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This is one type of fabrication of the narrow type code area of ROM. It consists of: 1. Forming the gate oxidizing layer and depositing the first polysilicon on the surface of substrate; 2. Coating, etching and removing the photo resistance in fixed pitch on the first polysilicon; 3. Embedding the N+ ion into the substrate to form N+ source/drain area; 4. Forming an oxidizing layer of high thickness with low temperature oxidizing way and removing photo resistance to form an oxidizing layer between the neighboring N+ source/drain area; 5. Depositing the second polysilicon on the outer surface.
TW81109469A1992-11-261992-11-26The fabrication of read-only-memory
TW208091B
(en)