JPWO2025023159A1 - - Google Patents
Info
- Publication number
- JPWO2025023159A1 JPWO2025023159A1 JP2025535783A JP2025535783A JPWO2025023159A1 JP WO2025023159 A1 JPWO2025023159 A1 JP WO2025023159A1 JP 2025535783 A JP2025535783 A JP 2025535783A JP 2025535783 A JP2025535783 A JP 2025535783A JP WO2025023159 A1 JPWO2025023159 A1 JP WO2025023159A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119225 | 2023-07-21 | ||
| PCT/JP2024/025880 WO2025023159A1 (ja) | 2023-07-21 | 2024-07-19 | 光硬化性樹脂組成物、接着剤、封止材、コーティング剤、硬化物、半導体装置、電子部品、並びに光硬化性樹脂組成物を使用する硬化、接着、封止及びコーティング方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023159A1 true JPWO2025023159A1 (https=) | 2025-01-30 |
Family
ID=94375340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535783A Pending JPWO2025023159A1 (https=) | 2023-07-21 | 2024-07-19 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023159A1 (https=) |
| KR (1) | KR20260036193A (https=) |
| CN (1) | CN121358808A (https=) |
| TW (1) | TW202519566A (https=) |
| WO (1) | WO2025023159A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026023322A1 (ja) * | 2024-07-22 | 2026-01-29 | ナミックス株式会社 | 光硬化性樹脂組成物の硬化方法、それを使用する接着、封止及びコーティング方法、並びにその硬化物 |
| WO2026023321A1 (ja) * | 2024-07-22 | 2026-01-29 | ナミックス株式会社 | 光硬化性樹脂組成物、接着剤、封止材、コーティング剤、硬化物、半導体装置、電子部品、並びに光硬化性樹脂組成物を使用する硬化、接着、封止及びコーティング方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6750266B2 (en) * | 2001-12-28 | 2004-06-15 | 3M Innovative Properties Company | Multiphoton photosensitization system |
| KR100736240B1 (ko) | 2003-11-26 | 2007-07-06 | 미쓰이 가가쿠 가부시키가이샤 | 1액형의 광 및 열병용 경화성 수지 조성물 및 그 용도 |
| JP2006117864A (ja) | 2004-10-25 | 2006-05-11 | Dainippon Printing Co Ltd | 蛍光体微粒子 |
| JP2009051954A (ja) | 2007-08-28 | 2009-03-12 | Three Bond Co Ltd | 光および加熱硬化性組成物とその硬化物 |
| CA2875502C (en) * | 2012-06-04 | 2018-01-02 | Dentsply International Inc. | Dental restorative composite with luminescent crystals |
| JP6293554B2 (ja) | 2014-03-31 | 2018-03-14 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法 |
| WO2016024618A1 (ja) * | 2014-08-12 | 2016-02-18 | 三菱樹脂株式会社 | 透明粘着シート |
| JP2016183331A (ja) | 2015-03-10 | 2016-10-20 | 国立大学法人九州大学 | フォトンアップコンバージョン組成物 |
| MY176736A (en) | 2017-05-18 | 2020-08-20 | Namics Corp | Resin composition |
| JP7307921B2 (ja) | 2019-11-15 | 2023-07-13 | 国立大学法人九州大学 | フォトンアップコンバージョン材料 |
| CN111590877B (zh) * | 2020-05-19 | 2021-03-30 | 江南大学 | 一种基于近红外光聚合的墨水直写三维打印的方法 |
| JP2023119225A (ja) | 2022-02-16 | 2023-08-28 | セイコーエプソン株式会社 | 液体吐出装置、制御方法 |
-
2024
- 2024-07-19 JP JP2025535783A patent/JPWO2025023159A1/ja active Pending
- 2024-07-19 WO PCT/JP2024/025880 patent/WO2025023159A1/ja active Pending
- 2024-07-19 KR KR1020257043340A patent/KR20260036193A/ko active Pending
- 2024-07-19 CN CN202480042244.8A patent/CN121358808A/zh active Pending
- 2024-07-19 TW TW113127206A patent/TW202519566A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN121358808A (zh) | 2026-01-16 |
| WO2025023159A1 (ja) | 2025-01-30 |
| TW202519566A (zh) | 2025-05-16 |
| KR20260036193A (ko) | 2026-03-16 |