TW202522117A - 附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法 - Google Patents
附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法 Download PDFInfo
- Publication number
- TW202522117A TW202522117A TW114105764A TW114105764A TW202522117A TW 202522117 A TW202522117 A TW 202522117A TW 114105764 A TW114105764 A TW 114105764A TW 114105764 A TW114105764 A TW 114105764A TW 202522117 A TW202522117 A TW 202522117A
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- layer
- reflective film
- substrate
- reflective
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019175851 | 2019-09-26 | ||
| JP2019-175851 | 2019-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202522117A true TW202522117A (zh) | 2025-06-01 |
Family
ID=75166148
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW114105764A TW202522117A (zh) | 2019-09-26 | 2020-09-23 | 附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法 |
| TW109132882A TWI877228B (zh) | 2019-09-26 | 2020-09-23 | 附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109132882A TWI877228B (zh) | 2019-09-26 | 2020-09-23 | 附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12346017B2 (enExample) |
| JP (2) | JP7746160B2 (enExample) |
| KR (1) | KR20220065763A (enExample) |
| CN (1) | CN114424119A (enExample) |
| TW (2) | TW202522117A (enExample) |
| WO (1) | WO2021060253A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI811037B (zh) | 2016-07-27 | 2023-08-01 | 美商應用材料股份有限公司 | 具多層吸收劑的極紫外遮罩坯料及製造方法 |
| TW202141165A (zh) | 2020-03-27 | 2021-11-01 | 美商應用材料股份有限公司 | 極紫外光遮罩吸收材料 |
| TW202202641A (zh) | 2020-07-13 | 2022-01-16 | 美商應用材料股份有限公司 | 極紫外線遮罩吸收劑材料 |
| US20220350233A1 (en) * | 2021-05-03 | 2022-11-03 | Applied Materials, Inc. | Extreme ultraviolet mask absorber materials |
| TW202532955A (zh) * | 2023-12-27 | 2025-08-16 | 日商Hoya股份有限公司 | 反射型光罩基底、反射型光罩、及半導體裝置之製造方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5433988A (en) | 1986-10-01 | 1995-07-18 | Canon Kabushiki Kaisha | Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray |
| JPH0797159B2 (ja) | 1986-10-01 | 1995-10-18 | キヤノン株式会社 | 軟x線・真空紫外線用多層膜反射鏡 |
| US5310603A (en) | 1986-10-01 | 1994-05-10 | Canon Kabushiki Kaisha | Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray |
| JPH0816720B2 (ja) | 1992-04-21 | 1996-02-21 | 日本航空電子工業株式会社 | 軟x線多層膜反射鏡 |
| US7217940B2 (en) * | 2003-04-08 | 2007-05-15 | Cymer, Inc. | Collector for EUV light source |
| JP4342830B2 (ja) | 2003-05-02 | 2009-10-14 | Hoya株式会社 | 反射型マスクブランクスの製造方法及び反射型マスクの製造方法並びに反射多層膜付き基板の製造方法。 |
| JP4553239B2 (ja) * | 2004-06-29 | 2010-09-29 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク並びに半導体装置の製造方法 |
| JP2008101916A (ja) | 2006-10-17 | 2008-05-01 | Canon Inc | 多層膜光学素子 |
| KR101485754B1 (ko) * | 2008-09-26 | 2015-01-26 | 주식회사 에스앤에스텍 | 극자외선용 블랭크 마스크 및 이를 이용하여 제조되는 포토마스크 |
| WO2010113787A1 (ja) * | 2009-03-31 | 2010-10-07 | Hoya株式会社 | マスクブランク及び転写用マスクの製造方法 |
| JP2010280931A (ja) * | 2009-06-03 | 2010-12-16 | Canon Inc | 多層膜成膜方法 |
| JP5662123B2 (ja) * | 2010-02-02 | 2015-01-28 | 株式会社日立ハイテクサイエンス | Euvマスク修正装置および方法 |
| JP2012212787A (ja) * | 2011-03-31 | 2012-11-01 | Dainippon Printing Co Ltd | 反射型マスクの製造方法、反射型マスク用イオンビーム装置、および反射型マスク |
| KR101596177B1 (ko) | 2011-08-25 | 2016-02-19 | 도판 인사츠 가부시키가이샤 | 반사형 마스크 및 그 제조 방법 |
| JP2013122952A (ja) * | 2011-12-09 | 2013-06-20 | Asahi Glass Co Ltd | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびに該マスクブランク用の反射層付基板の製造方法 |
| JP6416129B2 (ja) | 2013-02-15 | 2018-10-31 | エーエスエムエル ネザーランズ ビー.ブイ. | 放射源コレクタ及び製造方法 |
| US9612521B2 (en) | 2013-03-12 | 2017-04-04 | Applied Materials, Inc. | Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| JP2014229825A (ja) * | 2013-05-24 | 2014-12-08 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクの製造方法および、該マスクブランク用の反射層付基板の製造方法 |
| NL2017602A (en) * | 2015-11-02 | 2017-05-23 | Stichting Voor Fundamenteel Onderzoek Der Materie | Multilayer Reflector, Method of Manufacturing a Multilayer Reflector and Lithographic Apparatus |
| JP7097159B2 (ja) | 2017-07-03 | 2022-07-07 | 高砂熱学工業株式会社 | 登録プログラム、携帯端末及び登録方法 |
| SG11201913862WA (en) * | 2017-07-05 | 2020-01-30 | Toppan Printing Co Ltd | Reflective photomask blank and reflective photomask |
| JP6904234B2 (ja) | 2017-12-15 | 2021-07-14 | Agc株式会社 | マスクブランク用基板およびマスクブランク |
| JP7401356B2 (ja) * | 2019-03-27 | 2023-12-19 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
| JP6931729B1 (ja) * | 2020-03-27 | 2021-09-08 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
-
2020
- 2020-09-23 TW TW114105764A patent/TW202522117A/zh unknown
- 2020-09-23 US US17/761,100 patent/US12346017B2/en active Active
- 2020-09-23 TW TW109132882A patent/TWI877228B/zh active
- 2020-09-23 CN CN202080066022.1A patent/CN114424119A/zh active Pending
- 2020-09-23 JP JP2021548918A patent/JP7746160B2/ja active Active
- 2020-09-23 KR KR1020227007436A patent/KR20220065763A/ko active Pending
- 2020-09-23 WO PCT/JP2020/035728 patent/WO2021060253A1/ja not_active Ceased
-
2024
- 2024-03-18 JP JP2024041943A patent/JP2024075660A/ja active Pending
-
2025
- 2025-05-28 US US19/220,266 patent/US20250284189A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7746160B2 (ja) | 2025-09-30 |
| TW202117439A (zh) | 2021-05-01 |
| US12346017B2 (en) | 2025-07-01 |
| WO2021060253A1 (ja) | 2021-04-01 |
| TWI877228B (zh) | 2025-03-21 |
| US20220342293A1 (en) | 2022-10-27 |
| JP2024075660A (ja) | 2024-06-04 |
| CN114424119A (zh) | 2022-04-29 |
| US20250284189A1 (en) | 2025-09-11 |
| KR20220065763A (ko) | 2022-05-20 |
| JPWO2021060253A1 (enExample) | 2021-04-01 |
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