TW202519566A - 光硬化性樹脂組成物、接著劑、密封材、塗佈劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗佈之方法 - Google Patents

光硬化性樹脂組成物、接著劑、密封材、塗佈劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗佈之方法 Download PDF

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Publication number
TW202519566A
TW202519566A TW113127206A TW113127206A TW202519566A TW 202519566 A TW202519566 A TW 202519566A TW 113127206 A TW113127206 A TW 113127206A TW 113127206 A TW113127206 A TW 113127206A TW 202519566 A TW202519566 A TW 202519566A
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TW
Taiwan
Prior art keywords
resin composition
photocurable resin
light
wavelength
parts
Prior art date
Application number
TW113127206A
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English (en)
Chinese (zh)
Inventor
岩谷一希
齊藤信雄
大坪広大
永田理恵子
Original Assignee
日商納美仕有限公司
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Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202519566A publication Critical patent/TW202519566A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW113127206A 2023-07-21 2024-07-19 光硬化性樹脂組成物、接著劑、密封材、塗佈劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗佈之方法 TW202519566A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023119225 2023-07-21
JP2023-119225 2023-07-21

Publications (1)

Publication Number Publication Date
TW202519566A true TW202519566A (zh) 2025-05-16

Family

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Family Applications (1)

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TW113127206A TW202519566A (zh) 2023-07-21 2024-07-19 光硬化性樹脂組成物、接著劑、密封材、塗佈劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗佈之方法

Country Status (5)

Country Link
JP (1) JPWO2025023159A1 (https=)
KR (1) KR20260036193A (https=)
CN (1) CN121358808A (https=)
TW (1) TW202519566A (https=)
WO (1) WO2025023159A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026023322A1 (ja) * 2024-07-22 2026-01-29 ナミックス株式会社 光硬化性樹脂組成物の硬化方法、それを使用する接着、封止及びコーティング方法、並びにその硬化物
WO2026023321A1 (ja) * 2024-07-22 2026-01-29 ナミックス株式会社 光硬化性樹脂組成物、接着剤、封止材、コーティング剤、硬化物、半導体装置、電子部品、並びに光硬化性樹脂組成物を使用する硬化、接着、封止及びコーティング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6750266B2 (en) * 2001-12-28 2004-06-15 3M Innovative Properties Company Multiphoton photosensitization system
KR100736240B1 (ko) 2003-11-26 2007-07-06 미쓰이 가가쿠 가부시키가이샤 1액형의 광 및 열병용 경화성 수지 조성물 및 그 용도
JP2006117864A (ja) 2004-10-25 2006-05-11 Dainippon Printing Co Ltd 蛍光体微粒子
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
CA2875502C (en) * 2012-06-04 2018-01-02 Dentsply International Inc. Dental restorative composite with luminescent crystals
JP6293554B2 (ja) 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
WO2016024618A1 (ja) * 2014-08-12 2016-02-18 三菱樹脂株式会社 透明粘着シート
JP2016183331A (ja) 2015-03-10 2016-10-20 国立大学法人九州大学 フォトンアップコンバージョン組成物
MY176736A (en) 2017-05-18 2020-08-20 Namics Corp Resin composition
JP7307921B2 (ja) 2019-11-15 2023-07-13 国立大学法人九州大学 フォトンアップコンバージョン材料
CN111590877B (zh) * 2020-05-19 2021-03-30 江南大学 一种基于近红外光聚合的墨水直写三维打印的方法
JP2023119225A (ja) 2022-02-16 2023-08-28 セイコーエプソン株式会社 液体吐出装置、制御方法

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Publication number Publication date
CN121358808A (zh) 2026-01-16
JPWO2025023159A1 (https=) 2025-01-30
WO2025023159A1 (ja) 2025-01-30
KR20260036193A (ko) 2026-03-16

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