TW202509256A - 金屬濺鍍靶、金屬濺鍍靶結構體、使用其的膜的製造方法、以及金屬濺鍍靶的製造方法 - Google Patents

金屬濺鍍靶、金屬濺鍍靶結構體、使用其的膜的製造方法、以及金屬濺鍍靶的製造方法 Download PDF

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Publication number
TW202509256A
TW202509256A TW113130751A TW113130751A TW202509256A TW 202509256 A TW202509256 A TW 202509256A TW 113130751 A TW113130751 A TW 113130751A TW 113130751 A TW113130751 A TW 113130751A TW 202509256 A TW202509256 A TW 202509256A
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TW
Taiwan
Prior art keywords
target
outside
target outside
orientation
sputtering target
Prior art date
Application number
TW113130751A
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English (en)
Chinese (zh)
Inventor
正能大起
近藤大雅
原浩之
召田雅実
Original Assignee
日商東曹股份有限公司
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Application filed by 日商東曹股份有限公司 filed Critical 日商東曹股份有限公司
Publication of TW202509256A publication Critical patent/TW202509256A/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW113130751A 2023-08-17 2024-08-15 金屬濺鍍靶、金屬濺鍍靶結構體、使用其的膜的製造方法、以及金屬濺鍍靶的製造方法 TW202509256A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023-133069 2023-08-17
JP2023133069 2023-08-17
JP2023-202660 2023-11-30
JP2023202660 2023-11-30

Publications (1)

Publication Number Publication Date
TW202509256A true TW202509256A (zh) 2025-03-01

Family

ID=94632577

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113130751A TW202509256A (zh) 2023-08-17 2024-08-15 金屬濺鍍靶、金屬濺鍍靶結構體、使用其的膜的製造方法、以及金屬濺鍍靶的製造方法

Country Status (4)

Country Link
JP (1) JPWO2025037642A1 (https=)
KR (1) KR20260043103A (https=)
TW (1) TW202509256A (https=)
WO (1) WO2025037642A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005071135A2 (en) * 2004-01-08 2005-08-04 Cabot Corporation Tantalum and other metals with (110) orientation
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
JPWO2009107763A1 (ja) * 2008-02-29 2011-07-07 新日鉄マテリアルズ株式会社 金属系スパッタリングターゲット材
WO2010051040A1 (en) * 2008-11-03 2010-05-06 Tosoh Smd, Inc. Method of making a sputter target and sputter targets made thereby
JP2011089188A (ja) * 2009-10-26 2011-05-06 Ulvac Japan Ltd チタン含有スパッタリングターゲットの製造方法
CN111286703B (zh) * 2020-03-31 2021-12-10 贵研铂业股份有限公司 一种镍铂合金溅射靶材及其制备方法
JP2023133069A (ja) 2022-03-11 2023-09-22 株式会社リコー 液体吐出装置、および液体吐出方法

Also Published As

Publication number Publication date
WO2025037642A1 (ja) 2025-02-20
KR20260043103A (ko) 2026-03-31
JPWO2025037642A1 (https=) 2025-02-20

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