TW202602692A - 半導體製造步驟用聚酯膜 - Google Patents

半導體製造步驟用聚酯膜

Info

Publication number
TW202602692A
TW202602692A TW114112124A TW114112124A TW202602692A TW 202602692 A TW202602692 A TW 202602692A TW 114112124 A TW114112124 A TW 114112124A TW 114112124 A TW114112124 A TW 114112124A TW 202602692 A TW202602692 A TW 202602692A
Authority
TW
Taiwan
Prior art keywords
film
polyester
mol
layer
semiconductor manufacturing
Prior art date
Application number
TW114112124A
Other languages
English (en)
Chinese (zh)
Inventor
早川愛璃彩
鈴木智博
田中伊藤理奈
Original Assignee
日商三菱化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱化學股份有限公司 filed Critical 日商三菱化學股份有限公司
Publication of TW202602692A publication Critical patent/TW202602692A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW114112124A 2024-03-29 2025-03-28 半導體製造步驟用聚酯膜 TW202602692A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-058030 2024-03-29
JP2024058030 2024-03-29

Publications (1)

Publication Number Publication Date
TW202602692A true TW202602692A (zh) 2026-01-16

Family

ID=97220126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114112124A TW202602692A (zh) 2024-03-29 2025-03-28 半導體製造步驟用聚酯膜

Country Status (3)

Country Link
JP (1) JP7790639B1 (https=)
TW (1) TW202602692A (https=)
WO (1) WO2025206291A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003342393A (ja) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp ダイシングテープ用ポリエステル系軟質フィルム
JP2006007423A (ja) * 2004-06-22 2006-01-12 Mitsubishi Polyester Film Copp バックグラインドテープ用ポリエステルフィルム
JP5231885B2 (ja) * 2008-07-09 2013-07-10 株式会社リブドゥコーポレーション 吸収性物品および吸収性物品の製造方法
JP5396090B2 (ja) * 2009-01-27 2014-01-22 リンテック株式会社 印刷用シート
JP7446773B2 (ja) * 2019-11-07 2024-03-11 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
KR20220133199A (ko) * 2020-01-30 2022-10-04 미쯔비시 케미컬 주식회사 공중합 폴리에스테르 필름, 적층 필름 및 이들의 사용 방법
JP7536528B2 (ja) * 2020-06-29 2024-08-20 日東電工株式会社 積層体
JP7726000B2 (ja) * 2021-10-15 2025-08-20 三菱ケミカル株式会社 ポリエステルフィルムロール
WO2023243487A1 (ja) * 2022-06-13 2023-12-21 日東電工株式会社 電子部品仮固定用粘着シート
JP7819041B2 (ja) * 2022-06-13 2026-02-24 日東電工株式会社 電子部品仮固定用粘着シート

Also Published As

Publication number Publication date
JP7790639B1 (ja) 2025-12-23
WO2025206291A1 (ja) 2025-10-02
JPWO2025206291A1 (https=) 2025-10-02

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