TW202442742A - 組成物套組、接著劑組成物以及接著體 - Google Patents
組成物套組、接著劑組成物以及接著體 Download PDFInfo
- Publication number
- TW202442742A TW202442742A TW113111799A TW113111799A TW202442742A TW 202442742 A TW202442742 A TW 202442742A TW 113111799 A TW113111799 A TW 113111799A TW 113111799 A TW113111799 A TW 113111799A TW 202442742 A TW202442742 A TW 202442742A
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- meth
- thiol
- composition
- mass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023057879 | 2023-03-31 | ||
| JP2023-057879 | 2023-03-31 | ||
| JP2023-057881 | 2023-03-31 | ||
| JP2023057881 | 2023-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202442742A true TW202442742A (zh) | 2024-11-01 |
Family
ID=92905731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113111799A TW202442742A (zh) | 2023-03-31 | 2024-03-28 | 組成物套組、接著劑組成物以及接著體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024204435A1 (https=) |
| TW (1) | TW202442742A (https=) |
| WO (1) | WO2024204435A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5828225B2 (ja) * | 2011-05-31 | 2015-12-02 | 日油株式会社 | 硬化性樹脂組成物 |
| JP6606894B2 (ja) * | 2015-07-15 | 2019-11-20 | 味の素株式会社 | エポキシ樹脂組成物の製造方法 |
| JP7552221B2 (ja) * | 2019-10-31 | 2024-09-18 | 味の素株式会社 | 硬化性組成物 |
| JP7676761B2 (ja) * | 2020-12-04 | 2025-05-15 | artience株式会社 | 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材 |
| JPWO2023276773A1 (https=) * | 2021-06-28 | 2023-01-05 | ||
| WO2023286701A1 (ja) * | 2021-07-14 | 2023-01-19 | ナミックス株式会社 | 硬化性樹脂組成物 |
-
2024
- 2024-03-27 JP JP2025511070A patent/JPWO2024204435A1/ja active Pending
- 2024-03-27 WO PCT/JP2024/012446 patent/WO2024204435A1/ja not_active Ceased
- 2024-03-28 TW TW113111799A patent/TW202442742A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024204435A1 (ja) | 2024-10-03 |
| JPWO2024204435A1 (https=) | 2024-10-03 |
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