TW207015B - Process for fabricating electronic devices and image sensor - Google Patents

Process for fabricating electronic devices and image sensor

Info

Publication number
TW207015B
TW207015B TW081104136A TW81104136A TW207015B TW 207015 B TW207015 B TW 207015B TW 081104136 A TW081104136 A TW 081104136A TW 81104136 A TW81104136 A TW 81104136A TW 207015 B TW207015 B TW 207015B
Authority
TW
Taiwan
Prior art keywords
areas
substrate
electronic devices
input
image sensor
Prior art date
Application number
TW081104136A
Other languages
English (en)
Inventor
Koichi Oka
Yuichi Ichikawa
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Application granted granted Critical
Publication of TW207015B publication Critical patent/TW207015B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Dicing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW081104136A 1991-05-31 1992-05-27 Process for fabricating electronic devices and image sensor TW207015B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3156147A JP2707871B2 (ja) 1991-05-31 1991-05-31 電子デバイス及びその製造方法

Publications (1)

Publication Number Publication Date
TW207015B true TW207015B (en) 1993-06-01

Family

ID=15621363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081104136A TW207015B (en) 1991-05-31 1992-05-27 Process for fabricating electronic devices and image sensor

Country Status (4)

Country Link
US (1) US5337474A (zh)
JP (1) JP2707871B2 (zh)
KR (1) KR960001344B1 (zh)
TW (1) TW207015B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985690A (en) * 1995-01-30 1999-11-16 Nec Corporation Method of manufacturing contact image sensor
GB2314674B (en) * 1996-06-27 1998-09-16 Toshiba Cambridge Res Center Optically operable semiconductor device
JP2002050754A (ja) * 2000-05-08 2002-02-15 Canon Inc 半導体装置とその製造方法、放射線検出装置とそれを用いた放射線検出システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
GB2034127B (en) * 1978-10-13 1983-05-18 Matsushita Electric Ind Co Ltd Printed circuits and methods their manufacture
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
JPS57211248A (en) * 1981-06-22 1982-12-25 Hitachi Ltd Semiconductor integrated circuit device
JPS589360A (ja) * 1981-07-10 1983-01-19 Hitachi Ltd 混成集積回路の製造方法
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
JPH0255626A (ja) * 1988-08-20 1990-02-26 Benkan Corp エルボ成形用鋼板素材の板取り方法
JPH0265278A (ja) * 1988-08-31 1990-03-05 Toshiba Corp １次元イメージセンサ
KR970004752B1 (ko) * 1989-03-07 1997-04-03 로-무 가부시기가이샤 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치
JPH0376462A (ja) * 1989-08-18 1991-04-02 Ricoh Co Ltd イメージセンサ多数個取用大面積基板およびイメージセンサ
JPH03120868A (ja) * 1989-10-04 1991-05-23 Fuji Xerox Co Ltd イメージセンサ
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits

Also Published As

Publication number Publication date
KR960001344B1 (ko) 1996-01-26
KR920022543A (ko) 1992-12-19
JPH04354372A (ja) 1992-12-08
US5337474A (en) 1994-08-16
JP2707871B2 (ja) 1998-02-04

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent