JPWO2025206291A1 - - Google Patents
Info
- Publication number
- JPWO2025206291A1 JPWO2025206291A1 JP2025540436A JP2025540436A JPWO2025206291A1 JP WO2025206291 A1 JPWO2025206291 A1 JP WO2025206291A1 JP 2025540436 A JP2025540436 A JP 2025540436A JP 2025540436 A JP2025540436 A JP 2025540436A JP WO2025206291 A1 JPWO2025206291 A1 JP WO2025206291A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024058030 | 2024-03-29 | ||
| JP2024058030 | 2024-03-29 | ||
| PCT/JP2025/012719 WO2025206291A1 (ja) | 2024-03-29 | 2025-03-28 | 半導体製造工程用ポリエステルフィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025206291A1 true JPWO2025206291A1 (https=) | 2025-10-02 |
| JP7790639B1 JP7790639B1 (ja) | 2025-12-23 |
| JPWO2025206291A5 JPWO2025206291A5 (https=) | 2026-03-05 |
Family
ID=97220126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025540436A Active JP7790639B1 (ja) | 2024-03-29 | 2025-03-28 | 半導体製造工程用ポリエステルフィルム |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7790639B1 (https=) |
| TW (1) | TW202602692A (https=) |
| WO (1) | WO2025206291A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003342393A (ja) * | 2002-05-30 | 2003-12-03 | Mitsubishi Polyester Film Copp | ダイシングテープ用ポリエステル系軟質フィルム |
| JP2006007423A (ja) * | 2004-06-22 | 2006-01-12 | Mitsubishi Polyester Film Copp | バックグラインドテープ用ポリエステルフィルム |
| JP5231885B2 (ja) * | 2008-07-09 | 2013-07-10 | 株式会社リブドゥコーポレーション | 吸収性物品および吸収性物品の製造方法 |
| JP5396090B2 (ja) * | 2009-01-27 | 2014-01-22 | リンテック株式会社 | 印刷用シート |
| JP7446773B2 (ja) * | 2019-11-07 | 2024-03-11 | 日東電工株式会社 | ダイシングテープ及びダイシングダイボンドフィルム |
| KR20220133199A (ko) * | 2020-01-30 | 2022-10-04 | 미쯔비시 케미컬 주식회사 | 공중합 폴리에스테르 필름, 적층 필름 및 이들의 사용 방법 |
| JP7536528B2 (ja) * | 2020-06-29 | 2024-08-20 | 日東電工株式会社 | 積層体 |
| JP7726000B2 (ja) * | 2021-10-15 | 2025-08-20 | 三菱ケミカル株式会社 | ポリエステルフィルムロール |
| WO2023243487A1 (ja) * | 2022-06-13 | 2023-12-21 | 日東電工株式会社 | 電子部品仮固定用粘着シート |
| JP7819041B2 (ja) * | 2022-06-13 | 2026-02-24 | 日東電工株式会社 | 電子部品仮固定用粘着シート |
-
2025
- 2025-03-28 WO PCT/JP2025/012719 patent/WO2025206291A1/ja active Pending
- 2025-03-28 TW TW114112124A patent/TW202602692A/zh unknown
- 2025-03-28 JP JP2025540436A patent/JP7790639B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7790639B1 (ja) | 2025-12-23 |
| WO2025206291A1 (ja) | 2025-10-02 |
| TW202602692A (zh) | 2026-01-16 |
Similar Documents
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