膜、その製造方法及びフィルター
GB201506244D0 (en) * 2015-04-13 2015-05-27 Pilkington Group Ltd Coated glazing
WO2017171489A1 (ko) * 2016-03-31 2017-10-05 주식회사 엘지화학 배리어 필름의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719125A (en) * 1985-10-11 1988-01-12 Allied Corporation Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology
EP0218117A3 (en) * 1985-10-11 1989-11-23 Allied Corporation Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology
US4746480A (en) * 1986-08-11 1988-05-24 Hoechst Celanese Corporation Process for providing a protective oxide coating on ceramic fibers
US4826733A (en) * 1986-12-03 1989-05-02 Dow Corning Corporation Sin-containing coatings for electronic devices
US4756977A (en) * 1986-12-03 1988-07-12 Dow Corning Corporation Multilayer ceramics from hydrogen silsesquioxane
US4749631B1 (en) * 1986-12-04 1993-03-23 Multilayer ceramics from silicate esters
US5176941A (en) * 1987-11-07 1993-01-05 Hoechst Aktiengesellschaft Process of producing a ceramic/fiber composite using a molten polysilazone
JPH01221466A (ja) * 1988-03-01 1989-09-04 Toa Nenryo Kogyo Kk コーティング用組成物及びコーティング方法
US5152819A (en) * 1990-08-16 1992-10-06 Corning Incorporated Method of making fused silica
US5086126A (en) * 1990-12-24 1992-02-04 Dow Corning Corporation Method for producing functional silazane polymers
JP2765765B2 (ja) * 1991-03-14 1998-06-18 東京応化工業株式会社 位相シフタ材料の製造方法
JPH04320055A (ja) * 1991-04-18 1992-11-10 Denki Kagaku Kogyo Kk リードフレームおよび半導体パッケージ
JP2661815B2 (ja) * 1991-06-10 1997-10-08 東京応化工業株式会社 平坦化膜
JP3015104B2 (ja) * 1991-07-16 2000-03-06 触媒化成工業株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
EP0611067A2 (en) 1994-08-17
KR100313382B1 (ko) 2001-12-28
DE69416881T2 (de) 1999-11-04
US5358739A (en) 1994-10-25
JPH072511A (ja) 1995-01-06
KR940019814A (ko) 1994-09-15
EP0611067A3 (en) 1995-01-25
EP0611067B1 (en) 1999-03-10
DE69416881D1 (de) 1999-04-15

Similar Documents

Publication Publication Date Title
DK52393D0 (Direct)
TW270902B (Direct)
EP0643122A3 (Direct)
EP0637598A3 (Direct)
EP0644696A3 (Direct)
DK0698306T3 (Direct)
EP0702629A4 (Direct)
EP0710070A4 (Direct)
DK21393D0 (Direct)
EP0700547A4 (Direct)
CZ101796A3 (Direct)
DK21494A (Direct)
ECSDI930150S (Direct)
ECSDI930144S (Direct)
ECSDI930165S (Direct)
ECSDI930171S (Direct)
ECSMU930023U (Direct)
ECSMU930027U (Direct)
ECSMU930028U (Direct)
ECSDI930159S (Direct)
ECSDI930136S (Direct)
ECSDI930135S (Direct)
ECSDI930112S (Direct)
DK91593D0 (Direct)
DK46893D0 (Direct)