JP7790639B1 - 半導体製造工程用ポリエステルフィルム - Google Patents

半導体製造工程用ポリエステルフィルム

Info

Publication number
JP7790639B1
JP7790639B1 JP2025540436A JP2025540436A JP7790639B1 JP 7790639 B1 JP7790639 B1 JP 7790639B1 JP 2025540436 A JP2025540436 A JP 2025540436A JP 2025540436 A JP2025540436 A JP 2025540436A JP 7790639 B1 JP7790639 B1 JP 7790639B1
Authority
JP
Japan
Prior art keywords
film
mol
polyester
dicarboxylic acid
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025540436A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025206291A5 (https=
JPWO2025206291A1 (https=
Inventor
愛璃彩 早川
智博 鈴木
理奈 田中(伊藤)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of JPWO2025206291A1 publication Critical patent/JPWO2025206291A1/ja
Application granted granted Critical
Publication of JP7790639B1 publication Critical patent/JP7790639B1/ja
Publication of JPWO2025206291A5 publication Critical patent/JPWO2025206291A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2025540436A 2024-03-29 2025-03-28 半導体製造工程用ポリエステルフィルム Active JP7790639B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024058030 2024-03-29
JP2024058030 2024-03-29
PCT/JP2025/012719 WO2025206291A1 (ja) 2024-03-29 2025-03-28 半導体製造工程用ポリエステルフィルム

Publications (3)

Publication Number Publication Date
JPWO2025206291A1 JPWO2025206291A1 (https=) 2025-10-02
JP7790639B1 true JP7790639B1 (ja) 2025-12-23
JPWO2025206291A5 JPWO2025206291A5 (https=) 2026-03-05

Family

ID=97220126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025540436A Active JP7790639B1 (ja) 2024-03-29 2025-03-28 半導体製造工程用ポリエステルフィルム

Country Status (3)

Country Link
JP (1) JP7790639B1 (https=)
TW (1) TW202602692A (https=)
WO (1) WO2025206291A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003342393A (ja) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp ダイシングテープ用ポリエステル系軟質フィルム
JP2006007423A (ja) * 2004-06-22 2006-01-12 Mitsubishi Polyester Film Copp バックグラインドテープ用ポリエステルフィルム
JP2010017308A (ja) * 2008-07-09 2010-01-28 Livedo Corporation 伸縮シート、吸収性物品および伸縮シートの製造方法
JP2021077753A (ja) * 2019-11-07 2021-05-20 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
WO2021152923A1 (ja) * 2020-01-30 2021-08-05 三菱ケミカル株式会社 共重合ポリエステルフィルム、積層フィルムおよびこれらの使用方法
JP2022010816A (ja) * 2020-06-29 2022-01-17 日東電工株式会社 積層体
JP2023059547A (ja) * 2021-10-15 2023-04-27 三菱ケミカル株式会社 ポリエステルフィルムロール
JP2023181886A (ja) * 2022-06-13 2023-12-25 日東電工株式会社 電子部品仮固定用粘着シート
JP2023182006A (ja) * 2022-06-13 2023-12-25 日東電工株式会社 電子部品仮固定用粘着シート

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5396090B2 (ja) * 2009-01-27 2014-01-22 リンテック株式会社 印刷用シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003342393A (ja) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp ダイシングテープ用ポリエステル系軟質フィルム
JP2006007423A (ja) * 2004-06-22 2006-01-12 Mitsubishi Polyester Film Copp バックグラインドテープ用ポリエステルフィルム
JP2010017308A (ja) * 2008-07-09 2010-01-28 Livedo Corporation 伸縮シート、吸収性物品および伸縮シートの製造方法
JP2021077753A (ja) * 2019-11-07 2021-05-20 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
WO2021152923A1 (ja) * 2020-01-30 2021-08-05 三菱ケミカル株式会社 共重合ポリエステルフィルム、積層フィルムおよびこれらの使用方法
JP2022010816A (ja) * 2020-06-29 2022-01-17 日東電工株式会社 積層体
JP2023059547A (ja) * 2021-10-15 2023-04-27 三菱ケミカル株式会社 ポリエステルフィルムロール
JP2023181886A (ja) * 2022-06-13 2023-12-25 日東電工株式会社 電子部品仮固定用粘着シート
JP2023182006A (ja) * 2022-06-13 2023-12-25 日東電工株式会社 電子部品仮固定用粘着シート

Also Published As

Publication number Publication date
WO2025206291A1 (ja) 2025-10-02
JPWO2025206291A1 (https=) 2025-10-02
TW202602692A (zh) 2026-01-16

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