KR20220065763A - 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법 - Google Patents

다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR20220065763A
KR20220065763A KR1020227007436A KR20227007436A KR20220065763A KR 20220065763 A KR20220065763 A KR 20220065763A KR 1020227007436 A KR1020227007436 A KR 1020227007436A KR 20227007436 A KR20227007436 A KR 20227007436A KR 20220065763 A KR20220065763 A KR 20220065763A
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South Korea
Prior art keywords
film
multilayer reflective
reflective film
substrate
multilayer
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Pending
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KR1020227007436A
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English (en)
Korean (ko)
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마사노리 나까가와
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호야 가부시키가이샤
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Publication of KR20220065763A publication Critical patent/KR20220065763A/ko
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • G03F1/58Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76Patterning of masks by imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062Devices having a multilayer structure
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00Arrangements for handling radiation or particles
    • G21K2201/06Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/067Construction details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020227007436A 2019-09-26 2020-09-23 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법 Pending KR20220065763A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-175851 2019-09-26
JP2019175851 2019-09-26
PCT/JP2020/035728 WO2021060253A1 (ja) 2019-09-26 2020-09-23 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR20220065763A true KR20220065763A (ko) 2022-05-20

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ID=75166148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227007436A Pending KR20220065763A (ko) 2019-09-26 2020-09-23 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법

Country Status (6)

Country Link
US (2) US12346017B2 (enExample)
JP (2) JP7746160B2 (enExample)
KR (1) KR20220065763A (enExample)
CN (1) CN114424119A (enExample)
TW (2) TW202522117A (enExample)
WO (1) WO2021060253A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774375B (zh) 2016-07-27 2022-08-11 美商應用材料股份有限公司 具多層吸收劑的極紫外遮罩坯料及製造方法
TW202141165A (zh) 2020-03-27 2021-11-01 美商應用材料股份有限公司 極紫外光遮罩吸收材料
TW202202641A (zh) 2020-07-13 2022-01-16 美商應用材料股份有限公司 極紫外線遮罩吸收劑材料
US20220350233A1 (en) * 2021-05-03 2022-11-03 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
TW202532955A (zh) * 2023-12-27 2025-08-16 日商Hoya股份有限公司 反射型光罩基底、反射型光罩、及半導體裝置之製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297194A (ja) 1992-04-21 1993-11-12 Japan Aviation Electron Ind Ltd 軟x線多層膜反射鏡
JP2013122952A (ja) 2011-12-09 2013-06-20 Asahi Glass Co Ltd Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびに該マスクブランク用の反射層付基板の製造方法
JP2016519329A (ja) 2013-03-12 2016-06-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated アモルファス層極端紫外線リソグラフィブランク及びそのための製造・リソグラフィシステム

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797159B2 (ja) 1986-10-01 1995-10-18 キヤノン株式会社 軟x線・真空紫外線用多層膜反射鏡
US5433988A (en) 1986-10-01 1995-07-18 Canon Kabushiki Kaisha Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray
US5310603A (en) 1986-10-01 1994-05-10 Canon Kabushiki Kaisha Multi-layer reflection mirror for soft X-ray to vacuum ultraviolet ray
US7217940B2 (en) * 2003-04-08 2007-05-15 Cymer, Inc. Collector for EUV light source
JP4342830B2 (ja) * 2003-05-02 2009-10-14 Hoya株式会社 反射型マスクブランクスの製造方法及び反射型マスクの製造方法並びに反射多層膜付き基板の製造方法。
JP4553239B2 (ja) 2004-06-29 2010-09-29 Hoya株式会社 反射型マスクブランクス及び反射型マスク並びに半導体装置の製造方法
JP2008101916A (ja) * 2006-10-17 2008-05-01 Canon Inc 多層膜光学素子
KR101485754B1 (ko) * 2008-09-26 2015-01-26 주식회사 에스앤에스텍 극자외선용 블랭크 마스크 및 이를 이용하여 제조되는 포토마스크
JP5317310B2 (ja) 2009-03-31 2013-10-16 Hoya株式会社 マスクブランク及び転写用マスクの製造方法
JP2010280931A (ja) * 2009-06-03 2010-12-16 Canon Inc 多層膜成膜方法
JP5662123B2 (ja) * 2010-02-02 2015-01-28 株式会社日立ハイテクサイエンス Euvマスク修正装置および方法
JP2012212787A (ja) * 2011-03-31 2012-11-01 Dainippon Printing Co Ltd 反射型マスクの製造方法、反射型マスク用イオンビーム装置、および反射型マスク
EP2750164B1 (en) 2011-08-25 2018-08-01 Toppan Printing Co., Ltd. Reflective mask and method for manufacturing same
US9773578B2 (en) 2013-02-15 2017-09-26 Asml Netherlands B.V. Radiation source-collector and method for manufacture
JP2014229825A (ja) * 2013-05-24 2014-12-08 旭硝子株式会社 Euvリソグラフィ用反射型マスクブランクの製造方法および、該マスクブランク用の反射層付基板の製造方法
NL2017602A (en) * 2015-11-02 2017-05-23 Stichting Voor Fundamenteel Onderzoek Der Materie Multilayer Reflector, Method of Manufacturing a Multilayer Reflector and Lithographic Apparatus
JP7097159B2 (ja) 2017-07-03 2022-07-07 高砂熱学工業株式会社 登録プログラム、携帯端末及び登録方法
WO2019009212A1 (ja) 2017-07-05 2019-01-10 凸版印刷株式会社 反射型フォトマスクブランク及び反射型フォトマスク
JP6904234B2 (ja) * 2017-12-15 2021-07-14 Agc株式会社 マスクブランク用基板およびマスクブランク
JP7401356B2 (ja) * 2019-03-27 2023-12-19 Hoya株式会社 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法
JP6931729B1 (ja) * 2020-03-27 2021-09-08 Hoya株式会社 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297194A (ja) 1992-04-21 1993-11-12 Japan Aviation Electron Ind Ltd 軟x線多層膜反射鏡
JP2013122952A (ja) 2011-12-09 2013-06-20 Asahi Glass Co Ltd Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびに該マスクブランク用の反射層付基板の製造方法
JP2016519329A (ja) 2013-03-12 2016-06-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated アモルファス層極端紫外線リソグラフィブランク及びそのための製造・リソグラフィシステム

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WO2021060253A1 (ja) 2021-04-01
US12346017B2 (en) 2025-07-01
US20220342293A1 (en) 2022-10-27
JP2024075660A (ja) 2024-06-04
TW202522117A (zh) 2025-06-01
CN114424119A (zh) 2022-04-29
JP7746160B2 (ja) 2025-09-30
TW202117439A (zh) 2021-05-01
JPWO2021060253A1 (enExample) 2021-04-01
US20250284189A1 (en) 2025-09-11
TWI877228B (zh) 2025-03-21

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