CN121358808A - 光固化性树脂组合物、粘接剂、密封材料、涂覆剂、固化物、半导体装置、电子部件以及使用光固化性树脂组合物的固化、粘接、密封及涂覆方法 - Google Patents

光固化性树脂组合物、粘接剂、密封材料、涂覆剂、固化物、半导体装置、电子部件以及使用光固化性树脂组合物的固化、粘接、密封及涂覆方法

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Publication number
CN121358808A
CN121358808A CN202480042244.8A CN202480042244A CN121358808A CN 121358808 A CN121358808 A CN 121358808A CN 202480042244 A CN202480042244 A CN 202480042244A CN 121358808 A CN121358808 A CN 121358808A
Authority
CN
China
Prior art keywords
resin composition
light
photocurable resin
wavelength
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480042244.8A
Other languages
English (en)
Chinese (zh)
Inventor
岩谷一希
齐藤信雄
大坪广大
永田理惠子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN121358808A publication Critical patent/CN121358808A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202480042244.8A 2023-07-21 2024-07-19 光固化性树脂组合物、粘接剂、密封材料、涂覆剂、固化物、半导体装置、电子部件以及使用光固化性树脂组合物的固化、粘接、密封及涂覆方法 Pending CN121358808A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023119225 2023-07-21
JP2023-119225 2023-07-21
PCT/JP2024/025880 WO2025023159A1 (ja) 2023-07-21 2024-07-19 光硬化性樹脂組成物、接着剤、封止材、コーティング剤、硬化物、半導体装置、電子部品、並びに光硬化性樹脂組成物を使用する硬化、接着、封止及びコーティング方法

Publications (1)

Publication Number Publication Date
CN121358808A true CN121358808A (zh) 2026-01-16

Family

ID=94375340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480042244.8A Pending CN121358808A (zh) 2023-07-21 2024-07-19 光固化性树脂组合物、粘接剂、密封材料、涂覆剂、固化物、半导体装置、电子部件以及使用光固化性树脂组合物的固化、粘接、密封及涂覆方法

Country Status (5)

Country Link
JP (1) JPWO2025023159A1 (https=)
KR (1) KR20260036193A (https=)
CN (1) CN121358808A (https=)
TW (1) TW202519566A (https=)
WO (1) WO2025023159A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026023322A1 (ja) * 2024-07-22 2026-01-29 ナミックス株式会社 光硬化性樹脂組成物の硬化方法、それを使用する接着、封止及びコーティング方法、並びにその硬化物
WO2026023321A1 (ja) * 2024-07-22 2026-01-29 ナミックス株式会社 光硬化性樹脂組成物、接着剤、封止材、コーティング剤、硬化物、半導体装置、電子部品、並びに光硬化性樹脂組成物を使用する硬化、接着、封止及びコーティング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6750266B2 (en) * 2001-12-28 2004-06-15 3M Innovative Properties Company Multiphoton photosensitization system
KR100736240B1 (ko) 2003-11-26 2007-07-06 미쓰이 가가쿠 가부시키가이샤 1액형의 광 및 열병용 경화성 수지 조성물 및 그 용도
JP2006117864A (ja) 2004-10-25 2006-05-11 Dainippon Printing Co Ltd 蛍光体微粒子
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
CA2875502C (en) * 2012-06-04 2018-01-02 Dentsply International Inc. Dental restorative composite with luminescent crystals
JP6293554B2 (ja) 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
WO2016024618A1 (ja) * 2014-08-12 2016-02-18 三菱樹脂株式会社 透明粘着シート
JP2016183331A (ja) 2015-03-10 2016-10-20 国立大学法人九州大学 フォトンアップコンバージョン組成物
MY176736A (en) 2017-05-18 2020-08-20 Namics Corp Resin composition
JP7307921B2 (ja) 2019-11-15 2023-07-13 国立大学法人九州大学 フォトンアップコンバージョン材料
CN111590877B (zh) * 2020-05-19 2021-03-30 江南大学 一种基于近红外光聚合的墨水直写三维打印的方法
JP2023119225A (ja) 2022-02-16 2023-08-28 セイコーエプソン株式会社 液体吐出装置、制御方法

Also Published As

Publication number Publication date
JPWO2025023159A1 (https=) 2025-01-30
WO2025023159A1 (ja) 2025-01-30
TW202519566A (zh) 2025-05-16
KR20260036193A (ko) 2026-03-16

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