TW209312B - - Google Patents

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Publication number
TW209312B
TW209312B TW081107473A TW81107473A TW209312B TW 209312 B TW209312 B TW 209312B TW 081107473 A TW081107473 A TW 081107473A TW 81107473 A TW81107473 A TW 81107473A TW 209312 B TW209312 B TW 209312B
Authority
TW
Taiwan
Prior art keywords
chip
wafer
connector
item
circuit
Prior art date
Application number
TW081107473A
Other languages
English (en)
Original Assignee
Trw Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trw Inc filed Critical Trw Inc
Application granted granted Critical
Publication of TW209312B publication Critical patent/TW209312B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6616—Structural association with built-in electrical component with built-in single component with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • H01R13/6397—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap with means for preventing unauthorised use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6666—Structural association with built-in electrical component with built-in electronic circuit with built-in overvoltage protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/00032—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by data exchange
    • H02J7/00036—Charger exchanging data with battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/00047—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with provisions for charging different types of batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/927—Conductive gasket

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Software Systems (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

A6 B6 2〇93i^ 五、發明説明（1 ) 1 ,技術領城 (請先閲讀背面之注意事項再填寫本頁) 本發明傣相關於電子元件，更明確地，使用於作成電 子連接到在一値公連接器之多値腳（P I N)裝置。 2 . 討論 在各種不同應用使用電子連接和電嫌，從不同來源傳 送電子信號到一個同樣地不同目的地。一般地，電缠包括 多個値別電機，其终止於公連接器或母連接器的一端。公 連接器典型地使用一串的腳，其安裝在一般地矩形或圓型 殼内並且和母連接器内插座配合。 在些時候，需獲得擷取每個値別電線上所具有電子信 號。例如，期望能在所有腳上檢測電磁脈波的峰準位所感 應的應力。在過去，需有複雜的主動和被動儀器組件才能 執行此測試，這複雜性由於没有方便方式獲得在電親上每 値電線所具有信號。 經濟部中央標準局員工消費合作社印製 因此需要一個相對地簡單，但可靠技術，使用於容易 地耦合電路到此連接器的腳。電路包括主動或被動電子元 件，和更精密的徹處理器。雖然有此需求，但習知技術未 能提供如本發明所提出對此問題的簡單解決方式。 發明槪要 根據本發明的技術，一個晶片，最好是半導體材料， 具有一串的孔其對準於公連接器的腳。晶片嵌入公連接器 ,因此腳經過晶Μ的孔。晶Μ包含任何各種不同的電路裝 本紙張尺適用中國因家標準（CNS)甲4規格（210 X 297公:iH 3 - 81.9.25,000 Α6 Β6 經濟部中央標準局貝工消費合作社印製 五、發明説明（2 ) 置，其使用於執行預先選擇功能，在腳上有相關信號。這 些電路裝置包括主動或被動電子元件，或前述微處理器， 均容易地在晶片上以積饈電路形式實施。晶Η進一步包括 接觸裝置，使用於脚間之電子接觸，當它們延伸經在晶片 和電路裝置之孔。在此方式，所期望電路和在連接器之脚 間之電子連接容易地和快速地製造，不需要主連接器對的 進步的準備。明顯地，本發明具有廣泛應用。 圖式的簡短説明 在研究說明書和如下圖式後，熟悉該行業之專業人士 將知道本發明的各種不同優點： 圖1係根據本發明最佳實施例的技術，所裂造一個晶 片的安裝之一値爆炸透視圖。 圖2係@發明的一實施例的)剖面圖，其中晶片在相配 合的公知母連接器之間。 圖3偽另一個實施例的部份剖梘圖，和在脚和晶片間 製作電子接觸的技術。 圖4係一値合適的接觸結構的正視圖。 圖5係在使用接觸設計之部份側視圖。 圔6傜一個正視圖，說明晶片的一個持別電路設計。 圖7偽圖6晶片的側視圖，和 圖8係使用於測試晶片糸統的方塊圖。 最佯窖旃例的説明 (請先閱讀背面之注意事項再埸寫〆 裝· 訂· -線· 衣纸張尺度適用中囿國家標準（CNS)甲I規格（2〗0 X 297父#) 4 一 81.9.25,000 209312 A6 _B6_ 五、發明説明（3) 本發明說明將和少數幾値實施例相鼷連，這些實施例 在申請時是本發明的最佳模式。但，熟悉該行業之專業人 士，在研究本文，圖式，和申諳專利範圍後將有不同的修 改。在此認知在心中，現在翻到圖1。 根據本發明的最佳技術，晶片1◦使用於製作電子連 接到一個公電子連接器14的脚1 2。以習知方式公電子 連接器14配合於母電子連接器16。關於規榕，雖然不 限制實施例，並且在圖2—3更詳細的顯示，公/母連接 器14和16是合乎軍用規格（C — 38999)。公連 接器特徵在於一値圓柱形金屬外部，其可移動地連接到在 母連接器1·6上的互補金屬殼20。經常利用一値插入式 耦合在殼18和20配合表面，逹成此可移動連接。雖然 其它此種連接亦能確保連接器的適當配合。 公連接器的内部包括一個非傳導嵌入22,以維持脚 1 2的方向並且绝緣於傳導殼1 8。母連接器1 6包括一 個非傳導嵌入24和一列的插座26使用於收容脚12。 如圖1所示公連接器耦合到電子設備2 8。母連接器 1 6安裝在電纜3 0的一端。電缫包含多個電線，當連接 器1 4和1 6配合在一起時使電子信號在電子設備28傳 送。 根據本發明，晶片1 ◦嵌在配合連接器1 4和1 6之 間。晶片1 0直徑小於最小連接器殼的内直徑，並且厚度 足夠嵌入在一對連接器之間不會干擾之間確定連接。如圖 3所示，晶片10包括二個一般地平行主表面32和34 表纸張&茂適用中國固家標羋（CNS〉甲4规烙（210 X 297公楚45 — 81.9.25,000 A6 B6 209312 五、發明説明（4) * ,沿邊具有一値周邊線3 6。在晶片的二個主表面間形成 一串的孔38。孔38相對並且稍微地大於脚1 2的直徑 0 電路4 ◦，利用號碼40標示，在晶片1〇上形成， 並且是和一或多値孔12電子接觸。電路40可以是任何 不同裝置，例如主動或被動電子元件，和更精密微處理電 路。電路40—般地設計執行預先選擇功能，在脚12上 有相関電子信號。這些功能包括，但不受限制於，射頻儀 器，信號再路由和界面包護使用被動電子元件，例如，電 流/電壓監督器，暫態限制器，和點對點布線。主動電子 元件包括類比和邏輯電路，矩陣開闊，功率管理裝置和溫 度/衡整感測器均可使用，以提供個別事件監督，整合内 建測試變數和診斷，信號處理，界面診斷和/或信號調節 。電路40,在另一方面，可以使用徹處理電路的形式例 如6800 ◦等。並且可包括靜態RAM和ROM或非揮 發記億體。在那事件，電路能提供個別事件記錄，並且基 於信號調節/診斷做決定。 烴濟部中央標毕屬WK工消費合作社印製 如圖6所示電路40,但包含多個熔線42 (a, b 和c),其在晶片10的表面32上薄膜金屬層42減縮 寬度的地區所形成。熔線40 (a, b和c)連接到腳， 並且操作感測在脚1 2上電磁脈波所感應應力。假如，例 如，接收到一個電壓地損害脈波超過一或多個熔線之預先 決定電流水準，將熔化熔線使得相關腳電阻改變。晶片， 在這實施例，以一個矽基底41的形式，並且包括一値鈍 农紙張尺茂適用中國园家橒：‘MC>：S)甲4規格（210 X 297公in 6 - 81.9.25,000 209312 A6 B6 經濟部中央標準屬員工消費合作社印製 I、發明説明（） 化層4 6如圖7所示。除在晶片表面上形成一個簡單金屬 熔線電路40,能使用傳统很大積體電路在半導鳢晶片的 本體内形成主動裝置。 不管怎樣，亦可在脚12和電路4◦之間具有某些型 式的電子連接。在這特定實施例，對每値晶片孔3 8具有 一値金屬盤5 0。如圖3 — 5所示，每値金屬盤50包括 一個直徑稍微地小於連接脚12的横剖面直徑之孔口52 。多値徑向地延伸縫界定一列可彎曲指狀物5 6,它的内 部分在連接器腳的壓力下辇曲嵌入經晶片孔3 8 ,因此和 每値腳成為一値滑動，可移動的，但確動電子連接。盤 50的無縫周邊緣58安裝方式，利用傳導環氣或焊到在 晶Η 10上傳導圓形墊6 ◦圍繞著孔38。盤50利用金 屬軌跡42的方式，連接到電路，其在圖5參考號碼 40/代表形成在半導體材料表面上形成一値主動電子積 髏電路元件，這材料當成晶片10。 在大部份應用，它需使電子連接到連接器對的最内殼 ，其經常當成一個電子接地。在此例子相似於消除電子地 傳導指狀物6 2當成此目的使用，如圖3所示。 圖2説明一個有些更精巧實施例，其在晶Μ 1 〇上電 路4 0間做雙向通信。在此方式，它可能延伸本發明的能 力。如圖2所示，晶片包括一値合適的板上光學收發器 64,經一個光波導管68和一個遠方收發器和轉換器 66通信。收發器和轉換器60耦合到利用一値主電腦所 提供合適控制器7 0。從控制器70的電子信號利用收發 請 先 閲 讀 背 面 之 注 意 事 項-再 s 裝 訂 線 &紙張尺·度適用中囿國家標準（C\s)甲*規恪（210 X 297公？7 »i.y.ZDtoo 209312 A6 B6 五、發明説明（6) 器/轉換器60轉換成為合適光脈波，利用波導管68傳 輸到晶片1 0上收發器64。以合適材料裂成波導管6 8 ，具有足夠彈性和以可靠方式整合以傳輸光學資訊。應有 足夠彈性，因此它能順應在配合連接器的殼1 8和2 ◦間 所留下相對地小路徑，如所示者。例如，波導管68可以 是一値美拉片的形式，在它的外表面最好地塗層一値反射 物質以增加光學傳輸的效率。 光學收發器64轉換從波導管6 8的光學信號成為合 適電子信號，其輸入到晶片1 ◦上電路4 0。例如，此信 號能使用於程式以合適積體電路微處理器當成電路4 0者 。然後，微處理器能經在公連接器14的職12和電子設 備28通信（圖1)。並且，從電子設備28信號能經腳 12,電路40,光學收發器64,波導管68和光學收 發器/轉換器6 6和遠方控制器7 0通信。這型式的条統 能使用於各種不同應用，例如失進信號處理，智慧儀器， 即時資料串監督，遠方地控制信號調節，開關和處理；遠 方地控制界面診斷，暫態資料記錄和相類似者。其次，其 應用未受限於這些實施例。依在晶片10上電路的型式和 應用而定，期望移開此晶片並且測試其上電路。例如，假 如如圖6和7所示熔線形式的電路，期望著週期地移開和 測試此晶片，以決定是否任何熔線4 0 ( a , b , c )熔 化，由於在腳12上高準位電磁所感應出電流脈波。圔8 說明使用於此目的地合適測試控制台7 0。控制台7 0包 括一値晶片識別單元7 2，一値晶Η測試夾具7 4 , —個 本紙張疋度適用中國囚家標阜（CNS)甲4規珞（21f) X 297公Μ 8 - 81,9.25,000 20931^ A6 B6 經濟部中央標準局®:工消費合作钍印制衣 五、發明説明（7) 開關矩陣76，測量電路78,門檻證實電路80和電腦 控制82。識別單元72,利用在每値晶片10上一値識 別標簽84的方式識別一値晶片1 0。在此實施例，標簽 84是一値能利用合適條碼讀碼機8 6讀出的傳统條碼。 一個晶片抽出工具88的幫助，使用晶片的嵌入和移 開於連接器1 4具有最小晶片損害的危險。工具8 8使用 一個員空条统90,具有一個真空頭92能暫時地握住晶 片1 0。在嵌入期間，頭1 0操縱晶片因此脚滑入晶片孔 38,並且電子連接到腳接觸50,並且殼接觸62連接 到殼1 8 (圖3 )。然後以一般方式公和母連接器1 4和 1 6相配合，其中踏II 2嵌入到母插座26内。如圖所示 ，晶片1 0足夠地薄不影饗連接器的正常配合。欲移開晶 片10,使連接器解開，使用員空工具88從公連接器 1 4抽出晶Η 1〇。 然後，晶片放在測試夾具7 4 ,其一般地利用一組相 同軍用規格連接器1 4構成。測試夾具7 4能測試一個晶 片，利用放一個晶片在它的相關連接器的時候。一個 L E D指示器94自動地指示基於晶片識別碼所使用適當 連接器。開關矩陣7 6，開關在連接器的任何腳和另一腳 或連接器殼間的電阻測量。它亦開關在板上開關D C電源 供應，以證實任何熔線40 (a, b或c)的門檻值。利 用電腦6 2經一値匯流排界面卡控制開關矩陣7 6。測量 電路7 8做一値電阻測量，以決定假如有的話那一値熔線 40 (a, b或c)熔化。使用具有一個快速取樣速率的 (請先閲讀背面之注意事項再填S/; 1) .装. 訂. .線. 衣紙張义度適用中國國家標準（CNS)甲4規格（210 X 297公;9 - 8L9.25.000 209312 A6 B6 五、發明説明（8) A/D轉換器，因此在很短時間能測試許多熔線。門檻證 實電路8 0包括一値可程式開闊DC電源供應和一値電源 阻抗網路。它産生一個著名方脈波有足夠振幅熔化任何熔 線。慢慢地步進脈波準位，並且在每個脈波之後讀熔線阻 抗，以決定當熔線烷化和它的門檻值。電腦控制8 2控制 所有条統，並且從測試記錄資料。合適地程式此罨腦，因 此它將控制所有測試步驟。 從前述，該行業專業人士能認知，本發明具有一値簡 單，但可靠方式快速地使電子連接到電子連接器的脚。並 且能夠使得使用者經在晶片上適當電路使用修改或增加廣 泛的功能。從開始的說明，本發明利用幾個待定實施例説 明，但在研究本發明說明書，圖式和以下申請專利範圍該 專業人士將有各種修改應用。 蛵濟部中央標準局員工消費合作社印製 本紙張尺度通用中國因家橒莘（CXS)甲4規柊（2丨0 X 297公？r)l〇 一 81.9.25,000

Claims (1)

  1. 209312 A7 B7 C7 D7 經濟部中央標準局s工消費合作社印製 六、申請專利範团 1. 一種作成電子連接到在一個公電纜連接器的多値 脚之裝置，其中連接器配合於在一艏母連接器的插座，該 裝置包含： 一個晶片，具有一串的孔其對準於在公連接器脚，該 晶片可嵌入公連接器，因此腳延伸經孔； 電路裝置，在晶片上使用於使用在腳上之電子信號； 和 接觸裝置，使用於腳間之電子接觸，當它們延伸經在 晶片和電路裝置之孔。 2. 如申請專利範圍第1項之裝置，所述之該晶片利 用半導體材料做成的。 3. 如申請專利範圍第2項之裝置，所述之該電路装 置包含在半導體晶片上形成的一個積體電路。 4. 如申請專利範圍第2項之裝置，所述之該電路裝 置包： 在半導體晶片上裝置，使用於界於至少一個熔線耩合 到接觭裝置，當在腳上的信號超過一値預先選擇準位則熔 化此熔線。 5. 如申請專利範圍第丨項之裝置，所述之連接器每 個包含一値金屬殼，和裝置進一步包含： 第二接觭裝置，使用於在晶片和一個殼之間作成可移 動電子連接。 6. 如申請專利範圍第1項之裝置，進一步包含： 通信裝置，使用於在晶片上電路裝置和一個遠方控制 (請先閲讀背面之注意事項再蜞寫ί «) -裝· 訂. .線. 本紙張尺度適用中國國家標準（CNS)甲4规格（210 X 297公楚Γ 11 _ 81.9.10,000 Α7 Β7209312 C7 D7 經濟部中央標準局R工消費合作社印製 六、申請專利範固 器間，接收和傳輸資訊。 7. 如申請專利範圍第6項之裝置，所述之通信裝置 包含： 光學收發器裝置，其在晶片上； 遠方光學收發器裝置，其間隔於連接器；和 光導波管裝置，其使用於在晶片上收發器和遠方收發 器之間傳輸光學信號。 8. 如申請專利範圍第7項之裝置，所述之光導波管 裝置包含： 一個彈性片，延伸在公和母連接器的殼之間，片的一 端連接到在晶片上收發器上，和片和另一端連接到遠方收 發器。 9. 如申請專利範圍第1項之裝置，所述之該接觸裝 置包含： 金靥盤，每個具有多個向内地延伸可彎曲指狀物，其 在盤孔口終止；每値盤的外緣部份連接到晶片，因此在盤 孔口對準於晶Η的孔；並且腳延伸經孔口，並且可彎曲指 狀物在腳和晶片之間作成電子連接。 1〇.一種電連接器電路晶片組合，其包含： 一個公電子連接器，具有一個外部金屬殼，和多個電 子地傳導脚具有到電子設備的電子信號； 一個公連接器，具有一個外部金屬殼，和多個插座， 使用於收容公連接器的腳；和 一個半導體晶Η,具有足夠地薄允許公和母連接器相 本紙張尺度適用中國國家標準（CNS)甲4規格（210 X 297公釐Γ 12 - 81.9.10,000 (請先閲讀背面之注意事項再填寫f .裝_ 訂. —線 A7209312 經濟部中央標準局R工消费合作社印繫 六、申請專利範团 配合在一起，允許脚嚙合於插座；晶片包括接觸裝置，使 得脚和晶片之間具有可移動電子連接，因此允許晶片從公 連接器的殼的内部嵌入和移開；和在晶Μ上電路装置，使 用於經在公連接器上腳之接觸裝置電子地通信； 因此晶Η提供簡單電子連接到腳，和到所耩合電子設 備。 11. 如申請專利範圍第1〇項之组合，所述之該電 路裝置，包含形在半導體晶片上之一個積體電路。 12. 如申請專利範圍第1〇項之組合，所述之該電 路裝置包含： 在半導體晶Η上裝置，使用於界定至少一値熔線耦合 到接觸裝置，當在脚上信號超過一個預先選擇準位時熔化 此熔線。 13. 如申請專利範圍第1〇項之組合，進一步包括 第二接觸裝置，使得在晶片和殼之間作成可移動電子 連接。 14. 如申請專利範圍第丨〇項之組合，進一步包括 雙向通信裝置，使用於在晶片上電路裝置和一個遠方 控制器間之資訊接收和傳輸。 1 5 .如申請專利範圍第1 4項之組合，所述之雙向 通信裝置包含·. 光學收發器裝置，其在晶片上； 本紙張尺度適用中國國家標準（CNS)甲4規格（210 X 297公笼Γ 13 一 81.9710,000 (請先《讀背面之注意事項再填 裝. 訂. -線. ^09312 A7 B7 C7 D7 經濟部中央標準局8工消費合作社印製 六、申請專利範圍 遠方光學收發器裝置，間隔於連接器；和 光導波管裝置，使用於在晶片上收發器和遠方收發器 間傳輸光學信號。 16.如申請專利範圍第15項之組合，所述之光導 波管裝置包含： 一値彈性片延伸在公和母連接器的殼之間，片的一端 連接在晶片上收發器，和片的另一端連接到遠方收發器。 1 7.如申請專利範圍第1 0項之組合，所述之該接 觸裝置包含： 金屬盤，每個具有多個向内地延伸可彎曲指狀物，在 盤的一個孔口终止；每個盤的外周邊部份連接到晶片，因 此在盤的孔口對準於晶片的孔；並且腳延伸經孔口，和此 可彎曲指狀物在腳和晶片之間作成電子連接。 18'. —種使電子連接到電子設備的方法，其中電子 設備利用配合公和母連接器可移動地連接到一個電纜，公 連接器具有多値脚延伸進入母連接器的插座内，該方法包 含： 提供一個晶片，具有一串的孔相對於在公連接器的脸1 ， 嵌入晶片^進入公連接器，因此腳延伸經晶片内的孔； 在腳和晶片之間，作成一個摩擦接觸在腳和晶片之間 ;和 使用在晶片上電路，以執行預先選擇功能在腳上具有 信號。 (請先閲讀背面之注意事項再填Wfa：) -—裝· .線. L紙張尺度適用中國國家標準（CNS)甲4规格（210 X 297公釐J 14 一 81.9.10,000 A7 B7 C7 D7 209似 六、申請專利範圍 19. 如申請專利範圍所述第18項之方法，所述之 方法進一步包含： 在電子設備和遠方控制器之間，經晶片和它的接觸於 腳雙向地通信。 20. 如申請專利範圍第18項之方法，進一步包括 未配合公和母連接器； 從公連接器移開晶Η;並且 測量在晶片上電路的特徽。 (請先閲讀背面之注意事項再堉t •裝· 訂 .線. 經濟部中央標準局SX消費合作社印製 未纸張尺度適用中國國家標準（CNS)甲4規格（210 X 297公鏠了 15 - 81.9.10,000
TW081107473A 1992-06-05 1992-09-22 TW209312B (zh)

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CA2077486C (en) 1995-09-26
US5290191A (en) 1994-03-01
EP0573714A2 (en) 1993-12-15
EP0573714B1 (en) 1996-11-13
JPH0715957B2 (ja) 1995-02-22
KR0162907B1 (ko) 1999-01-15
US5181859A (en) 1993-01-26
KR940006314A (ko) 1994-03-23
DE69215215D1 (de) 1996-12-19
DE69215215T2 (de) 1997-03-13
JPH0637214A (ja) 1994-02-10
CA2077486A1 (en) 1993-12-06
EP0573714A3 (en) 1995-04-26

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