TW269730B - - Google Patents
Info
- Publication number
- TW269730B TW269730B TW083101243A TW83101243A TW269730B TW 269730 B TW269730 B TW 269730B TW 083101243 A TW083101243 A TW 083101243A TW 83101243 A TW83101243 A TW 83101243A TW 269730 B TW269730 B TW 269730B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3640893 | 1993-02-25 | ||
JP33786293A JP3324250B2 (ja) | 1993-02-25 | 1993-12-28 | 感光性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW269730B true TW269730B (zh) | 1996-02-01 |
Family
ID=26375452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083101243A TW269730B (zh) | 1993-02-25 | 1994-02-16 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6664021B1 (zh) |
JP (1) | JP3324250B2 (zh) |
KR (1) | KR100286964B1 (zh) |
DE (1) | DE4406282A1 (zh) |
GB (1) | GB2275475B (zh) |
SG (1) | SG43151A1 (zh) |
TW (1) | TW269730B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100366260B1 (ko) * | 1997-12-29 | 2003-03-04 | 제일모직주식회사 | 절연보호막용 폴리이미드 조성물의 제조방법 |
KR100360709B1 (ko) * | 1997-12-31 | 2003-01-24 | 제일모직주식회사 | 실록산폴리이미드전구체조성물및그제조방법 |
US6342333B1 (en) * | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
KR100548625B1 (ko) * | 2003-03-24 | 2006-01-31 | 주식회사 엘지화학 | 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물 |
JPWO2008029816A1 (ja) * | 2006-09-04 | 2010-01-21 | 日本電気株式会社 | 感光性樹脂組成物、屈折率制御方法、およびそれを用いた光導波路並びに光学部品 |
TWI370833B (en) * | 2006-12-29 | 2012-08-21 | Ind Tech Res Inst | Composition with high transparency, high thermal-resistant, and low coefficient of thermal expansion, and flexible transparent film and optoelectronic device employing the same |
FR2935977B1 (fr) * | 2008-09-15 | 2010-12-17 | Centre Nat Rech Scient | Procede d'hydrolyse-polycondensation photochimique de chromophores reticulables a encombrement sterique, catalyse par un acide photogenere et ses applications. |
WO2022054839A1 (ja) * | 2020-09-10 | 2022-03-17 | 三井化学株式会社 | 組成物、積層体及び積層体の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61108627A (ja) * | 1984-11-02 | 1986-05-27 | Chisso Corp | 可溶性ポリイミドシロキサン前駆体及びその製造方法 |
JPH0617474B2 (ja) * | 1985-05-31 | 1994-03-09 | チッソ株式会社 | 高接着性シリコン含有ポリアミド酸の製造法 |
JPH0768347B2 (ja) * | 1985-09-25 | 1995-07-26 | 株式会社日立製作所 | 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法 |
JPS62266537A (ja) * | 1986-05-14 | 1987-11-19 | Fuji Photo Film Co Ltd | マイクロカプセル及びそれを使用した感光性記録材料 |
JPS6416831A (en) * | 1987-07-09 | 1989-01-20 | Chisso Corp | Solution of heat-resistant photosensitive material |
JPH0749482B2 (ja) * | 1988-02-26 | 1995-05-31 | チッソ株式会社 | 低吸湿性かつ高接着性のシリコン含有ポリイミド及びその前駆体の製造方法 |
EP0378156A3 (en) * | 1989-01-09 | 1992-02-26 | Nitto Denko Corporation | Positively photosensitive polyimide composition |
JP3015430B2 (ja) * | 1990-09-10 | 2000-03-06 | 株式会社東芝 | 感光性組成物及び樹脂封止型半導体装置 |
JP2890213B2 (ja) * | 1991-02-25 | 1999-05-10 | チッソ株式会社 | 感光性重合体組成物及びパターンの形成方法 |
US5302489A (en) * | 1991-10-29 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Positive photoresist compositions containing base polymer which is substantially insoluble at pH between 7 and 10, quinonediazide acid generator and silanol solubility enhancer |
JP2674415B2 (ja) * | 1992-01-27 | 1997-11-12 | 信越化学工業株式会社 | 感光性樹脂組成物及び電子部品用保護膜 |
JPH06308730A (ja) * | 1993-04-26 | 1994-11-04 | Chisso Corp | 感光性ポリイミド前駆体組成物 |
JP3306843B2 (ja) * | 1996-02-05 | 2002-07-24 | 日本電信電話株式会社 | マイクロセルを用いた移動通信方法 |
-
1993
- 1993-12-28 JP JP33786293A patent/JP3324250B2/ja not_active Expired - Fee Related
-
1994
- 1994-02-16 TW TW083101243A patent/TW269730B/zh active
- 1994-02-17 GB GB9403074A patent/GB2275475B/en not_active Expired - Fee Related
- 1994-02-17 SG SG1996004493A patent/SG43151A1/en unknown
- 1994-02-25 KR KR1019940003437A patent/KR100286964B1/ko not_active IP Right Cessation
- 1994-02-25 DE DE4406282A patent/DE4406282A1/de not_active Withdrawn
-
1996
- 1996-11-26 US US08/756,440 patent/US6664021B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
SG43151A1 (en) | 1997-10-17 |
US6664021B1 (en) | 2003-12-16 |
GB9403074D0 (en) | 1994-04-06 |
KR940020178A (ko) | 1994-09-15 |
JPH06308731A (ja) | 1994-11-04 |
KR100286964B1 (ko) | 2001-09-17 |
DE4406282A1 (de) | 1994-09-01 |
GB2275475A (en) | 1994-08-31 |
JP3324250B2 (ja) | 2002-09-17 |
GB2275475B (en) | 1996-07-31 |